2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第4页

Simulation of particle levitation due to dielectrophoresis 介质电泳引起的粒子悬浮模拟

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464526

V. Rochus, S. Hannot, J. Golinval, D. Rixen

引用次数: 2

Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's 通用0级MEMS封装的热机械设计，采用芯片封盖和Through Silicon Via

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464539

B. Vandevelde, R. Jansen, S. Bouwstra, N. Pham, B. Majeed, P. Limaye, E. Beyne, H. Tilmans

{"title":"Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's","authors":"B. Vandevelde, R. Jansen, S. Bouwstra, N. Pham, B. Majeed, P. Limaye, E. Beyne, H. Tilmans","doi":"10.1109/ESIME.2010.5464539","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464539","url":null,"abstract":"This paper describes the thermo-mechanical design of an advanced zero-level capping technology used for packaging of a MEMS die. The package approach uses Intermetallic Compound (IMC) bonding to seal the MEMS die with a cap, and uses Through Silicon Via's (TSV) to provide the electrical connections from the MEMS die to the second level substrate (LTCC or PCB). Advanced FEM based thermo-mechanical simulations are performed to estimate the impact of processing and temperature cycling on the mechanical stresses and deformations induced in the structure. Special focus goes to the rigid CuSn IMC bond, the copper TSV using a polymer dielectric and the cap deflection under a pressure of 1 bar (vacuum inside) and 90 bar (simulating overmoulding). Finally, the impact of assembling the MEMS package on an LTCC substrate and an FR4 printed circuit board with CuSn, respectively solder connections is investigated with respect to the package reliability, the cap deflection and the strain and anchor rotation at location of the MEMS.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126733163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface 微电子封装材料的分子建模。3d交联环氧树脂/ SiO2界面的基本热机械性能估计

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464521

O. Holck, E. Dermitzaki, B. Wunderle, J. Bauer, B. Michel

{"title":"Molecular modelling of microelectronic packaging materials - basic thermo-mechanical property estimation of a 3D-crosslinked epoxy / SiO2 interface","authors":"O. Holck, E. Dermitzaki, B. Wunderle, J. Bauer, B. Michel","doi":"10.1109/ESIME.2010.5464521","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464521","url":null,"abstract":"In this work we present a procedure for the construction of 3D networked epoxy moulding compounds and an estimation of basic thermodynamic properties by molecular dynamics simulations. Our investigations present part of general trend to extend failure analysis, reliability assessment and the development of packaging materials from the conventional discrete usage of simulation techniques to a more holistic approach of an interconnected multimethods-procedure, enabling bottom-up simulation of complex microsystems. Within that framework, the task at hand for detailed atomistic molecular modelling is to develop practical methods in order to take materials development as well as materials failure analysis to the nanoscale level. This paper reports a cross linking scheme for the construction of three dimensionally cross linked simulation packages and presents a first property analysis of an industry near moulding compound material. First models and results are presented of model packages of ideal epoxy/silicon-dioxide interfaces.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127522618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Analysis of the performance reduction of axial fans in close proximity to EMC screens 靠近电磁兼容屏的轴流风机性能降低分析

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464583

R. Antón, A. Bengoechea, Y. Masip, A. Rivas, J. C. Ramos, G. S. Larraona

引用次数: 0

Effect of the mechanical properties of underfill on the local deformation and residual stress in a chip mounted by area-arrayed flip chip structures 下填土力学性能对倒装芯片局部变形和残余应力的影响

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464598

K. Nakahira, Yuki Sato, H. Kishi, K. Suzuki, H. Miura

引用次数: 1

A correlation between thermo-mechanical finite elements tool with electro-thermal finite elements tool: towards an electro-mechanical finite elements modeling for IGBT used in power assemblies 热机械有限元工具与电热有限元工具的相关性:面向电力组件中使用的IGBT的机电有限元建模

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464606

Y. Belmehdi, S. Azzopardi, E. Woirgard, J. Delétage, I. Favre

{"title":"A correlation between thermo-mechanical finite elements tool with electro-thermal finite elements tool: towards an electro-mechanical finite elements modeling for IGBT used in power assemblies","authors":"Y. Belmehdi, S. Azzopardi, E. Woirgard, J. Delétage, I. Favre","doi":"10.1109/ESIME.2010.5464606","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464606","url":null,"abstract":"Our objective is to establish a connection between finite elements mechanical simulations using ANSYS software applied on a power module including a silicone die with finite elements electrical simulations using TCAD SENTAURUS software applied on a silicone power transistor, such as a Planar Gate Punch Through Insulated Gate Bipolar Transistor (IGBT). In this paper, the thermo-mechanical finite elements software is used to obtained the mechanical stress distribution within the silicone die under the four points bending configuration. Then, the mechanical stress is implemented in the semiconductor device simulator to obtain three static configurations (output characteristics, forward transfer and breakdown voltage). Simulation results show the same tendency as experiments and illustrate that whereas the mechanical stress has low effect on breakdown voltage, the forward current as well as the transconductance are strongly affected by external mechanical stress depending on its level, direction and nature (compressive or tensile).","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115411827","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Thermo-mechanical simulations of LTCC packages for RF MEMS applications 用于RF MEMS应用的LTCC封装的热力学模拟

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464591

J. Lenkkeri, E. Juntunen, M. Lahti, S. Bouwstra

{"title":"Thermo-mechanical simulations of LTCC packages for RF MEMS applications","authors":"J. Lenkkeri, E. Juntunen, M. Lahti, S. Bouwstra","doi":"10.1109/ESIME.2010.5464591","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464591","url":null,"abstract":"Stresses and strains in assemblies of a silicon-based MEMS chip and in an LTCC package have been simulated using Comsol Multiphysics simulation software. The simulated structures included the MEMS chip either wire bonded or flip-chip bonded into a cavity in a LTCC substrate and an LTCC lid sealed on top of the cavity. For die bonding of the MEMS chip and for sealing of the lid AuSn solder material was assumed and for the flip-chip joining of the MEMS chip Au-bumps and thermo compression bonding process were assumed. Both 2D and 3D simulations were made for a temperature range between 218 K and 393 K, for pressures up to 100 bar, for shear force applied either to chip or lid edge and for heat dissipation of 1 W applied to the chip. The effects of 2nd level packaging were also studied. The simulations show that the strains at the surface of the MEMS components are larger in the flip-chip type chip compared with wire bonded chip. For thermal management of the LTCC type package thermal vias through the LTCC substrate will be necessary. Several possible ways for minimizing the strains in the MEMS component are discussed in this article.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127052235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

High temperature storage influence on molding compound properties 高温贮存对成型复合材料性能的影响

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464541

J. de Vreugd, K. Jansen, L. Ernst, C. Bohm, R. Pufall

引用次数: 18

Exemplified calculation of stress migration in a 90nm node via structure 举例计算了90nm节点通过结构的应力迁移

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464542

K. Weide-Zaage

引用次数: 22

Thermomechanical characterization of electronic components 电子元件的热机械特性

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464592

Sana Ben Khlifa, N. Bonfoh, P. Lipinski, M. Fendler, S. Bernabé, H. Ribot

{"title":"Thermomechanical characterization of electronic components","authors":"Sana Ben Khlifa, N. Bonfoh, P. Lipinski, M. Fendler, S. Bernabé, H. Ribot","doi":"10.1109/ESIME.2010.5464592","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464592","url":null,"abstract":"The main objective of this study is to validate the thermomechanical properties of materials used in some electronic components. The improved performance of HgCdTe infrared focal plane arrays requires reliability of the assembly at low temperatures down to 77K. Unfortunately, the thermomechanical behavior of most materials of these components remains to be clarified, particularly in a cryogenic environment. The present investigation is a part of a global study that aims to analyze the reliability of some electronic assembly, through numerical simulations combined with experimental measures. The relevance of this numerical modelling strongly depends on a precise characterization of the thermo-mechanical behavior of specific materials involved in the considered assemblies. Thus, through numerical simulations of a model of electronic chip, we determine the thermal and mechanical properties of materials such as indium, silicon, fused silica, by comparing these simulations results with the experimental measurements carried out on these same models of chips. This study enables us to have a complete database of the thermomechanical behavior of materials studied for the range of operating temperatures.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123465885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0