1996 Proceedings 46th Electronic Components and Technology Conference最新文献_第6页

OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools 光电技术联盟(OETC)并行光数据链:组件、系统应用和仿真工具

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517403

Y. Wong, D. Muehlner, C. C. Faudskar, M. Fishteyn, J. Gates, P. Anthony, G. Cyr, J. Choi, J. Crow, D. Kuchta, P. Pepeljugoski, K. Stawiasz, W. Nation, D. Engebretsen, B. Whitlock, R. Morgan, M. Hibbs-Brenner, J. Lehman, R. Walterson, E. Kalweit, T. Marta

{"title":"OptoElectronic Technology Consortium (OETC) parallel optical data link: components, system applications, and simulation tools","authors":"Y. Wong, D. Muehlner, C. C. Faudskar, M. Fishteyn, J. Gates, P. Anthony, G. Cyr, J. Choi, J. Crow, D. Kuchta, P. Pepeljugoski, K. Stawiasz, W. Nation, D. Engebretsen, B. Whitlock, R. Morgan, M. Hibbs-Brenner, J. Lehman, R. Walterson, E. Kalweit, T. Marta","doi":"10.1109/ECTC.1996.517403","DOIUrl":"https://doi.org/10.1109/ECTC.1996.517403","url":null,"abstract":"This paper discusses the present state of the art of components, systems, and application technology related to parallel optical data links (ODL) as demonstrated by the OptoElectronic Technology Consortium (OETC). Parallel ODL technology is poised for large volume commercialization despite some uncertainties in industrial standards and system applications. This is fueled by the demand for high-bandwidth to support the upcoming information age. To meet the need for low-cost, broadband digital multimedia services, parallel ODL technology faces the challenge of providing reasonable cost/performance ratios when compared with other established technologies. Responding to this challenge has required the integration of a number of state-of-the-art component technologies (e.g. VCSEL, monolithic integrated photoreceiver, MCM, GaAs IC, optical array connector and cable) with system designs and applications.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129261583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 20

Challenges for developing low-cost avionics/aerospace-grade optoelectronic modules 开发低成本航空电子/航天级光电模块的挑战

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550878

E. Chan, M. Beranek, K. W. Davido, H. Hager, C. Hong, R.L. St. Pierre

引用次数: 22

An interim report on the comparisons of polymide to non-polyimide reliability for C4 关于C4用聚酰亚胺与非聚酰亚胺可靠性比较的中期报告

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550751

J. Phillips, G. Margaritis, B. Afshari

引用次数: 1

Extraction of transient behavioral model of digital I/O buffers from IBIS IBIS数字I/O缓冲器瞬态行为模型的提取

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550806

P. Tehrani, Yuzbe Chen, J. Fang

引用次数: 21

Is the current surface insulation resistance (SIR) methodology appropriate to today's manufacturing technology? 当前的表面绝缘电阻(SIR)方法适用于今天的制造技术吗?

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517397

H. Chan

{"title":"Is the current surface insulation resistance (SIR) methodology appropriate to today's manufacturing technology?","authors":"H. Chan","doi":"10.1109/ECTC.1996.517397","DOIUrl":"https://doi.org/10.1109/ECTC.1996.517397","url":null,"abstract":"Corrosive contaminants left on a circuit from assembly and manufacturing processes present reliability problems. Contemporary SIR measurement procedures consist of daily resistance measurements across a comb pattern on samples that age in environmental chambers. Yet these tests lack information on the corrosiveness of the contaminants and often exhibit inconsistency as quantitative measures. A DC continuous measurement method is used here to study the fundamental science behind these measurements for ionic contaminants on a printed circuit board. For ionic contaminants, such as those left from low-solids-fluxes (LSF), the SIR values exhibited continuous and irreversible changes during the test. The DC voltage causes mobile ions to migrate towards the electrodes and are thus being depleted from the insulating surface. Hence, only the initial measurement on a virgin sample gives the true quantitative measure of these contaminants. The subsequent rise in SIR value should not be interpreted as an improvement in reliability but rather be indicative of the presence of mobile ions which might be corrosive. Once the board is depleted of ions, reversing the applied voltage polarity cannot restore the initially low SIR value, but only gives a very slow drop followed by a very slow rise in the SIR value. These changes are responsible for many measurement anomaly commonly observed under various DC biasing schemes where the SIR values are recorded only once daily. An alternate SIR methodology using AC measurement is shown to give more consistent results. The AC voltage causes no net ion migration but may still cause voltage-accelerated aging. While this work uses printed circuit board as a test vehicle, the fundamental science is applicable to Hibrid IC and to other processes where cleanliness is needed for reliability.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128875545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications 聚合物光互连技术(POINT)光电封装和互连板和背板的应用

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517407

Y.S. Liu, R. Wojnarowski, W. Hennessy, J. Bristow, Yue Liu, A. Peczalski, J. Rowlette, A. Plotts, J. Stack, M. Kadar-Kallen, J. Yardley, L. Eldada, R. Osgood, R. Scarmozzino, S.H. Lee, V. Ozgus, S. Patra

{"title":"Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications","authors":"Y.S. Liu, R. Wojnarowski, W. Hennessy, J. Bristow, Yue Liu, A. Peczalski, J. Rowlette, A. Plotts, J. Stack, M. Kadar-Kallen, J. Yardley, L. Eldada, R. Osgood, R. Scarmozzino, S.H. Lee, V. Ozgus, S. Patra","doi":"10.1109/ECTC.1996.517407","DOIUrl":"https://doi.org/10.1109/ECTC.1996.517407","url":null,"abstract":"The Polymer Optical interconnect Technology (POINT) is a collaborative program among GE, Honeywell, AMP, AlliedSignal, Columbia University and University of California at San Diego (UCSD), sponsored by ARPA, in developing affordable optoelectronic packaging and interconnect technologies for board- and backplane-level optical interconnect applications. The POINT program leverages on the existing electronic design, processing, fabrication and MCM packaging technologies to optoelectronic packaging. The POINT program also incorporates several state-of-the-art optoelectronic technologies that include: high speed VCSEL for multi-channel data transmission; flexible optical polymer waveguides and low-loss polymers for board and backplane interconnects; low-cost diffractive optical elements (DOE) for board-to-backplane interconnect; and use of molded MT-type connectors to reduce weight and size. In addition, to further reduce design and fabrication cycle times, CAD tools for multimode optical waveguide modelling, and for mechanical modelling of optoelectronic packaging will be employed to aid the technology development.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123767563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 33

Photonic packaging using laser/receiver arrays and flexible optical circuits 使用激光/接收器阵列和柔性光学电路的光子封装

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517435

G. Grimes, J. Markush, Y. Wong, P. Anthony, W. R. Holland, E.G. Priest, C. J. Sherman, S. Peck, D. Muehlner, C. C. Faudskar, J.S. Nyquist, J.S. Helton, G.L. Sonnier, J. Gates, W. Honea, J. R. Bortolini

引用次数: 10

Printed circuit board material and design considerations for wireless applications 无线应用的印刷电路板材料和设计考虑

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517413

B. Daigle

引用次数: 11

Design trade-offs in high performance packages 在高性能封装中进行设计权衡

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517454

S. Kadakia, A. Agrawal

引用次数: 1

Soldering technology for optoelectronic packaging 光电封装的焊接技术

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517371

Q. Tan, Y.C. Lee

引用次数: 72