Printed circuit board material and design considerations for wireless applications

Abstract

Designers are moving towards material systems which can be fabricated using conventional epoxy/glass printed circuit board (PCB) processes. This allows microwave circuits to be built using the vast fabrication infrastructure available for digital circuits. This paper provides basic background information about substrate material characteristics and design considerations, which are critical for wireless applications. Material characteristics discussed include dissipation factor, dielectric constant tolerances and stability. Design and material options which allow microwave circuits to be manufactured by conventional FR4 fabricators are emphasized.