{"title":"无线应用的印刷电路板材料和设计考虑","authors":"B. Daigle","doi":"10.1109/ECTC.1996.517413","DOIUrl":null,"url":null,"abstract":"Designers are moving towards material systems which can be fabricated using conventional epoxy/glass printed circuit board (PCB) processes. This allows microwave circuits to be built using the vast fabrication infrastructure available for digital circuits. This paper provides basic background information about substrate material characteristics and design considerations, which are critical for wireless applications. Material characteristics discussed include dissipation factor, dielectric constant tolerances and stability. Design and material options which allow microwave circuits to be manufactured by conventional FR4 fabricators are emphasized.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Printed circuit board material and design considerations for wireless applications\",\"authors\":\"B. Daigle\",\"doi\":\"10.1109/ECTC.1996.517413\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Designers are moving towards material systems which can be fabricated using conventional epoxy/glass printed circuit board (PCB) processes. This allows microwave circuits to be built using the vast fabrication infrastructure available for digital circuits. This paper provides basic background information about substrate material characteristics and design considerations, which are critical for wireless applications. Material characteristics discussed include dissipation factor, dielectric constant tolerances and stability. Design and material options which allow microwave circuits to be manufactured by conventional FR4 fabricators are emphasized.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"46 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.517413\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.517413","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Printed circuit board material and design considerations for wireless applications
Designers are moving towards material systems which can be fabricated using conventional epoxy/glass printed circuit board (PCB) processes. This allows microwave circuits to be built using the vast fabrication infrastructure available for digital circuits. This paper provides basic background information about substrate material characteristics and design considerations, which are critical for wireless applications. Material characteristics discussed include dissipation factor, dielectric constant tolerances and stability. Design and material options which allow microwave circuits to be manufactured by conventional FR4 fabricators are emphasized.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
