Photonic packaging using laser/receiver arrays and flexible optical circuits

The topic of this paper is a description of how we replaced the discrete optoelectronic and passive optics devices of the optical interconnection system of a DAGS VI-2000 with parallel optical components developed by the OETC. We have demonstrated that the use of parallel optics components, including high density laser transmitters, high density receivers and high density multifiber backplane connectors are compatible with standard electronic packaging technologies for large telecommunications platforms. We have further demonstrated that the use of parallel optics can dramatically increase system capacity with minimal impact on system physical architecture.