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1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)最新文献

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AMHS for 300 mm wafer AMHS适用于300mm晶圆片
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664525
Ryo Kurosaki, Hiromi, Yoshio Watanabe, Yano, Manufacturing Enginering Div
{"title":"AMHS for 300 mm wafer","authors":"Ryo Kurosaki, Hiromi, Yoshio Watanabe, Yano, Manufacturing Enginering Div","doi":"10.1109/ISSM.1997.664525","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664525","url":null,"abstract":"Many discussions are currently underway concerning the imminent introduction of new 300 mm generation wafer fabrication facilities. An Automated Material Handling System (AMHS) is at the center of interest and various transport methods are being studied and proposed by various manufacturers and committees. Since the weight of transport materials is estimated to increase in a 300 mm wafer fabrication facility, it will be difficult to transport such materials by human hand. Therefore, it is highly probable that an AMHS will play a significant role in a reduced operator wafer fab. In this paper, the results of a transport capability investigation with two different transport methods are examined and guidelines for selecting the best transport method are suggested.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121028241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 36
Practical modeling of the effects of processing fluctuations on circuit behaviour 加工波动对电路行为影响的实际建模
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664590
T. Smedes, P.G.A. Emonts
{"title":"Practical modeling of the effects of processing fluctuations on circuit behaviour","authors":"T. Smedes, P.G.A. Emonts","doi":"10.1109/ISSM.1997.664590","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664590","url":null,"abstract":"We describe a tool to predict and analyze the effects of processing fluctuations on circuit behaviour. This tool enables the designer to optimize the performance and robustness of the design. Furthermore, the tool helps to reduce the time to market by helping to fit the design in a given process. Information gained in this way can also help to decide where to put more effort in controlling the process and where the control might perhaps be relaxed. After the description of the tool we present results and application examples.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115045971","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Mitigation of earthquake risk in manufacturing 减轻制造业的地震风险
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664513
D. W. King
{"title":"Mitigation of earthquake risk in manufacturing","authors":"D. W. King","doi":"10.1109/ISSM.1997.664513","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664513","url":null,"abstract":"This paper outlines the steps taken to identify and mitigate the risk of earthquakes in Rockwell's Mexicali, Mexico assembly and test facility. Its intent is to provide a guide for other companies located in seismically active regions.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129212525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Slurry delivery system design for tungsten chemical mechanical planarization manufacturing site 钨化工机械刨平生产现场料浆输送系统设计
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664496
H. Mizuno, Y. Miyamoto, S. Shikami, J. Bare
{"title":"Slurry delivery system design for tungsten chemical mechanical planarization manufacturing site","authors":"H. Mizuno, Y. Miyamoto, S. Shikami, J. Bare","doi":"10.1109/ISSM.1997.664496","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664496","url":null,"abstract":"A bulk slurry delivery system is necessary at manufacturing sites using Chemical Mechanical Planarization (CMP). Slurry settling is an important issue in the slurry handling operation. Slurry settling characteristics and the effective connection of the polishers to the slurry delivery loop were studied. This paper presents the results of the study and of the polishing performance by polishers connected in an effective slurry delivery system.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121634350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An advanced wet cleaning system for process integration 一个先进的湿式清洗系统的过程集成
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664495
K. Tsugane, H. Tomioka, K. Shinbara, A. Izumi
{"title":"An advanced wet cleaning system for process integration","authors":"K. Tsugane, H. Tomioka, K. Shinbara, A. Izumi","doi":"10.1109/ISSM.1997.664495","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664495","url":null,"abstract":"We developed a single wafer wet cleaning system for cluster tools available to /spl phi/ 200 mm production-line, and clarified the system's advantages in terms of its ability to remove particles, suppress native oxide growth and adsorption of organic matter. Moreover, we showed that there were no water marks on the wafer treated in this system. Integration of the system and thermal processing chambers avoids exposure to air between each process and enable us to produce highly reliable and high quality devices.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134079480","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Application of in-situ particle monitoring in defect management system under clean manufacturing environment 颗粒原位监测在清洁制造环境下缺陷管理系统中的应用
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664502
V.M.C. Chen, A. W. Chow, L. Milor, Yeng-Kaung Peng
{"title":"Application of in-situ particle monitoring in defect management system under clean manufacturing environment","authors":"V.M.C. Chen, A. W. Chow, L. Milor, Yeng-Kaung Peng","doi":"10.1109/ISSM.1997.664502","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664502","url":null,"abstract":"In-situ Particle Monitors (ISPM) have been adopted in the industry for optimizing cleaning cycles and detecting equipment abnormalities. However, in advanced manufacturing environments where the equipment is well maintained and where yield-dominating excursions rarely happen, the ISPM signal is usually too weak to use for yield monitoring. This paper details what we did to optimize ISPM sensitivity performance for non-excursion conditions, analyzes the results, and presents an alternative approach for integrating ISPM in defect management systems.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134148325","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
How to get predictable throughput times in a multiple product environment 如何在多产品环境中获得可预测的吞吐量时间
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664612
P. McGlynn, M. O'dea
{"title":"How to get predictable throughput times in a multiple product environment","authors":"P. McGlynn, M. O'dea","doi":"10.1109/ISSM.1997.664612","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664612","url":null,"abstract":"TPTs can be made predictable by changing operating procedures on the floor, where self-sustaining technicians (SSTs) can make fast real time decisions on an hourly basis on what operation, lot and quantity to run. Multiple products can move through a production line with equal throughput times. This can be successfully done by applying some simple TOC principles combined with changes in operating procedures, intensive training and the use of relevant indicators to measure success. As we achieve more control over product throughput times they become more predictable.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"178 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131802811","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Noncontact inspection of opaque film thickness in single layer and multilayer structures and edge-exclusion zones 单层、多层结构及边缘隔离区不透明膜厚度的非接触检测
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664615
M. Banet, M. Fuchs, R. Logan, K. Nelson, J. Rogers
{"title":"Noncontact inspection of opaque film thickness in single layer and multilayer structures and edge-exclusion zones","authors":"M. Banet, M. Fuchs, R. Logan, K. Nelson, J. Rogers","doi":"10.1109/ISSM.1997.664615","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664615","url":null,"abstract":"A rapid, noncontact, nondestructive optical measurement method permits determination of the thicknesses of opaque films with angstrom repeatability. The method, called impulsive stimulated thermal scattering (ISTS), can be used on nearly any metal including Cu, Al, Ti, W, and Ti:W. Measurements are made across the entire area of a wafer including the edge-exclusion zone, permitting examination of beveled layer edges. Exposed and buried metal layers can both be measured. Typical data acquisition time is about one second, suitable for in-line measurement of product wafers. Comparisons of ISTS results with those of conventional four-point probe, SEM, and profilometry measurements are favorable.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130925534","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Emission-free distilled DIW closed system for ISO 14001 符合ISO 14001标准的无排放蒸馏DIW封闭系统
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664514
K. Koba, S. Momose, S. Inoue, C. Ban, K. Sato
{"title":"Emission-free distilled DIW closed system for ISO 14001","authors":"K. Koba, S. Momose, S. Inoue, C. Ban, K. Sato","doi":"10.1109/ISSM.1997.664514","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664514","url":null,"abstract":"It is required that semiconductor factories generate \"zero\" industrial waste materials. Distillation systems are excellent from an emission-free stand point because they require no chemicals to purify the water and no periodical replacement of materials. We developed the first distilled deionized water (DIW) system for semiconductor manufacturing, and demonstrated the quality of distilled DIW for quarter micron device production. Then we designed a variety of an emission-free distilled DIW closed systems utilizing different processes, and investigated the costs of these systems.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127856730","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Metallic contaminants generation from tubing during start-up and following moisture upsets in HCl distribution systems 在HCl分配系统中，在启动期间和湿气破坏后，油管产生金属污染物
1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) Pub Date : 1997-10-06 DOI: 10.1109/ISSM.1997.664629
N. Anderson, G. Vereecke, M. Heyns, P. Espitalier-Noel
{"title":"Metallic contaminants generation from tubing during start-up and following moisture upsets in HCl distribution systems","authors":"N. Anderson, G. Vereecke, M. Heyns, P. Espitalier-Noel","doi":"10.1109/ISSM.1997.664629","DOIUrl":"https://doi.org/10.1109/ISSM.1997.664629","url":null,"abstract":"Contamination control has always been an important issue for IC manufacturing processes. Within the area of corrosive gas distribution, metallic contamination is a constant threat to process yield. This paper focuses on metallic contamination resulting from low pressure HCl gas flow through tubing materials during system start-up and following exposure to moisture. The paper discusses the effect of HCl exposure on two tubing materials. Data relating to the type, physical state, and concentration of metallic contamination is included. Surface chemistry mechanisms are proposed in relation to the observed phenomena. The comparison of two tubing materials permits performance, cost and design implications to be considered.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131314496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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