Slurry delivery system design for tungsten chemical mechanical planarization manufacturing site

H. Mizuno, Y. Miyamoto, S. Shikami, J. Bare
{"title":"Slurry delivery system design for tungsten chemical mechanical planarization manufacturing site","authors":"H. Mizuno, Y. Miyamoto, S. Shikami, J. Bare","doi":"10.1109/ISSM.1997.664496","DOIUrl":null,"url":null,"abstract":"A bulk slurry delivery system is necessary at manufacturing sites using Chemical Mechanical Planarization (CMP). Slurry settling is an important issue in the slurry handling operation. Slurry settling characteristics and the effective connection of the polishers to the slurry delivery loop were studied. This paper presents the results of the study and of the polishing performance by polishers connected in an effective slurry delivery system.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.1997.664496","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

A bulk slurry delivery system is necessary at manufacturing sites using Chemical Mechanical Planarization (CMP). Slurry settling is an important issue in the slurry handling operation. Slurry settling characteristics and the effective connection of the polishers to the slurry delivery loop were studied. This paper presents the results of the study and of the polishing performance by polishers connected in an effective slurry delivery system.
钨化工机械刨平生产现场料浆输送系统设计
在使用化学机械刨平(CMP)的生产现场,散装浆料输送系统是必要的。浆料沉降是浆料处理过程中的一个重要问题。研究了浆液沉降特性以及抛光机与浆液输送回路的有效连接。本文介绍了在一个有效的浆液输送系统中连接的抛光机的抛光性能的研究结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
CiteScore
0.80
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信