{"title":"Slurry delivery system design for tungsten chemical mechanical planarization manufacturing site","authors":"H. Mizuno, Y. Miyamoto, S. Shikami, J. Bare","doi":"10.1109/ISSM.1997.664496","DOIUrl":null,"url":null,"abstract":"A bulk slurry delivery system is necessary at manufacturing sites using Chemical Mechanical Planarization (CMP). Slurry settling is an important issue in the slurry handling operation. Slurry settling characteristics and the effective connection of the polishers to the slurry delivery loop were studied. This paper presents the results of the study and of the polishing performance by polishers connected in an effective slurry delivery system.","PeriodicalId":138267,"journal":{"name":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.1997.664496","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A bulk slurry delivery system is necessary at manufacturing sites using Chemical Mechanical Planarization (CMP). Slurry settling is an important issue in the slurry handling operation. Slurry settling characteristics and the effective connection of the polishers to the slurry delivery loop were studied. This paper presents the results of the study and of the polishing performance by polishers connected in an effective slurry delivery system.