An advanced wet cleaning system for process integration

Abstract

We developed a single wafer wet cleaning system for cluster tools available to /spl phi/ 200 mm production-line, and clarified the system's advantages in terms of its ability to remove particles, suppress native oxide growth and adsorption of organic matter. Moreover, we showed that there were no water marks on the wafer treated in this system. Integration of the system and thermal processing chambers avoids exposure to air between each process and enable us to produce highly reliable and high quality devices.