{"title":"A 2.4-GHz 18-mW Two-Point Delta-Sigma Modulation Transmitter for IEEE 802.15.4","authors":"Ching-Lung Ti, Tsung-Hsien Lin","doi":"10.1109/VDAT.2007.373241","DOIUrl":"https://doi.org/10.1109/VDAT.2007.373241","url":null,"abstract":"A 2.4-GHz two-point modulation transmitter (TX), designed for IEEE 802.15.4 (ZigBee) applications, is reported in this paper. The TX is based on a delta-sigma fractional-/V PLL to reduce chip area and power consumption. In addition, the chosen architecture prevents the transmission data rate from being limited by the PLL bandwidth. To alleviate the non-linearity problems of a conventional fractional-N PLL, linearization techniques are adopted. The TX is designed to operate in the 2.4-GHz ISM band, and is capable of delivering a date rate more than 2 Mbps. Implemented in the TSMC 0.18-mum CMOS process, the TX consumes 18 mW under a 1.4-V supply voltage.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133795085","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The novel Chinese abacus adder","authors":"Zi-Yi Zhao, Chien-Hung Lin, Yu-Zhi Xie, Yen-Ju Chen, Yi-Jie Lin, Shu-Chung Yi","doi":"10.1109/VDAT.2007.372759","DOIUrl":"https://doi.org/10.1109/VDAT.2007.372759","url":null,"abstract":"A novel Chinese abacus adder is presented in this paper. The simulation results of 8-bit adders are compared with those of CLA (carry look-ahead) adder and RCA (ripple carry adder) by all input patterns. The delay of the 8-bit abacus adder is 22%, and 14% less than those of CLA adders for 0.35mum and 0.18mum technologies, respectively. The power consumption of the abacus adders are 30% and 60% less than those of CLA adders for 0.35mum, and 0.18mum technologies, respectively. The delay of the 32-bit abacus adder is 17%, and 12% less than those of CLA adder for 0.35mum, and 0.18mum technologies, respectively.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122568508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"On-Chip Transmission Line Modeling and Applications to Millimeter-Wave Circuit Design in 0.13um CMOS Technology","authors":"Chun-Lin Ko, C. Kuo, Y. Juang","doi":"10.1109/VDAT.2007.373243","DOIUrl":"https://doi.org/10.1109/VDAT.2007.373243","url":null,"abstract":"This paper presents the on-chip transmission line modeling and applications to circuit design at millimeter-wave (ram-wave) frequencies. The microstrip model of circuit simulators benefits in fast calculations of the characteristics of microstrip lines. As the structure of on-chip microstrip differs from the modeled structure, two key parameters of the microstrip model need to be modified for the different electromagnetic (EM) behavior according to the measured microstrip line. With proper parameters, the traditional transmission line model is able to accurately predict the real characteristic of on-chip microstrip lines without time-consuming EM simulation. A mm-wave microstrip line filter and a single-stage cascode low noise amplifier (LNA) are fabricated to verify the model. All passive components for input/output matching networks and bias networks are on-chip. The LNA takes the supply voltage and dc current of 1.4 V and 10 mA, respectively. A gain of 3.8 dB and an input/output return loss of 8.5/7.0 dB are measured at 60.3 GHz. The simulation results in both circuits are in good agreement with measured data.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"118 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123604880","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Low-Power Instruction Cache Architecture Using Pre-Tag Checking","authors":"S. Cheng, Juinn-Dar Huang","doi":"10.1109/VDAT.2007.373216","DOIUrl":"https://doi.org/10.1109/VDAT.2007.373216","url":null,"abstract":"In this paper, we propose a low-power instruction cache architecture utilizing three techniques - two-phased cache, sequential access indicator for tag-memory access skipping, and a new proposed technique named pre-tag checking. By these techniques, significant portion of tag-memory and data-memory accesses can be eliminated to reduce the power consumption. The experimental results show that the proposed instruction cache architecture can reduce about 54% power consumption compared to the conventional one for an 8 KB two-way set associative cache.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126405213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Challenges of Digital Consumer and Mobile SoC's: More Moore Possible?","authors":"T. Furuyama","doi":"10.1109/DATE.2007.364556","DOIUrl":"https://doi.org/10.1109/DATE.2007.364556","url":null,"abstract":"Summary form only given. Digital consumer and mobile products have continuously accommodated more features and functions. For example, recent high-end cellular phones work as multi-modal wireless communicators that handle various formats; GSM, 3G, BT, WiFi and so on. In addition, they also operate as terrestrial digital TV viewers, MP3 music players, digital cameras, substitutes for credit cards, GPS locators and many more. These products require to best combine highly integrated SoC's and sophisticated software stacks in a timely manner. It is essential to establish a hardware/software co-design/verification environment with an ESL design methodologies. Another key is an IP reuse platform where various functions can be implemented on an SoC by legacy sub-systems with a low-power multi-processor architecture. These challenges are getting more complicated in deep sub-100 nm technology nodes.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126532498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"λ-geometry clock tree construction with wirelength and via minimization","authors":"Chun-Hao Wang, Wai-Kei Mak","doi":"10.1109/VDAT.2007.373226","DOIUrl":"https://doi.org/10.1109/VDAT.2007.373226","url":null,"abstract":"λ-geometry routing provides more available routing directions on different metal layers for chip interconnection to reduce wirelength. However, it can lead to a significant increase in via cost. In this paper, we consider lambda-geometry zero-skew clock tree construction with wirelength and via minimization. Our lambda-geometry clock router achieves, on average, a 7.57% wirelength reduction in the Y-architecture and 9.68% in the X-architecture when compared with results in the Manhattan architecture. In addition, we also propose a dynamic programming approach to determine the one-bend routes of the clock edges to optimize the total node via cost of the whole clock tree. Our via minimization algorithm can reduce the total via cost by an average of 17% in the Y-architecture and 37% in the X architecture.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133638570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Nanoelectronics: challenges and opportunities","authors":"G. Micheli","doi":"10.1007/11847083_64","DOIUrl":"https://doi.org/10.1007/11847083_64","url":null,"abstract":"","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117117276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Kuo-Hsing Cheng, Chao-An Chen, Wei-Bin Yang, Feng-Hsin Cho
{"title":"A 30Phase 500MHz PLL for 3X Over-Sampling Clock Data Recovery","authors":"Kuo-Hsing Cheng, Chao-An Chen, Wei-Bin Yang, Feng-Hsin Cho","doi":"10.1109/VDAT.2007.373236","DOIUrl":"https://doi.org/10.1109/VDAT.2007.373236","url":null,"abstract":"In this paper, we present architecture of phase-locked loop (PLL) for clock and data recovery (CDR) for high-speed serial links. The conventional over-sampling architecture uses two timing modules. One is used to track reference clock, the other is to generate multiphase to sample high speed serial-in data. The architecture improves drawback of the conventional CDR by using Blender unit to make high resolution delay phase and PLL will track this phase. Additionally, this work achieves to save power and chip area and the stability of system can be improved, because of combining the two timing modules to one. This work is fabricated by TSMC 0.13um 1p8m 1.2v process. The PLL is operates at 500MHz and CDR circuit can recovery 5Gb/s serial-in data.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-06-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127178543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A 6Gbps Serial Link Transmitter with Pre-emphasis","authors":"Chih-Hsien Lin, Chung-Hong Wang, S. Jou","doi":"10.1145/1119772.1119948","DOIUrl":"https://doi.org/10.1145/1119772.1119948","url":null,"abstract":"In this paper, we propose a novel 6Gbps SATA transmitter. The transmitter is constructed by PISO, driver, pre-emphasis and PLL for a 1-5 meter cable. A test chip of transmitter with PLL and on-chip termination is implemented to verify the design methodology. The overall circuit is implemented in TSMC 0.18 mum 1P6M 1.8 V CMOS process. The whole measured transmitter jitter is about 44ps and the power consumption is 68 mW for 6Gbps case.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"300 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-01-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114049045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Challenges and Solutions in Modern VLSI Placement","authors":"Zhe-Wei Jiang, Hsin-Chen Chen, Tung-Chieh Chen, Yao-Wen Chang","doi":"10.1109/vdat.2007.373223","DOIUrl":"https://doi.org/10.1109/vdat.2007.373223","url":null,"abstract":"The VLSI placement problem is to place objects into a fixed die such that there are no overlaps among objects and some cost metric (e.g., wirelength, routability) is optimized. It is a major step in physical design that has been studied for decades. However, modern VLSI design challenges have reshaped the placement problem. A modern placer needs to handle large-scale designs with millions of objects, heterogeneous objects with very different sizes, and various complex placement constraints such as preplaced blocks and chip density. In this paper, we first introduce the major techniques employed in our placer for tackling the large-scale mixed-size designs and the aforementioned constraints, and then provide some future research directions for the modern placement problem.","PeriodicalId":137915,"journal":{"name":"2007 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114625319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}