现代VLSI封装的挑战与解决方案

Zhe-Wei Jiang, Hsin-Chen Chen, Tung-Chieh Chen, Yao-Wen Chang
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引用次数: 9

摘要

超大规模集成电路的放置问题是将对象放置到固定的芯片中,这样对象之间就没有重叠,并且一些成本指标(例如,无线距离,可达性)得到优化。这是物理设计的重要一步,已经被研究了几十年。然而,现代VLSI设计挑战重塑了安置问题。现代砂矿机需要处理具有数百万个对象的大规模设计,具有非常不同尺寸的异构对象,以及各种复杂的放置约束,例如预先放置的块和芯片密度。在本文中,我们首先介绍了我们的砂矿用于解决大规模混合尺寸设计和上述约束的主要技术,然后为现代放置问题提供了一些未来的研究方向。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Challenges and Solutions in Modern VLSI Placement
The VLSI placement problem is to place objects into a fixed die such that there are no overlaps among objects and some cost metric (e.g., wirelength, routability) is optimized. It is a major step in physical design that has been studied for decades. However, modern VLSI design challenges have reshaped the placement problem. A modern placer needs to handle large-scale designs with millions of objects, heterogeneous objects with very different sizes, and various complex placement constraints such as preplaced blocks and chip density. In this paper, we first introduce the major techniques employed in our placer for tackling the large-scale mixed-size designs and the aforementioned constraints, and then provide some future research directions for the modern placement problem.
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