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2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)最新文献

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Scalable Package-level RFI Filter for Digital Clock Noise Mitigation in 5-GHz and future 6-GHz WiFi Applications 用于5 ghz和未来6 ghz WiFi应用的数字时钟噪声抑制的可扩展封装级RFI滤波器
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825285
Jaejin Lee, Hao-han Hsu, Ying-Ern Ho
{"title":"Scalable Package-level RFI Filter for Digital Clock Noise Mitigation in 5-GHz and future 6-GHz WiFi Applications","authors":"Jaejin Lee, Hao-han Hsu, Ying-Ern Ho","doi":"10.1109/ISEMC.2019.8825285","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825285","url":null,"abstract":"Digital clock frequency greater than 5-GHz is demanded due to fast signal processing for computer platforms. System-on-chip (SoC) and WiFi radio co-existence risk becomes increasing and has to be mitigated to support increasing data throughput requirement. Scalable package RFI filter solutions are studied for 5-GHz and future 6-GHz WiFi applications in the paper. Conventional RFI mitigation solutions have been investigated in package and board levels by on-board shielding and decoupling filter strategies. However, the solutions depend on PCB designs and RF component characteristics. Scalability and effectiveness of the solutions are therefore limited. In this study, an inductive meander structure is implemented at ground pad of the RF capacitor and allows tailoring effective filter frequency, which improves scalability of the package RFI filter solution. In addition, integrated package LC filter is designed with meander inductors and comb capacitor and shows effective filter frequency of 6.72 GHz and GHz-noise reduction of about 8 dB. This work provides effective and scalable gigahertz on-die clock noise mitigation solutions for WiFi applications.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125250571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Real-Time Circuit Reconfiguration for a Cognitive Software-Defined Radar Transmission: A New Paradigm in Spectrum Sharing 认知软件定义雷达传输的实时电路重构:频谱共享的新范式
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825209
C. Baylis, Austin Egbert, Jose Alcala-Medel, Angelique Dockendorf, A. Martone, R. Marks
{"title":"Real-Time Circuit Reconfiguration for a Cognitive Software-Defined Radar Transmission: A New Paradigm in Spectrum Sharing","authors":"C. Baylis, Austin Egbert, Jose Alcala-Medel, Angelique Dockendorf, A. Martone, R. Marks","doi":"10.1109/ISEMC.2019.8825209","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825209","url":null,"abstract":"Future radar systems will must adapt to dynamic frequency constraints while maximizing target detection range. However, the impedance termination providing optimum power changes significantly with frequency and array scan angle. To maintain good detection range over operating frequency and scan angle changes, we introduce the use of high-power reconfigurable circuitry between the transmitter power amplifier and transmit antenna. This tunable matching network and its fast tuning algorithms will be implemented under the control of a software-defined radio (SDR) platform to allow real-time optimization.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"218 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124051697","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Fast and Accurate Current Prediction in Packages Using Neural Networks 利用神经网络快速准确地预测封装电流
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825314
Yanan Liu, Tianjian Lu, Jin Y. Kim, Ken Wu, Jianming Jin
{"title":"Fast and Accurate Current Prediction in Packages Using Neural Networks","authors":"Yanan Liu, Tianjian Lu, Jin Y. Kim, Ken Wu, Jianming Jin","doi":"10.1109/ISEMC.2019.8825314","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825314","url":null,"abstract":"Electromigration (EM) has become one major reliability concern in modern integrated circuit (IC) packages. EM is caused by large currents flowing in metals and the resulting mean time to failure (MTTF) is highly dependent on the maximum current value. We here propose a scheme for fast and accurate prediction of the maximum current on the ball grid arrays (BGAs) in a package given the pin current information of the die. The proposed scheme uses neural networks to learn the resistance network of the package and achieve the non-linear current mapping. The fast prediction tool can be used for analysis and design exploration of the pin assignment on the die level.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127488544","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Modeling and Critical Winding Geometric Parameter Identification for the Near Electric Field from Helical Inductors 螺旋电感近电场建模及关键绕组几何参数辨识
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825234
M. El-Sharkh, Shuo Wang
{"title":"Modeling and Critical Winding Geometric Parameter Identification for the Near Electric Field from Helical Inductors","authors":"M. El-Sharkh, Shuo Wang","doi":"10.1109/ISEMC.2019.8825234","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825234","url":null,"abstract":"With the development of power electronics, the switching speed and switching frequency is increased to achieve higher power density. However, with the increased power density, components are positioned closer to each other, which increase the concerns of near field coupling. In non-isolated power converters, inductors are identified as major sources of electric field. This paper develops a fundamental theoretical model to quantify the relationship between helical windings and the near electric field. The developed theoretical model reveals that the inductors with helical winding structure will become an unintentional antenna that generate near electric field. It is recognized in this paper the geometric parameters such as the winding radius and the distance between winding layers are factors that influence the electric near field. The theoretical model is verified through the experiments and ANSYS HFSS simulations. Based on the model, the near electric field can be reduced by winding structure design.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132750266","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Undesired Resonances in High-Speed Differential Pair due to Non-Ideal Return Path Design 非理想返回路径设计引起的高速差分副非期望共振
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825288
Yansheng Wang, Hanfeng Wang, Ken Wu
{"title":"Undesired Resonances in High-Speed Differential Pair due to Non-Ideal Return Path Design","authors":"Yansheng Wang, Hanfeng Wang, Ken Wu","doi":"10.1109/ISEMC.2019.8825288","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825288","url":null,"abstract":"This paper studies a specific G-S-S-G style high-speed differential pair. Simulation shows that resonances exist in both common- and differential-mode signals. With the further investigation, it turns out to be that a quarter-wavelength resonant structure is incautiously created, which is responsible for the resonances. To remove the resonances, two methods are recommended in this paper. Each method has its own benefits and limitations. The proposed solutions can be treated as design rules when similar differential pairs are designed.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"201 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134026639","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Mitigation Techniques to Resolve Radiated Emission Failures due to HDMI Interconnects on a PCB 解决由于PCB上HDMI互连而导致的辐射发射故障的缓解技术
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/isemc.2019.8825225
E. Chikando, C. Ong, Y. F. Shen
{"title":"Mitigation Techniques to Resolve Radiated Emission Failures due to HDMI Interconnects on a PCB","authors":"E. Chikando, C. Ong, Y. F. Shen","doi":"10.1109/isemc.2019.8825225","DOIUrl":"https://doi.org/10.1109/isemc.2019.8825225","url":null,"abstract":"This paper presents a deep-dive analysis of common HDMI related EMI violations at the board-level. A robust design solution is detailed for improving performance in major areas of a customer reference board plagued with emission levels significantly over the CISPR-32 limit. The emission level violation was causing customer ship-hold and significant schedule slip. The combination of these design enhancements is shown to result in a notable EMI noise level reduction of over 10 dB in the regulatory frequency range of 30 MHz to 1 GHz.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128427220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Symmetry vs. Balance in Balancing Networks for Dipolar Antennas 偶极天线平衡网络中的对称与平衡
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825257
J. Mclean, H. Foltz
{"title":"Symmetry vs. Balance in Balancing Networks for Dipolar Antennas","authors":"J. Mclean, H. Foltz","doi":"10.1109/ISEMC.2019.8825257","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825257","url":null,"abstract":"Imperfect balancing networks (baluns) have been identified as a source of error in emission and site attenuation measurements. For this reason performance tests have been developed to characterize the symmetry of baluns. We draw a distinction between symmetry and balance as they relate to baluns and describe both quantitatively in terms of 3-port network parameters. It is shown that a symmetric balun alone does not necessarily eliminate common-mode (CM) current on the feed transmission line. Common-mode current on the feed transmission line is minimized by use of a current balun. However, for a given implementation such as transmission-line transformer some types of baluns are more difficult to implement than others and an imperfect, asymmetric current balun may perform worse than another type of balun (e.g. voltage) which is more symmetric.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129220150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Decoupling capacitor derating study under DC bias and cooling environment 直流偏置和冷却环境下去耦电容降额研究
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825287
Baolong Li
{"title":"Decoupling capacitor derating study under DC bias and cooling environment","authors":"Baolong Li","doi":"10.1109/ISEMC.2019.8825287","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825287","url":null,"abstract":"Passive electronics devices, especial capacitor's capacitance will be changed under different working voltage and thermal condition, which is called derating or degrading. Comparing traditional DoE (Design on Experimental) method to study derating problem, using electrical thermal multiphysics simulation, is more accurate and efficient. In this paper, a simple printed PCB with decoupling capacitors will be simulated under several scenarios: DoE, normal condition(non-derating), derated by working voltage, and derated by working voltage and temperature condition. By comparing the power impedance and noise value under those scenarios, advantages of multiphysics simulation for capacitor's derating will be proved.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116747629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigations into Methods to Stabilize the Spark in Air Discharge ESD 稳定空气放电静电放电火花的方法研究
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825281
Jianchi Zhou, Keyu Zhou, Xin Yan, Li Shen, D. Pommerenke, Guang-Xiao Luo
{"title":"Investigations into Methods to Stabilize the Spark in Air Discharge ESD","authors":"Jianchi Zhou, Keyu Zhou, Xin Yan, Li Shen, D. Pommerenke, Guang-Xiao Luo","doi":"10.1109/ISEMC.2019.8825281","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825281","url":null,"abstract":"In the interest of improving the reproducibility of air discharge during IEC 61000-4-2 ESD testing, different methods are investigated that reduce the variation of the spark current during air discharge. As the variation is caused by the interplay of the statistical time lag and the approach speed, methods are investigated that provide initial charge carriers for the avalanche initiation at the beginning of sparking. These methods include ionizers, cold plasma, humidity, exposure of the electrodes to UV light, different electrode materials, and surface shapes. Most of these methods reduce the variations of the spark currents. However, only some can be implemented during testing. The strongest effect was achieved by using cold plasma and by one surface material found in a gasket.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114503571","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Specific EMC Requirements for Semiconductor Manufacturing Environment and Review of SEMI E33 and E176 Standards 半导体制造环境的特殊EMC要求及SEMI E33和E176标准评审
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI: 10.1109/ISEMC.2019.8825245
V. Kraz
{"title":"Specific EMC Requirements for Semiconductor Manufacturing Environment and Review of SEMI E33 and E176 Standards","authors":"V. Kraz","doi":"10.1109/ISEMC.2019.8825245","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825245","url":null,"abstract":"Semiconductor manufacturing environment and processes present unique requirements to EMI environment that may not necessarily fall under “generic” EMC approach. This paper outlines the specific EMI challenges in semiconductor manufacturing and how SEMI (www.semi.org) addresses these issues in its two EMC Standards.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126791789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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