半导体制造环境的特殊EMC要求及SEMI E33和E176标准评审

V. Kraz
{"title":"半导体制造环境的特殊EMC要求及SEMI E33和E176标准评审","authors":"V. Kraz","doi":"10.1109/ISEMC.2019.8825245","DOIUrl":null,"url":null,"abstract":"Semiconductor manufacturing environment and processes present unique requirements to EMI environment that may not necessarily fall under “generic” EMC approach. This paper outlines the specific EMI challenges in semiconductor manufacturing and how SEMI (www.semi.org) addresses these issues in its two EMC Standards.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Specific EMC Requirements for Semiconductor Manufacturing Environment and Review of SEMI E33 and E176 Standards\",\"authors\":\"V. Kraz\",\"doi\":\"10.1109/ISEMC.2019.8825245\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Semiconductor manufacturing environment and processes present unique requirements to EMI environment that may not necessarily fall under “generic” EMC approach. This paper outlines the specific EMI challenges in semiconductor manufacturing and how SEMI (www.semi.org) addresses these issues in its two EMC Standards.\",\"PeriodicalId\":137753,\"journal\":{\"name\":\"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)\",\"volume\":\"69 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2019.8825245\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2019.8825245","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

半导体制造环境和工艺对EMI环境提出了独特的要求,可能不一定属于“通用”EMC方法。本文概述了半导体制造中具体的EMI挑战,以及SEMI (www.semi.org)如何在其两个EMC标准中解决这些问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Specific EMC Requirements for Semiconductor Manufacturing Environment and Review of SEMI E33 and E176 Standards
Semiconductor manufacturing environment and processes present unique requirements to EMI environment that may not necessarily fall under “generic” EMC approach. This paper outlines the specific EMI challenges in semiconductor manufacturing and how SEMI (www.semi.org) addresses these issues in its two EMC Standards.
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