2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)最新文献

A modeling and code generation framework for critical embedded systems design: From Simulink down to VHDL and Ada/C code 关键嵌入式系统设计的建模和代码生成框架:从Simulink到VHDL和Ada/C代码

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-08 DOI: 10.1109/ICECS.2014.7050092

Mickael Lanoe, Matteo Bordin, Dominique Heller, P. Coussy, C. Chavet

引用次数: 2

Sizing of the physical layer of a RF intra-chip communications 射频芯片内通信物理层的大小

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-07 DOI: 10.1109/ICECS.2014.7049947

M. Hamieh, M. Ariaudo, S. Quintanel, Y. Louët

引用次数: 10

UWB-IR digital baseband architecture for IEEE 802.15.6 wireless BAN ieee802.15.6无线BAN的UWB-IR数字基带架构

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-07 DOI: 10.1109/ICECS.2014.7050123

H. Chougrani, J. Schwoerer, Pierre-Henri Horrein, A. Baghdadi, F. Dehmas

引用次数: 5

Towards multiphysics simulations of integrated circuits 集成电路的多物理场仿真

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-01 DOI: 10.1109/ICECS.2014.7050114

M. Garci, J. Kammerer, L. Hébrard

{"title":"Towards multiphysics simulations of integrated circuits","authors":"M. Garci, J. Kammerer, L. Hébrard","doi":"10.1109/ICECS.2014.7050114","DOIUrl":"https://doi.org/10.1109/ICECS.2014.7050114","url":null,"abstract":"Although the electrical benefits are greatly increasing in miniaturized integrated circuits, their corresponding design and reliability issues are also being raised. This work aims at the multiphysics simulation of integrated circuits that allows the designer to monitor the electrical, thermal and mechanical long term behaviour of the circuit from its early design stages. The multi-physics simulation tool is based on the direct method where three networks, i.e. an electrical, a thermal and a mechanical network, are directly linked and simulated with a unique circuit simulator. The tool was developed in a standard CAD environment, i.e. Cadence®. The way the three networks are built is described. In addition, to achieve multiphysics simulations, conventional CMOS models have to be replaced by specific multiphysics models that take additional physical effects into account, such as thermal effects, hot carriers induced ageing and their impact on the device performances. The modelling approaches as well as some simulation results are provided. Finally, the paper discusses the remaining prospective work to be able to perform electro-thermo-mechanical simulations of complex integrated systems.","PeriodicalId":133747,"journal":{"name":"2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127340766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Digital hardware optimization for 1.5-GHz high-speed DDFS 1.5 ghz高速DDFS的数字硬件优化

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-01 DOI: 10.1109/ICECS.2014.7050093

Keerthi S. Asok, Karuna P. Sahoo

引用次数: 1

Resonant-based test method for MEMS devices 基于谐振的MEMS器件测试方法

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-01 DOI: 10.1109/ICECS.2014.7050012

A. Dianat, A. Attaran, R. Rashidzadeh, R. Muscedere

引用次数: 1

A MapReduce framework implementation for Network-on-Chip platforms 一个用于片上网络平台的MapReduce框架实现

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-01 DOI: 10.1109/ICECS.2014.7049936

Konstantinos Gyftakis, Iraklis Anagnostopoulos, D. Soudris, D. Reisis

引用次数: 3

A 130 nm CMOS IR-UWB receiver based on baseband cross-phase detection 一种基于基带交叉相位检测的130 nm CMOS IR-UWB接收机

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-01 DOI: 10.1109/ICECS.2014.7050110

M. Crepaldi, P. Ros, D. Demarchi

引用次数: 3

Capacitive kinetic energy harvesting: System-level engineering challenges 电容式动能收集:系统级工程挑战

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-01 DOI: 10.1109/ICECS.2014.7050127

D. Galayko, A. Dudka, P. Basset

{"title":"Capacitive kinetic energy harvesting: System-level engineering challenges","authors":"D. Galayko, A. Dudka, P. Basset","doi":"10.1109/ICECS.2014.7050127","DOIUrl":"https://doi.org/10.1109/ICECS.2014.7050127","url":null,"abstract":"This review paper presents a short overview of the energy harvesting technologies at microscale, and focus on challenges related to vibration energy harveters (VEHs) which use electrostatic (capacitive) transducers. These devices are the best candidates for microscale integration, since the electrostatic transducers are natively implemented in silicon microtechnologies (MEMS). The main challenges associated with electrostatic VEHs are related to the passive nature of the capacitive transducer. The latter can be seen as a variable capacitor, needed to be dynamically biased/pre-charged in order to convert vibrations into electricity. For this, a complex management of the charging/discharging electrical flow on the transducer is required: this is achieved with a conditioning circuit, studied in numerous works. Electrostatic kinetic energy harvester a multidomain complex system, containing several blocks, whose optimal design still a subject of advanced research. This paper reviews the challenges related to design of capacitive vibration energy harvesters at the system level, explains fundamental limitation of the capacitive vibration energy harvesters at micro scale, and overview the existing system-level solutions of capacitive VEHs.","PeriodicalId":133747,"journal":{"name":"2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129291194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

MTCMOS low-power optimization technique (LPOT) for 1V pipelined RISC CPU circuit MTCMOS低功耗优化技术(LPOT)的1V流水线RISC CPU电路

2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS) Pub Date : 2014-12-01 DOI: 10.1109/ICECS.2014.7049921

Chen-Bo Hsu, Y. Hong, J. Kuo

引用次数: 2