{"title":"射频芯片内通信物理层的大小","authors":"M. Hamieh, M. Ariaudo, S. Quintanel, Y. Louët","doi":"10.1109/ICECS.2014.7049947","DOIUrl":null,"url":null,"abstract":"In this paper we size a RF intra-chip communications based on Orthogonal Frequency Division Multiple Access (OFDMA) modulation which allows data rate and message recipient reconfiguration. Firstly, we present the advantages of this modulation such as providing flexible and high-speed data transmission. Then, we study the impact of the RF-interconnect channel shape on the transmission in terms of required transmission power. Finally, we present the effect of the channel composed of the line and its multiple access on the transfer of information and we perform a channel equalization to overcome this undesired effect.","PeriodicalId":133747,"journal":{"name":"2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Sizing of the physical layer of a RF intra-chip communications\",\"authors\":\"M. Hamieh, M. Ariaudo, S. Quintanel, Y. Louët\",\"doi\":\"10.1109/ICECS.2014.7049947\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we size a RF intra-chip communications based on Orthogonal Frequency Division Multiple Access (OFDMA) modulation which allows data rate and message recipient reconfiguration. Firstly, we present the advantages of this modulation such as providing flexible and high-speed data transmission. Then, we study the impact of the RF-interconnect channel shape on the transmission in terms of required transmission power. Finally, we present the effect of the channel composed of the line and its multiple access on the transfer of information and we perform a channel equalization to overcome this undesired effect.\",\"PeriodicalId\":133747,\"journal\":{\"name\":\"2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)\",\"volume\":\"115 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-12-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICECS.2014.7049947\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 21st IEEE International Conference on Electronics, Circuits and Systems (ICECS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICECS.2014.7049947","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Sizing of the physical layer of a RF intra-chip communications
In this paper we size a RF intra-chip communications based on Orthogonal Frequency Division Multiple Access (OFDMA) modulation which allows data rate and message recipient reconfiguration. Firstly, we present the advantages of this modulation such as providing flexible and high-speed data transmission. Then, we study the impact of the RF-interconnect channel shape on the transmission in terms of required transmission power. Finally, we present the effect of the channel composed of the line and its multiple access on the transfer of information and we perform a channel equalization to overcome this undesired effect.