Towards multiphysics simulations of integrated circuits

Abstract

Although the electrical benefits are greatly increasing in miniaturized integrated circuits, their corresponding design and reliability issues are also being raised. This work aims at the multiphysics simulation of integrated circuits that allows the designer to monitor the electrical, thermal and mechanical long term behaviour of the circuit from its early design stages. The multi-physics simulation tool is based on the direct method where three networks, i.e. an electrical, a thermal and a mechanical network, are directly linked and simulated with a unique circuit simulator. The tool was developed in a standard CAD environment, i.e. Cadence®. The way the three networks are built is described. In addition, to achieve multiphysics simulations, conventional CMOS models have to be replaced by specific multiphysics models that take additional physical effects into account, such as thermal effects, hot carriers induced ageing and their impact on the device performances. The modelling approaches as well as some simulation results are provided. Finally, the paper discusses the remaining prospective work to be able to perform electro-thermo-mechanical simulations of complex integrated systems.