1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)最新文献

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A new technique for the precise measurement of gate oxide damage caused by process induced charging 提出了一种精确测量过程感应充电栅氧化损伤的新技术
T. Turner, A. Pronin, J. Daniels
{"title":"A new technique for the precise measurement of gate oxide damage caused by process induced charging","authors":"T. Turner, A. Pronin, J. Daniels","doi":"10.1109/IRWS.1999.830582","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830582","url":null,"abstract":"Careful characterization of thin gate oxides aged with a tunneling current stress has shown a characteristic of the aging process that can be used to precisely calculate the damage produced in the oxide. This characteristic can be quantified by a simple measurement that correlates very well with the amount of tunneling current stress forced through an oxide. Process Induced Charging effects can damage an oxide by forcing high tunneling currents through the oxide. The amount of charge damage to an oxide can be difficult to measure. Generally, antenna transistors are used to monitor this problem with a shift in the transistor characteristics used to quantify the amount of damage. This can be difficult due to the non-linear relationship between the oxide damage and the transistor characteristics such as V/sub t/ or transconductance. This paper will describe the results of precise I-V characterization of a thin oxide following a tunneling current stress. The results show a near linear relationship between the magnitude of a transient leakage current from the \"floating channel\" region under the gate and the amount of tunneling current stress.","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"234 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122514242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
HCI characterization of Trans-LC and HCl gate oxidation process 反式lc和HCl栅氧化过程的HCI表征
Zhiqiang Ma, G. Chapman, V. Ho
{"title":"HCI characterization of Trans-LC and HCl gate oxidation process","authors":"Zhiqiang Ma, G. Chapman, V. Ho","doi":"10.1109/IRWS.1999.830580","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830580","url":null,"abstract":"This paper presents our recent HCI (Hot Carrier Injection) characterization results of Trans-LC and HCI gate oxidation process. In the HCI gate oxidation process, a small percentage of chlorine (Cl) is introduced to the oxidation tube to get sodium ion (Na) that can cause device instability. This process, however, is critical with respect to the corrosion of stainless steel pipe and special care is required to prevent the corrosion from happening. Alternatively, a new way of introducing Cl to the oxidation tube by using a new chlorine source produced by a chemical reaction has been investigated. In this case, trans-dichloroethylene (Trans-LC) has been employed as the chlorine source. The reaction is C/sub 2/H/sub 2/Cl/sub 2/+O/sub 2//spl rarr/2CO/sub 2/+2HCl to get the HCl used in the gate oxidation process.","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"275 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122807993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A methodology to assess the influence of Burn In related to long-term reliability of submicron CMOS transistors 一种评估烧蚀对亚微米CMOS晶体管长期可靠性影响的方法
S. Holzhauser, A. Narr
{"title":"A methodology to assess the influence of Burn In related to long-term reliability of submicron CMOS transistors","authors":"S. Holzhauser, A. Narr","doi":"10.1109/IRWS.1999.830550","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830550","url":null,"abstract":"We have found a suitable methodology to establish the influence of Burn In (BI) stress on transistor lifetime with respect to decreasing transistor channel lengths and simultaneously increasing energy of accelerated electrons by higher electric fields during BI. This paper describes the details of the measurement method and a transformation model, which allows us to calculate the BI influence on transistor lifetime based on standard hot carrier stress (HCS) investigations. The new method results in a considerable reduction of measurement time and a suitable way to assess the transistor lifetime reduction due to the BI procedure.","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133123948","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Predicting plasma charging damage in ultra thin gate oxide by using nondestructive DCIV technique 利用非破坏性DCIV技术预测超薄栅极氧化物的等离子体充电损伤
Hao Guan, M. Li, Yaohui Zhang, B.J. Cho, B. Jie, J. Xie, J.L.F. Wang, A. C. Yen, G.T.T. Sheng, Z. Dong, Weidan Li
{"title":"Predicting plasma charging damage in ultra thin gate oxide by using nondestructive DCIV technique","authors":"Hao Guan, M. Li, Yaohui Zhang, B.J. Cho, B. Jie, J. Xie, J.L.F. Wang, A. C. Yen, G.T.T. Sheng, Z. Dong, Weidan Li","doi":"10.1109/IRWS.1999.830554","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830554","url":null,"abstract":"The direct-current current-voltage (DCIV) method is presented to be an effective monitor for predicting plasma charging damage in ultra thin gate oxides. The DCIV experiments in deep submicron p-MOSFETs with 50 /spl Aring/ and 37 /spl Aring/ oxide and with various metal antenna structures clearly indicate a plasma damage region on the wafers. High initial interface trap density, rapid latent degradation and low charge to soft breakdown were found in the serious plasma damage region.","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"684 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132867810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Burn-In 老化
R. Vollertsen, R. Hijab
{"title":"Burn-In","authors":"R. Vollertsen, R. Hijab","doi":"10.1109/IRWS.1999.830588","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830588","url":null,"abstract":"Burn-In is used to screen weak parts from a population of completely processed chips to assist in meeting reliability requirements. This tutorial provides a general introduction to burn-in. It is shown how burn-in improves the failure rate. Typical burn-in conditions, the burn-in models and an example of failure mechanisms are given. The impact of burn-in on technology reliability (hot carriers, gate oxide, electromigration) is discussed, emphasizing that the upper limits of the burn-in conditions can be controlled by technology reliability. Finally the benefits and disadvantages of burn-in are summarized.","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116304796","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 271
Hot-carriers Hot-carriers
A. Bravaix
{"title":"Hot-carriers","authors":"A. Bravaix","doi":"10.1109/IRWS.1999.830577","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830577","url":null,"abstract":"","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"359 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115897953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
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