1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)最新文献_第2页

Limiting oxide failure mode versus oxide thickness. Some insights for deep-submicron technologies 极限氧化物失效模式与氧化物厚度的关系。对深亚微米技术的一些见解

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830563

S. Bruyère, E. Vincent, G. Ghibaudo

引用次数: 2

Temperature gradient effects in electromigration using an extended transition probability model and temperature gradient free tests. I. Transition probability model 用扩展跃迁概率模型和无温度梯度试验研究电迁移中的温度梯度效应。一、转移概率模型

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830555

K. Jonggook, V. Tyree, C. R. Crowell

{"title":"Temperature gradient effects in electromigration using an extended transition probability model and temperature gradient free tests. I. Transition probability model","authors":"K. Jonggook, V. Tyree, C. R. Crowell","doi":"10.1109/IRWS.1999.830555","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830555","url":null,"abstract":"Temperature gradient effects incorporated in electromigration are examined via the movement of vacancies. To explain the movement of metal ions or vacancies, an extended transition probability model with temperature gradients and vacancy concentration gradients is compared with the usual drift-diffusion model including the equation of continuity and the Einstein relationship. The self-consistent constant vacancy source boundary condition for repeated SWEAT structure is proposed so as to solve the equation of continuity. A derived time-to-fail equation from our model with temperature gradients is similar to the original Black's equation. Also temperature gradient effects are simulated using our temperature model and the vacancy concentration profile that will ultimately lead to failure is investigated for various current densities and substrate temperatures. Based on our simulation and experiments at extremely high current density (typical of SWEAT type tests), there is a failure site with very small standard deviation for both NIST and SWEAT when strongly controlled by temperature gradient effects. By adding a compensating heat flow structure under the interconnection region, a temperature gradient free test structure was designed and tested with various temperature gradients. Test results show dramatic changes in failure location and time to failure as the amount of the temperature gradient is varied.","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115242838","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Temperature dependence of resistance in Black's equation and in calibration for SWEAT and NIST structures: the parameter T/sub EO/ Black方程和SWEAT和NIST结构校准中电阻的温度依赖性:参数T/sub EO/

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830579

C. R. Crowell, C. Shih, K. Jonggook, V. Tyree

{"title":"Temperature dependence of resistance in Black's equation and in calibration for SWEAT and NIST structures: the parameter T/sub EO/","authors":"C. R. Crowell, C. Shih, K. Jonggook, V. Tyree","doi":"10.1109/IRWS.1999.830579","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830579","url":null,"abstract":"The equation for resistance R(T) at temperature T can be expressed in the form R(T)=(dR/dT).(T-T/sub EO/. When dR/dT is constant over the range of your experiment, T/sub EO/ is then a constant, the temperature at which R(T) extrapolates to zero. If we wish to express the corresponding relationship with /spl beta/(T/sub r/), the temperature coefficient of resistivity (TCR) at temperature T/sub r/, /spl beta/(T/sub r/) is defined in the form /spl beta/(T/sub r/)=(dR/dT/sub r/).(1/R(T/sub r/))=1/(T/sub r/-T/sub EO/). For both these equations it is desirable to use the Kelvin scale for T, especially when activation energy terms occur in the test under consideration. Our experimental measurements of temperature calibration have yielded T/sub EO/ values less than 40 degrees Kelvin, and with sufficient accuracy such that materials properties can be usefully determined provided that the test temperature is not too high. When /spl beta/(T/sub r/) is specified by an independent source, it is necessary that T/sub r/ be included in both theoretical and experimental cases.","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124503680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Thin oxide limits 薄氧化物极限

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830575

E. Vincent, J. Suehle

引用次数: 0

Product reliability and maximum voltage limits from extrinsic gate oxide voltage ramp data 产品可靠性和最大电压限制从外部栅极氧化物电压斜坡数据

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830566

R. Hijab

引用次数: 5

Analysis of evolution to and beyond quasi-breakdown in ultra-thin oxide and oxynitride 超薄氧化物和氮氧化物准击穿前后的演化分析

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830569

M. Okandan, S. Fonash, B. Maiti, H. Tseng, P. Tobin

引用次数: 0

Impact of test-structure design and test methods for electromigration testing 测试结构设计和测试方法对电迁移测试的影响

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830557

S. Menon, J. Fazekas, J. von Hagen, L. Head, C. Ellenwood, H. Schafft

{"title":"Impact of test-structure design and test methods for electromigration testing","authors":"S. Menon, J. Fazekas, J. von Hagen, L. Head, C. Ellenwood, H. Schafft","doi":"10.1109/IRWS.1999.830557","DOIUrl":"https://doi.org/10.1109/IRWS.1999.830557","url":null,"abstract":"The ultimate goal of this work is to develop design guidelines for electromigration test structures and to revise existing standard test methods for fast wafer-level and conventional package-level stress testing. These tests all involve stressing a sample of test structures and measuring their failure times to obtain sample estimates of the median-time-to-failure, t/sub 50/, and the standard deviation of the log/sub e/ of the failure times, or sigma(/spl sigma/). Four test methods (Standard Wafer Level Electromigration Accelerated Test (SWEAT), IsoI-SWEAT, Isothermal, and ASTM) and six test structures (four SWEAT-type and two ASTM-type) were used to stress Al-1% Si metallization (1 /spl mu/m and 3 /spl mu/m) lines. It was observed that /spl sigma/ is not affected by test structure design, but is affected by the test method. /spl sigma/(SWEAT) was the largest and /spl sigma/(IsoI-SWEAT) was the smallest, quite understandable based on how the stress in the test methods differ. Sigma was also larger for narrower lines. The manner of terminating the test line in the ASTM-type structures did not impact lifetime, except in the narrowest lines, where the lifetime was higher for the structures with split end segments (contrary to expectations). An opening in the passivation over the heat sinks in the SWEAT-type structures did not impact lifetime. A thermal analysis showed that the usual technique of using the fractional change in resistance of the test structure to estimate the joule heating of test lines can lead to underestimates of the stress temperature. The larger the relative resistance of the heat sinks of the test structure, the greater the stress temperature of the test line will be under estimated and the lower the t/sub 50/ will be. The analysis also helped explain the observed differences in the t/sub 50/ values for the different test structures.","PeriodicalId":131342,"journal":{"name":"1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1999-10-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114807013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

On the bimodal lognormal distribution of electromigration lifetimes 电迁移寿命的双峰对数正态分布

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830581

M. Lepper, A. Fischer, A. Zitzelsberger

引用次数: 0

Reliability aspects of stress-induced voiding in 0.25 /spl mu/m metallization 0.25 /spl mu/m金属化中应力诱导空化的可靠性分析

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830552

A. Zitzelsberger, M. Lehr

引用次数: 1

An evaluation of electrical linewidth determination using cross-bridge and multi-bridge test structures 用跨桥和多桥试验结构确定电线路宽度的评价

1999 IEEE International Integrated Reliability Workshop Final Report (Cat. No. 99TH8460) Pub Date : 1999-10-18 DOI: 10.1109/IRWS.1999.830556

L. Head, H. Schafft

引用次数: 3