2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)最新文献_第3页

Experimental validation of the power blurring method 功率模糊方法的实验验证

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444285

Je-Hyoung Park, Sangho Shin, J. Christofferson, A. Shakouri, S. Kang

引用次数: 10

Hot spots and core-to-core thermal coupling in future multi-core architectures 未来多核架构中的热点和核对核热耦合

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444291

M. Janicki, J. Collet, A. Louri, A. Napieralski

引用次数: 28

Experimental analysis model of an active cooling method for 3D-ICs utilizing a multidimensional configured thermoelectric 利用多维配置热电的3d - ic主动冷却方法的实验分析模型

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444315

Huy N. Q. Phan, D. Agonafer

引用次数: 8

A novel conduction-convection based cooling solution for 3D stacked electronics 一种新的基于传导对流的3D堆叠电子冷却解决方案

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444316

K. Kota, P. Hidalgo, Y. Joshi, A. Glezer

{"title":"A novel conduction-convection based cooling solution for 3D stacked electronics","authors":"K. Kota, P. Hidalgo, Y. Joshi, A. Glezer","doi":"10.1109/STHERM.2010.5444316","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444316","url":null,"abstract":"The present investigation focuses on the design and thermal parametric study of a unique liquid interface thermal management solution for a 3D chip stack that is embedded within a cavity, in a radial heat sink cooled by an array of synthetic jet actuators. The heat sink module was previously reported by the authors, who achieved an overall heat transfer coefficient of ~70 W/m2.K. The radial heat sink exploits enhanced, small-scale heat transfer that is affected by a central array of synthetic jet actuators. This approach is very effective due to the short radial thermal path of the cooling air along the fins which couples rapid, time-periodic entrainment and ejection of cool and heated air, respectively to increase the local heat transfer coefficient on the air-side. The key focus of this paper is the numerical simulation of the dielectric liquid interface used to efficiently transmit the heat from the high power 3D stacked electronics to the heat sink base. The coupled natural convection in the fluid and conduction in solid spreaders sandwiched between the tiers of the stack form a novel efficient, passive and scalable thermal management solution.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123606620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

TIM selection criteria for silicon validation environment 硅验证环境的TIM选择标准

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444307

Y. Pang, R. Mohammed, R. Sahan, Yi Xia, M. Prabhugoud

{"title":"TIM selection criteria for silicon validation environment","authors":"Y. Pang, R. Mohammed, R. Sahan, Yi Xia, M. Prabhugoud","doi":"10.1109/STHERM.2010.5444307","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444307","url":null,"abstract":"Thermal interface materials (TIMs) are widely used as heat conductive medium between a heat source and a heat dissipating device. A high thermal performance TIM can provide a low thermal resistance path and thus improve the thermal management of the heat source. This paper presents various criteria for TIMs used in silicon validation environment in addition to the well-known criteria for high performance TIMs. Seven commercially available greases and eight different thermal pads were evaluated based on the requirements for use in the silicon validation environment. These criteria include thermal performance before and after subjected to elevated temperature, adhesiveness of the grease before and after subjected to elevated temperature, adhesiveness of the grease over multiple usages, compliance of the thermal pad, reusability of the thermal pad for multiple loading and unloading cycles, and severity of silicone bleed from the thermal pad under elevated temperature and pressure. In addition to these validation requirements of TIMs, there is an additional requirement of high cycle of reusability in the robotic testing environment to minimize human interface. Indium TIM, a metallic TIM, provides well over 500 reusability cycles. Adhesion issue with high Indium content becomes dominant at high temperature and needs to be well addressed to take advantage of the reusability characteristics of Indium TIM.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122127211","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

The merits of open bath immersion cooling of datacom equipment 数据通信设备开槽浸没冷却的优点

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444305

P. Tuma

{"title":"The merits of open bath immersion cooling of datacom equipment","authors":"P. Tuma","doi":"10.1109/STHERM.2010.5444305","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444305","url":null,"abstract":"This paper discusses the economic and environmental merits of passive 2-phase immersion in semi-open baths of dielectric fluid for cooling datacom equipment such as servers. The technique eliminates the need for hermetic connectors, pressure vessels, seals and clamshells typically associated with immersion cooling and the connectors, plumping, pumps and cold plates associated with more traditional liquid cooling techniques. A board level power density of 11.7W/cm2 can be sustained with 100 cm3 of fluid per kW. The modular 80 kW baths modeled can eject 130 kW per m2 of floor space via water-cooled condensers. It is estimated that 28°C water at 15 gpm could maintain average CPU junction temperatures, Tj<;60°C and 62°C water at 30 gpm could maintain Tj<;85°C, maximizing the availability of the heat for other purposes. Alternatively, the heat can be transferred directly to ambient air without water as an intermediate. The costs and greenhouse gas emissions associated with conservative annual fluid emission estimates are found to be less than those associated with the electrical power required for traditional chassis fans and liquid pumps. Since these fugitive losses occur at one point, more efficient capture techniques can be easily applied.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122312522","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 79

Enhanced gaseous natural convection from micro-scale fin structures using acoustic stimulation 利用声刺激增强微尺度翅片结构的气体自然对流

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444310

Sung Ki Kim, M. David, K. Goodson, Sang Hak Kim, Jin Sup Kim

{"title":"Enhanced gaseous natural convection from micro-scale fin structures using acoustic stimulation","authors":"Sung Ki Kim, M. David, K. Goodson, Sang Hak Kim, Jin Sup Kim","doi":"10.1109/STHERM.2010.5444310","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444310","url":null,"abstract":"This paper investigates the effect of acoustic stimulation on natural convection heat transfer in micro-scale fin structures. Enhancement of heat transfer from electronic components enclosed within compact geometries is a key goal in thermal management. Among the techniques to enhance heat transfer, extended surface is a simple approach to achieve the goal. However, micro scale fin heat sinks have little effect on natural convection heat transfer. Previous work has shown that heat transfer via flow-induced vibration in a micro fin array can be enhanced, but only in a forced convection scheme with high flow rates. Acoustic stimulation has also been investigated in boiling and we extend this method of stimulation to enhance gaseous natural convection. The acoustic stimulation is generated using a speaker placed close to the micro fin array device. Waves of varying amplitude and frequency are generated and device surface temperatures recorded along with the speaker velocities, measured using Laser Doppler Velocimetry. The results obtained suggest that natural convection heat transfer can be enhanced using acoustic stimulation in micro-scale fin structures where the fins contribute negligible effect on overall heat transfer, and the enhancement varies with fin geometries. The results indicate that gaseous natural convection is feasible as a thermal management scheme in micro fin structures for low heat flux applications. Future works will be devoted to finding the resonance frequency of natural convection in micro-scale fin structures that can enhance heat transfer dramatically with little additional power consumption.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128953099","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Low profile heat pipe heat sink and green performance characterization for next generation CPU module thermal designs 低轮廓热管散热器和绿色性能表征下一代CPU模块的热设计

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444301

M. Vogel, Guoping Xu, D. Copeland, S. Kang, B. Whitney, G. Meyer, K. Kawabata, M. Conners

{"title":"Low profile heat pipe heat sink and green performance characterization for next generation CPU module thermal designs","authors":"M. Vogel, Guoping Xu, D. Copeland, S. Kang, B. Whitney, G. Meyer, K. Kawabata, M. Conners","doi":"10.1109/STHERM.2010.5444301","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444301","url":null,"abstract":"Increasing thermal demands of high-end server CPUs require increased performance of air-cooling systems to meet industry needs. Improving the air-cooled heat sink thermal performance is one of the critical areas for increasing the overall air-cooling limit. One of the challenging aspects for improving the heat sink performance is the effective utilization of relatively large air-cooled fin surface areas when heat is being transferred from a relatively small heat source (CPU) with high heat flux. Increased electrical performance for the computer industry has created thermal design challenges due to increased power dissipation from the CPU and due to spatial envelope limitations. Local hot spot heat fluxes within the CPU are exceeding 100 W/cm2, while the maximum junction temperature requirement is 105 C, or less. The CPU power dissipation continues to increase and the number of CPUs per server continues to increase for next generation servers. This has resulted in increased data room energy costs associated with supplying additional power to the server, and also cooling the server. Typically in the past, if two heat sink technologies met the thermal performance requirements along with meeting the reliability performance requirements, the least expensive technology would be utilized. In the future, heat sink thermal performance specifications will consider including the impact of energy cost savings attained through reduced server air flow rate requirements if utilizing a superior heat sink technology warrants a potential increase in heat sink cost.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130591366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Enabling new LED designs through advanced cooling technology 通过先进的冷却技术实现新的LED设计

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444275

B. Noska, Che Cheung, Hailin Jin, R. Mahalingam

引用次数: 7

Thermal analysis of high power LED array system 大功率LED阵列系统热分析

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444274

Guangchen Zhang, Shiwei Feng, Chunsheng Guo, Chenning Ge, Kaikai Ding

引用次数: 2