大功率LED阵列系统热分析

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI:10.1109/STHERM.2010.5444274

Guangchen Zhang, Shiwei Feng, Chunsheng Guo, Chenning Ge, Kaikai Ding

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引用次数: 2

摘要

通过电温敏感参数(TSP)法测试，证明了串联LED阵列系统的电气平均温升的物理含义是系统中所有子LED温升的算术平均值。基于这一关系，本文提出了一种利用扫描测量和递归计算来评估串联LED系统温度分布的新方法。给出了氮化镓基大功率LED阵列的瞬态热响应测量结果，为该方法提供了实验验证。结果表明，该方法实时性好，且与封装形式无关。单个测量结果与该方法之间的误差小于±2°C。

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Thermal analysis of high power LED array system

It's proved that the physical meaning of the electrical average temperature rise of series LED array system tested by electrical temperature sensitive parameter (TSP) method is the arithmetic mean of the temperature rises of all sub-LEDs in the system. Based on this relationship, a novel method to evaluate the temperature distribution of series LED systems by scan measurement and recursive calculation is proposed in this paper. Transient heating response measurements of GaN based high power LED arrays are presented to provide experimental verification for this method. The results show that this method is real-time valid and package form independent. The error between the results of individual measurement and this proposed method is less than ±2°C.

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2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)

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