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2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)最新文献

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Investigations of cooling solutions for three-dimensional (3D) chip stacks 三维(3D)芯片堆冷却解决方案的研究
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444319
Keiji Matsumoto, S. Ibaraki, M. Sato, K. Sakuma, Y. Orii, F. Yamada
{"title":"Investigations of cooling solutions for three-dimensional (3D) chip stacks","authors":"Keiji Matsumoto, S. Ibaraki, M. Sato, K. Sakuma, Y. Orii, F. Yamada","doi":"10.1109/STHERM.2010.5444319","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444319","url":null,"abstract":"Three-dimensional (3D) chip stacks are receiving more attention for system performance enhancements. However, because of the higher circuit density, the cooling of 3D chip stacks gets more challenging. In conventional cooling methods, a heat sink or a micro-channel cooler is located at the top of the chip to dissipate the generated heat in a chip. In this paper, possible cooling methods from the bottom of a silicon interposer and cooling from the peripheral of a silicon interposer were proposed and evaluated. Based on the experimentally obtained thermal resistance of lead-free (SnAg) interconnections, the cooling performances of the above two cooling solutions were investigated by modeling and the requirements were clarified.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129325530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 25
Time and frequency domain CCD-based thermoreflectance techniques for high-resolution transient thermal imaging 高分辨率瞬态热成像的时域和频域ccd热反射技术
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444287
B. Vermeersch, J. Christofferson, K. Maize, A. Shakouri, G. De Mey
{"title":"Time and frequency domain CCD-based thermoreflectance techniques for high-resolution transient thermal imaging","authors":"B. Vermeersch, J. Christofferson, K. Maize, A. Shakouri, G. De Mey","doi":"10.1109/STHERM.2010.5444287","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444287","url":null,"abstract":"Thermoreflectance microscopy is a well established method for the thermal imaging of (opto)electronic components and ICs. The technique combines submicron spatial resolution with excellent temperature resolution (10mK can be achieved). The dynamic thermal behavior can be studied using either a transient pulsed boxcar or frequency domain approach, the latter including homodyne and heterodyne lock-in systems. Temporal scales in the nanosecond range can be resolved. The basic principles of the various methods are reviewed, and their associated advantages and drawbacks are compared. We also propose a novel heterodyne technique as an alternative to the 'four bucket' method that has been used so far. Our approach greatly reduces the timing complexity while eliminating a major source of systematic error. Illustrative case studies present the transient and AC heat diffusion in integrated gold heaters, and separate imaging of Joule and Peltier effects in a 20×20μm2 thermoelectric microcooler.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132902250","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Investigation of dust in electrohydrodynamic (EHD) systems 电流体动力(EHD)系统中的粉尘研究
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444283
N. Jewell-Larsen, S. Karpov, H. Ran, P. Savalia, K. Honer
{"title":"Investigation of dust in electrohydrodynamic (EHD) systems","authors":"N. Jewell-Larsen, S. Karpov, H. Ran, P. Savalia, K. Honer","doi":"10.1109/STHERM.2010.5444283","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444283","url":null,"abstract":"Convection remains the most popular cooling solution for portable consumer electronic devices. However, increasing heat generation in microelectronics and the demand for increasingly compact devices has resulted in heat fluxes that are pushing the limit of conventional rotary fan air cooling technology. Electrohydrodynamic (EHD) ionic wind pumps offer a possible solution. In this technique, applying a voltage to a sharp electrode ionizes air molecules, which are propelled by the electric field, transferring momentum to neutral air molecules, thus creating airflow and cooling. A previous paper discussed the successful integration of an EHD cooling system in a notebook computer. It demonstrated the benefits of EHD cooling technology including silence, high coefficient of performance and flexible form factor, and discussed key technical challenges for commercialization. In this paper, we focus on a concern shared by both fan and EHD cooling systems: the accumulation of dust particles, which can result in performance loss. The fundamental mechanisms of particle collection within an EHD system are discussed, and a numerical model for predicting dust deposition is presented and verified using experimental results.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124546047","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
PTAT sensor for chip overheat protection PTAT传感器芯片过热保护
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444294
M. Szermer, M. Janicki, P. Pietrzak, Z. Kulesza, A. Napieralski
{"title":"PTAT sensor for chip overheat protection","authors":"M. Szermer, M. Janicki, P. Pietrzak, Z. Kulesza, A. Napieralski","doi":"10.1109/STHERM.2010.5444294","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444294","url":null,"abstract":"This paper presents a novel application of a Proportional-To-Absolute-Temperature (PTAT) sensor. The main function of this sensor is to monitor circuit temperature and generate an overheat signal in order to warn about excessive temperature of a circuit. Special emphasis is laid on the description of the design of current mirrors, which are responsible for the output signal voltage drop when circuit temperature exceeds certain preset value. The entire design was validated by measurements of the test ASIC implementing the sensor. The measurements confirmed correct operation of the sensor, but at the same time they revealed high sensitivity of the design to the parameter spread among particular ASICs and to the interference from digital circuitry.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123848609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Energy minimization based fan configuration for double walled telecommunication cabinet with solar load 具有太阳能负载的双壁电信机柜的节能风扇配置
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444278
Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, S. Karajgikar, D. Agonafer, Mark Hendrix
{"title":"Energy minimization based fan configuration for double walled telecommunication cabinet with solar load","authors":"Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, S. Karajgikar, D. Agonafer, Mark Hendrix","doi":"10.1109/STHERM.2010.5444278","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444278","url":null,"abstract":"Access networks provide the last mile of connectivity to telecommunication customers throughout the world. Voice, data, and video services through fiber, copper and wireless media are all delivered to the end user by the access portion of the network. In an access network, thermal management of active electronics and optical devices are critical to network reliability and performance. The outside plant telecom enclosures provide environmental protection for both active electronics and optical devices. These enclosures must incorporate cooling systems that support thermal requirements of the electronic and optical components. In addition to the heat load from the electronics there is also solar loading on the cabinet, which needs to be taken into account when designing a cooling system. In order to reduce the solar loading, a double walled cabinet was shown to be an effective method. In this method, air is forced between the telecommunication cabinet and the outside wall. Although the air gap is effective in reducing the solar load, its thickness was found to be insignificant [1]. Thus to reduce the cabinet dimensions, double walled cabinets with smaller air gap are recommended. However, this may impact the energy consumption of the fan and may pose acoustic problems. Hence, a study was carried out for different fan configurations and the effect it had on cabinet temperature and energy consumed by the fans were studied. From the study it was found out that there was significant change in energy consumed by fans when their location is changed.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116914773","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A compliant thermal spreader with internal liquid metal cooling channels 内置液态金属冷却通道的散热片
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444288
R. Wilcoxon, N. Lower, D. Dlouhý
{"title":"A compliant thermal spreader with internal liquid metal cooling channels","authors":"R. Wilcoxon, N. Lower, D. Dlouhý","doi":"10.1109/STHERM.2010.5444288","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444288","url":null,"abstract":"This paper describes a 1 mm thick substrate with integrated flow channels to circulate liquid metal that is pumped with an electromagnetic pump. The substrate was fabricated using conventional circuit board assembly methods. Tests were performed with pumping current of up to 10 amps, which corresponded to a pumping power of 450 mW. This testing showed that the substrate had an effective thermal conductivity of more than 6000 W/mK. The thin geometry and organic circuit board materials of the substrate allow it to be mechanically compliant and therefore can reduce the need for thermal gap fillers to connect dissipating components to the thermal spreader.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122343268","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Proactive power migration to reduce maximum value and spatiotemporal non-uniformity of on-chip temperature distribution in homogeneous many-core processors 在同质多核处理器中减少片上温度分布最大值和时空非均匀性的主动功率迁移
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444295
M. Cho, N. Sathe, M. Gupta, S. Kumar, S. Yalamanchilli, S. Mukhopadhyay
{"title":"Proactive power migration to reduce maximum value and spatiotemporal non-uniformity of on-chip temperature distribution in homogeneous many-core processors","authors":"M. Cho, N. Sathe, M. Gupta, S. Kumar, S. Yalamanchilli, S. Mukhopadhyay","doi":"10.1109/STHERM.2010.5444295","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444295","url":null,"abstract":"This paper presents a proactive spatiotemporal power multiplexing method to manage the thermal field in many-core processors. We first analyze the thermal field in many core processors in deep nanometer (to 16nm nodes). We show that the thermal field in many-core can have significant spatiotemporal non-uniformity along with high maximum temperature. For better reliability and improved cooling efficiency, it is important to achieve a lower peak temperature and a more uniform thermal field under all workload or utilization conditions. We propose proactive power migration to reduce spatial and temporal temperature difference, by redistributing the heat generating locations. The effectiveness of the proposed method is demonstrated for a 256 core many-core processor in predictive 16nm nodes.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132149249","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Exploring the thermal impact on manycore processor performance 探讨热对多核处理器性能的影响
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444293
Wei Huang, K. Skadron, S. Gurumurthi, R. J. Ribando, M. Stan
{"title":"Exploring the thermal impact on manycore processor performance","authors":"Wei Huang, K. Skadron, S. Gurumurthi, R. J. Ribando, M. Stan","doi":"10.1109/STHERM.2010.5444293","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444293","url":null,"abstract":"Performance of processors with many simple parallel cores is limited by the serial part of the workload, requiring an asymmetric core organization with one or more aggressive “primary” cores for better serial performance. A primary core introduces power-hungry microarchitectural structures and usually causes severe local hot spots. This paper explores the thermal impact on manycore processor architecture and evaluates its performance. Preliminary results show that thermal constraints reduce performance as expected, but also make performance almost insensitive to the complexity of the primary core across a diverse degrees of parallelism, which greatly reduces design complexity.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131080055","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 26
A simplified CFD modeling technique for Small Form factor Pluggable transceiver 小尺寸可插拔收发器的简化CFD建模技术
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444320
Jun Shen, A. Raghupathy
{"title":"A simplified CFD modeling technique for Small Form factor Pluggable transceiver","authors":"Jun Shen, A. Raghupathy","doi":"10.1109/STHERM.2010.5444320","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444320","url":null,"abstract":"Small Form-factor Pluggable (SFP) transceivers are commonly used in fiber optics based networks. Detailed CFD model demands a lot of mesh counts and is computationally prohibitive in system and board level simulations. In the present study, detailed SFP models have been simulated at 24 different boundary conditions consisted of four system airflow velocities, three power dissipations and two PCB board thermal conductivities. A two-resistor compact model has been derived based on the simulated heat fluxes and case temperatures of detailed SFP models. The case temperatures simulated from two-resistor model are benchmarked to the results from detailed SFP model. The two-resistor model has been compared with detailed SFP and DELPHI models strictly under the same condition. It has been shown with consistent accuracy. The advantages of using this model lie on modeling simplicity requiring the least grid resolution, easy scalability to different power dissipations, and great compatibility of various SFP packages. The limitations of two-resistor model are discussed at the end.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133980200","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Characteristic length and cooling circle 特性长度和冷却周期
2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) Pub Date : 2010-04-08 DOI: 10.1109/STHERM.2010.5444318
I. Luiten
{"title":"Characteristic length and cooling circle","authors":"I. Luiten","doi":"10.1109/STHERM.2010.5444318","DOIUrl":"https://doi.org/10.1109/STHERM.2010.5444318","url":null,"abstract":"Modular design, outsourcing and open innovation create a complex network of possible end product embodiments in product design for the consumer market. Analyzing each and every possibility in detail is out of the question as resources are limited and module details are often proprietary information. To meet this challenge the thermal engineer needs a feeling about what will and what will not work out, without getting bogged down in too much detail. This paper presents the concepts of characteristic length and cooling circle as an approximate measure for the extent of heat spreading in beam and in flat thin plate geometries. Beam and flat thin plate geometries are widely used by mechanical designers, and being able to assess how much of the geometry is actually thermally affected by a heat source is of great value in thermal decision making and communication. For both geometries an application is discussed and compared to CFD simulations to assess the validity of the approach.","PeriodicalId":111882,"journal":{"name":"2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)","volume":"232 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133529249","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
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