2016 17th International Conference on Electronic Packaging Technology (ICEPT)最新文献_第3页

Electromigration behavior of Sn3.0Ag0.5Cu/Sn58Bi structural composite solder interconnect Sn3.0Ag0.5Cu/Sn58Bi结构复合焊料互连的电迁移行为

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583134

Fengjiang Wang, Lili Zhou, Xiaojing Wang

引用次数: 0

Electrical simulation and fabrication of high Q spiral inductors on glass substrate using the glass reflow process 利用玻璃回流工艺在玻璃基板上制备高Q值螺旋电感器的电学模拟与研究

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583275

Hai-yang Chen, X. Jing, J. Shang

引用次数: 2

Fast MSL analysis of microelectronic packages by using equal weight increasing method 用等增重法快速分析微电子封装的MSL

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583161

Zhixue Liu, Xiaosong Ma, Qiulin Ding, G. Zhang

{"title":"Fast MSL analysis of microelectronic packages by using equal weight increasing method","authors":"Zhixue Liu, Xiaosong Ma, Qiulin Ding, G. Zhang","doi":"10.1109/ICEPT.2016.7583161","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583161","url":null,"abstract":"With the wide application of microelectronics packaging products in the industry, the chip have been more and more attention in the harsh environment of high temperature, high humidity. Therefore how to rapidly deliver high reliability products to market has been one of the issues of concern in the microelectronics industry. However moisture sensitivity level (MSL) analysis in microelectronics packaging is one of the most time consuming problem. Thus it is important to study the mechanism and method of the analysis of moisture sensitivity and shorten the analysis time. In this paper the fast analysis of microelectronic package MS L is achieved by the approach of an equal weight of water increasing at different conditions by simulation. According to project requirements, the ESOP8 is chosen as experimental device. Further the model is established, which is used to calculate equal moisture weight increase, and 10 to 67 acceleration factors are obtained. The purpose of this paper is to realize MSL the fast reliability evaluation method for microelectronics packaging industry. Finally using ANS YS finite element simulation is for the calculation.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"28 1","pages":"391-394"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87907333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Advanced packaging lithography and inspection solutions for next generation FOWLP-FOPLP processing 先进的封装光刻和检测解决方案，用于下一代FOWLP-FOPLP加工

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583315

K. Best, Gurvinder Singh, R. McCleary

{"title":"Advanced packaging lithography and inspection solutions for next generation FOWLP-FOPLP processing","authors":"K. Best, Gurvinder Singh, R. McCleary","doi":"10.1109/ICEPT.2016.7583315","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583315","url":null,"abstract":"For more than 50 years the semiconductor industry has pursued Moore's law, continuously improving device performance, reducing cost, and scaling transistor geometries down to where advanced CMOS has reached beyond the 10nm technology node. The commensurate increase in I/O count has created many challenges for device packaging which hitherto was considered low cost with simple solutions. It was once thought that old backend foundry lithography steppers could be used to address the new packaging requirements; which was true whilst the substrates remained in the traditional 300mm Silicon format. The recent unprecedented rapid growth in Fan Out Wafer Level Packaging (FOWLP) applications has introduced a more complicated landscape of process challenges, with no restriction on substrate format, where cost is the main driver and high yields are mandatory. This paper discusses the lithography process challenges that have ensued from disruptive FOWLP, and more recently the paradigm shift to Fan Out Panel Level Packaging (FOPLP). The work reports on lithography solutions for CD control over topography and high aspect ratio imaging of 2μm line/space RDL. In addition, the introduction of new inspection capabilities for defects and metrology is reported for both wafers and panels. The increase in lithography productivity and cost reduction provided by FOPLP is also discussed with production examples.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"14 1","pages":"1090-1094"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88283913","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Preparation of highly conductive adhesives by insitu incorporation of silver nanoparticles 银纳米颗粒原位掺入制备高导电性胶粘剂

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583170

Yankang Han, Baotan Zhang, Pengli Zhu, Qianqian Liu, Yougen Hu, R. Sun, C. Wong

{"title":"Preparation of highly conductive adhesives by insitu incorporation of silver nanoparticles","authors":"Yankang Han, Baotan Zhang, Pengli Zhu, Qianqian Liu, Yougen Hu, R. Sun, C. Wong","doi":"10.1109/ICEPT.2016.7583170","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583170","url":null,"abstract":"In this paper, Ag nano-particles (Ag-NPs) with size of 50 nm, good stability and dispersion have been prepared via the tradition polyol method. Then, a small amount of this prepared nanosized Ag particles combined with the common used Ag micro-flake (Ag-MFs) were used as the conductive fillers to fabricate the isotropic electrically conductive adhesive (ICA). The content of the Ag-NPs on the electrical properties of the ICAs have been studied systematically. It is showed that, only a small amount of Ag-NPs, much lower than literature reported previously, can dramatically improve the electrical conductivity of the ICA based on Ag-MFs. The results indicated that for the 80wt% Ag-MFs filled ICA, after introducing 0.24wt% Ag-NPs, the volume resistivity of the samples could be reduced from 1.14 ×10-3 Ω·cm to 1.37×10-4 Ω·cm. ICA made by above method with the 70wt % Ag fillers have excellent overall performance with higher shear strength of 26.35 Mpa and a lower volume resistivity of 8.00×10-4 Ω·cm, which was considered to be an ideal ICA candidate for electronic packaging applications.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"52 1","pages":"434-438"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83953379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Failure analysis of die-bonding interfaces between LED chip and heat sink LED芯片与散热器之间的模键接口失效分析

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583390

Wei Liu, Shunong Zhang, Yushen Jin, T. Zhang, L. C. Guo

引用次数: 1

Thermal and flow characteristics of device integrated metallic foam heat sinks with central impingement flow 具有中心冲击流的集成金属泡沫散热器的热特性和流动特性

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583179

H. Zhang, C. Li, P. Fan

{"title":"Thermal and flow characteristics of device integrated metallic foam heat sinks with central impingement flow","authors":"H. Zhang, C. Li, P. Fan","doi":"10.1109/ICEPT.2016.7583179","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583179","url":null,"abstract":"In this work, thermal and flow characteristics for the metallic foam heat sinks (FHSs) with the central impingement flow were studied with de-ionized water coolant. Such a flow configuration helps to reduce the pressure drop inherent for straight flow in porous foams. The reduction in the pressure drop is analyzed based on the one-dimensional porous medium model and verified with experimental measurement. The FHSs was fabricated and their thermal and flow characteristics were experimentally tested by integrating with a thermal test chip in BGA package format. The test chip has been built in with thermal diodes and resistors as heating source and junction temperature measurement. The foam materials were made of copper with the porosity ranging 60%-90% at the same pore density of 60 PPI (pores per inch), which were first brazed to the copper cavity and then assembled with a cover plate to form the flow channels. The cover plate was fabricated with an inlet slot at the center and two outlets at the two ends to provide a uniform impingement flow on the top of the foam. The idea is to split the fluid flow at the center of the heating component so that the pressure drop through the bulk foam material is reduced. As a result, the pressure drop is found to drop significantly without sacrificing the thermal performance for the present FHSs.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"23 1","pages":"477-481"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86719164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

The microanalysis of copper-coated diamond composite powders prepared by electroless plating 化学镀镀铜包覆金刚石复合粉末的显微分析

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583389

Lianmeng Zhang, Shuya Xiong, Ruxia Liu, Jian Zhang, G. Luo, Q. Shen

引用次数: 1

Development of a stable non-cyanide gold-tin electroplating solution for optoelectronic applications 光电用稳定无氰金-锡电镀溶液的研制

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583191

F. Huang, Yawei Liu, Mingliang L. Huang

引用次数: 1

Low melting alloy composites as thermal interface materials with low thermal resistance 低熔点合金复合材料作为低热阻的热界面材料

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583147

Haoran Wen, Yaqiang Ji, Kai Zhang, M. Yuen, S. Lee, Xianzhu Fu, R. Sun, C. Wong

引用次数: 0