{"title":"化学镀镀铜包覆金刚石复合粉末的显微分析","authors":"Lianmeng Zhang, Shuya Xiong, Ruxia Liu, Jian Zhang, G. Luo, Q. Shen","doi":"10.1109/ICEPT.2016.7583389","DOIUrl":null,"url":null,"abstract":"Diamond-Cu matrix composite with high thermal conductivity and low coefficient of thermal expansion has been the high-performance thermal management materials. High-performance copper-coated diamond composite powders were successfully prepared using electroless plating at an appropriate bath temperature, pH value, copper ions concentration. The XRD results showed the coated Cu was highly pure with very little oxygen content. The SEM results that the particle size and surface roughness increased, with the increase of bath temperature, pH value, copper ions concentration separately. Finally, diamond-Cu composite powers with dense Cu coating and homogeneous Cu particles could be obtained under the optimum process conditions at the reaction temperature of 45 °C, pH value of 12.5 and copper ions concentration of 0.10 mol/L.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"74 1","pages":"1418-1422"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"The microanalysis of copper-coated diamond composite powders prepared by electroless plating\",\"authors\":\"Lianmeng Zhang, Shuya Xiong, Ruxia Liu, Jian Zhang, G. Luo, Q. Shen\",\"doi\":\"10.1109/ICEPT.2016.7583389\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Diamond-Cu matrix composite with high thermal conductivity and low coefficient of thermal expansion has been the high-performance thermal management materials. High-performance copper-coated diamond composite powders were successfully prepared using electroless plating at an appropriate bath temperature, pH value, copper ions concentration. The XRD results showed the coated Cu was highly pure with very little oxygen content. The SEM results that the particle size and surface roughness increased, with the increase of bath temperature, pH value, copper ions concentration separately. Finally, diamond-Cu composite powers with dense Cu coating and homogeneous Cu particles could be obtained under the optimum process conditions at the reaction temperature of 45 °C, pH value of 12.5 and copper ions concentration of 0.10 mol/L.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"74 1\",\"pages\":\"1418-1422\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583389\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583389","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The microanalysis of copper-coated diamond composite powders prepared by electroless plating
Diamond-Cu matrix composite with high thermal conductivity and low coefficient of thermal expansion has been the high-performance thermal management materials. High-performance copper-coated diamond composite powders were successfully prepared using electroless plating at an appropriate bath temperature, pH value, copper ions concentration. The XRD results showed the coated Cu was highly pure with very little oxygen content. The SEM results that the particle size and surface roughness increased, with the increase of bath temperature, pH value, copper ions concentration separately. Finally, diamond-Cu composite powers with dense Cu coating and homogeneous Cu particles could be obtained under the optimum process conditions at the reaction temperature of 45 °C, pH value of 12.5 and copper ions concentration of 0.10 mol/L.