2016 17th International Conference on Electronic Packaging Technology (ICEPT)

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2016 17th International Conference on Electronic Packaging Technology (ICEPT) - 最新文献

Unlocking the full potential of Lithography for Advanced Packaging

Pub Date : 2018-10-01 DOI: 10.1109/icept.2016.7583313 J. van der Voort, G. van der Beek, Berend van der Grinten

A compact QCW conduction-cooled high power semiconductor laser array

Pub Date : 2016-10-04 DOI: 10.1109/ICEPT.2016.7583125 Qiwen Zhu, Pu Zhang, Shuna Wang, Dihai Wu, Zhiqiang Nie, Lingling Xiong, Yunfei Song, Xingsheng Liu

Thermal behavior of microchannel cooled high power diode laser arrays

Pub Date : 2016-10-04 DOI: 10.1109/ICEPT.2016.7583183 Dihai Wu, Pu Zhang, Zhiqiang Nie, Lingling Xiong, Yunfei Song, Qiwen Zhu, Yao Lu, Yifan Dang, Xingsheng Liu

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