{"title":"利用玻璃回流工艺在玻璃基板上制备高Q值螺旋电感器的电学模拟与研究","authors":"Hai-yang Chen, X. Jing, J. Shang","doi":"10.1109/ICEPT.2016.7583275","DOIUrl":null,"url":null,"abstract":"In order to meet the need of high integration and low cost of wireless communication systems, passive devices are widely used in all kinds of systems. This paper introduces an innovative method to manufacture integrated passive inductors based on glass reflow process. IPDs(integrated passive devices) have been simulated by 3D EM(electromagnetic) simulator software HFSS(high frequency structure simulator). From 0GHz to 10GHz, the Q value is above 200, higher than the Q value of conventional thin film inductors. Moreover, several key parameters of spiral inductors including inductor diameter, inductor thickness, substrate thickness, inductor width and inductor space are investigated. Finally, manufacturing process of inductors is presented.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"9 1","pages":"901-904"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Electrical simulation and fabrication of high Q spiral inductors on glass substrate using the glass reflow process\",\"authors\":\"Hai-yang Chen, X. Jing, J. Shang\",\"doi\":\"10.1109/ICEPT.2016.7583275\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In order to meet the need of high integration and low cost of wireless communication systems, passive devices are widely used in all kinds of systems. This paper introduces an innovative method to manufacture integrated passive inductors based on glass reflow process. IPDs(integrated passive devices) have been simulated by 3D EM(electromagnetic) simulator software HFSS(high frequency structure simulator). From 0GHz to 10GHz, the Q value is above 200, higher than the Q value of conventional thin film inductors. Moreover, several key parameters of spiral inductors including inductor diameter, inductor thickness, substrate thickness, inductor width and inductor space are investigated. Finally, manufacturing process of inductors is presented.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"9 1\",\"pages\":\"901-904\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583275\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583275","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Electrical simulation and fabrication of high Q spiral inductors on glass substrate using the glass reflow process
In order to meet the need of high integration and low cost of wireless communication systems, passive devices are widely used in all kinds of systems. This paper introduces an innovative method to manufacture integrated passive inductors based on glass reflow process. IPDs(integrated passive devices) have been simulated by 3D EM(electromagnetic) simulator software HFSS(high frequency structure simulator). From 0GHz to 10GHz, the Q value is above 200, higher than the Q value of conventional thin film inductors. Moreover, several key parameters of spiral inductors including inductor diameter, inductor thickness, substrate thickness, inductor width and inductor space are investigated. Finally, manufacturing process of inductors is presented.
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