2016 17th International Conference on Electronic Packaging Technology (ICEPT)最新文献_第2页

Study on short-circuit failure of solder-joint interconnections 焊点互连短路失效研究

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583234

W. Zhonghua, Xiao Hui

引用次数: 1

Study of interconnection between Ni nano-array and nano-Ag solder Ni纳米阵列与纳米银焊料互连的研究

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583263

Zhen-zhu Zheng, Fan Yang, Chunqing Wang

{"title":"Study of interconnection between Ni nano-array and nano-Ag solder","authors":"Zhen-zhu Zheng, Fan Yang, Chunqing Wang","doi":"10.1109/ICEPT.2016.7583263","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583263","url":null,"abstract":"As the integrated circuit and semiconductor industry developing rapidly, traditional micro-joining technology can not meet the new high-power devices challenge. Due to the size effect, nano-materials can offer low-temperature connection and high-temperature service property, which may be a promising approach for the high-power application. In the interconnection process, such as nano-Ag solder, the sintering temperature is much higher than the theoretical calculating value. This huge temperature difference is related to the microstructure gap between the nanostructure and the conventional pad. In order to achieve the low-temperature joining and increase the interconnection efficiency, the Ni nanostructure was deposited on the Cu pad surface by the electrochemical method in this paper. The Ni nanostructure could reduce the size difference between the nano-solder and the traditional pad. It is significant to control the Ni surface nanostructure. The electrochemical parameters, such as current density and temperature were studied. The surface nanostructure and nano-solder sintering process were investigated. The interconnection can be completed in lower temperature compared with the traditional joining process. The whole connection could be finished more efficiently.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"15 1","pages":"849-851"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79136092","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Reliability prediction for IGBT solder joints using Clech Algorithm 基于Clech算法的IGBT焊点可靠性预测

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583309

Hua Lu, C. Bailey

引用次数: 6

Study of Package-on-Package solder joints under random vibration load based on Patran 基于Patran的随机振动载荷下封装焊点的研究

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583172

Long Zhang, Chunyue Huang, Wei Huang, Tian-ming Li, Jianwei Hua

引用次数: 2

QFP plastic cavity carrier design for MPW chip package 用于MPW芯片封装的QFP塑料腔载体设计

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583359

Zhenchao Li, Qian Wang, Yu Chen, Guangjun Cui, Zhao-Lin Liu

{"title":"QFP plastic cavity carrier design for MPW chip package","authors":"Zhenchao Li, Qian Wang, Yu Chen, Guangjun Cui, Zhao-Lin Liu","doi":"10.1109/ICEPT.2016.7583359","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583359","url":null,"abstract":"Before mass production, designed IC will be firstly verified using a Multi Project Wafer (MPW) procedure. How to package the MPW chips in a short time with a reasonable price is the common need of design houses. The Quad Flat Package (QFP) cavity carrier provides a “house” to protect the chips, and is strongly accepted by IC design companies and research parties. But usually, the QFP cavity carrier is shaped by ceramic in a high price. This article will present an EMC (Epoxy Molding Compound) based QFP cavity carrier which is developed by a microelectronic transfer-molding technology with double side film lining the mold parts. The design of EMC based QFP cavity carrier is elaborated and the development of QFP cavity carrier through by Film Assistant Molding (FAM) technology provided by the Boschman molding tool is demonstrated. After unit and strip drawing, molding process with software of mold flow was simulated. The simulation results showed all of the units in the strip can be fully filled and the compound was void free. Together with previous experience in QFN (Quad Flat No-lead Package) cavity products, it is concluded that QFP plastic cavity carriers will become universal kits for MPW chip or testing chip package in an acceptable price and delivery time.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"7 1","pages":"1288-1292"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78516312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Influence of electric current on the grain orientation of Cu-Sn intermetallic compounds in Cu/molten Sn/Cu interconnection system 电流对Cu/熔融Sn/Cu互连体系中Cu-Sn金属间化合物晶粒取向的影响

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583151

Jiayun Feng, Baolei Liu, Yanhong Tian, B. Zhang

{"title":"Influence of electric current on the grain orientation of Cu-Sn intermetallic compounds in Cu/molten Sn/Cu interconnection system","authors":"Jiayun Feng, Baolei Liu, Yanhong Tian, B. Zhang","doi":"10.1109/ICEPT.2016.7583151","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583151","url":null,"abstract":"In this paper, the interfacial reaction and the grain orientation of Cu6Sn5 intermetallic compound was investigated in Cu/molten Sn/Cu interconnection system under the current density of 1.0 × 102A/cm2 at 260 °C. The imposed electric current significantly accelerated the Cu6Sn5 growth rate at anode side under the effect of solid-liquid electromigration, while it has no obvious effect on the Cu3Sn growth rate. The growth kinetics calculation results showed that with the passage of electric current, the growth of Cu6Sn5 compound at the cathode was determined by reaction process, while the Cu3Sn growth was diffusion-controlled. In addition, the current can strongly influence the orientation of Cu6Sn5 phase in Cu-molten Sn-Cu system. There was a strong texture of [0001] direction in Cu6Sn5 phase, which was paralleled with the direction of electron flow. This result indicated that the electrons traveled along some particular directions and were scattered least by the lattices. The newly formed Cu-Sn compounds orientated themselves in those particular growth directions to facilitate electron flow.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"89 1","pages":"348-351"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80343386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Analysis of board level vibration reliability of PoP structure with underfill material 下填料PoP结构板级振动可靠性分析

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583085

J. Xia, Guoyuan Li, Bin Zhou

引用次数: 2

In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesive 石墨烯纳米银的原位水热合成及其在导电胶粘剂中的应用

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583089

Jinfeng Zeng, Hongru Ma, Xun Tian, Yanqing Ma

{"title":"In situ hydrothermal synthesis of silver nanoparticle based on graphene and their application for electrically conductive adhesive","authors":"Jinfeng Zeng, Hongru Ma, Xun Tian, Yanqing Ma","doi":"10.1109/ICEPT.2016.7583089","DOIUrl":"https://doi.org/10.1109/ICEPT.2016.7583089","url":null,"abstract":"Electrically conductive adhesive based on epoxy and conductive materials, which have been considered as the new promising material for electronic packaging because of the advantages of low processing temperature, fine pitch interconnect and environmentally friendly. The silver nanoparticle based on graphene have been used in the electrically conductive adhesive as a result of the excellent electrical material. The number of effective conductive paths were improved after doping silver nanoparticle based on graphene into epoxy. So silver nanoparticle based on graphene was prepared in situ hydrothermal method via silver-ammonia solution and graphene oxide as initial solution without other supported reagents. Scanning Electron Microscopy, Transmission Electron Microscopy, X-ray diffraction and Raman spectroscopy were applied to analyze the morphologies and structures of silver nanoparticle based on graphene. Then electrically conductive adhesive was prepared by mixing silver nanoparticle based on graphene, silver flakes and epoxy together. The electrical properties of electrically conductive adhesive were tested by four-point probe method after cured at 150 °C for 2 h. The result shows that silver nanoparticles were dispersed on the surface of graphene layers uniformly and the average diameter of nanosilver particles is 80 nm. The electrical properties of electrically conductive adhesive was 7.0×10-4 Ω·cm when the nanosilver based on graphene reached 0.2 %, which compared with electrically conductive adhesive (1.1×10-3 Ω·cm) without nanosilver based on graphene was improved.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"1993 1","pages":"57-60"},"PeriodicalIF":0.0,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82389576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Experimental investigation of paraffin wax with graphene enhancement as thermal management materials for batteries 石墨烯增强石蜡作为电池热管理材料的实验研究

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583385

Yan Zhang, W. Yue, Shaochun Zhang, Shirong Huang, Johan Liu

引用次数: 2

Edge chipping of silicon wafers in rotating grinding 旋转磨削过程中硅片的边缘剥落

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI: 10.1109/ICEPT.2016.7583317

Jinglong Sun, F. Qin, Pei Chen, Tong An, Zhongkang Wang

引用次数: 3