Analysis of board level vibration reliability of PoP structure with underfill material

Abstract

The board level vibration reliability of the Package-on-Package (PoP) structure with different underfill types was investigated by finite element method (FEM). Underfill methods used in this study were the full-filled method, the corer-bonded method and the edge-bonded method. Results show that all of them can obviously improve the reliability of PoP structure in random vibration environment. The stress level of the solder joint significantly decreases by the application of underfill materials in the bottom package body of PoP structure. In addition, the location of critical solder joint is different with different underfill types.