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2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)最新文献

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Environmental Sensing Hub on Single Chip Using Double-Side Post-CMOS Processes 采用双面后cmos工艺的单片环境传感中心
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056143
Cheng-Chun Chang, Ping-Hsiu Hong, Sheng-Kai Yeh, Yung-Chian Lin, Mei-Feng Lai, W. Fang
{"title":"Environmental Sensing Hub on Single Chip Using Double-Side Post-CMOS Processes","authors":"Cheng-Chun Chang, Ping-Hsiu Hong, Sheng-Kai Yeh, Yung-Chian Lin, Mei-Feng Lai, W. Fang","doi":"10.1109/MEMS46641.2020.9056143","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056143","url":null,"abstract":"This research reports a monolithically integrated Humidity/Thermometer/Pressure sensor to realize an environment sensing hub. The environment sensing hub is designed and implemented using the TSMC $0.18 mu mathrm{m}$ 1P6M CMOS platform and the follow-up double-side post-CMOS micromachining processes. Features of this study are: (1) Small footprint with less packaging effort: monolithic integration of H/T/P sensors on a single chip, (2) Fast response time of relative-humidity (RH) sensor: removal of backside silicon by double-side post-CMOS process to enhance vapor diffusion of capacitive RH sensor. (3) Double-side post-CMOS process: simultaneously fabricating backside cavities for H/P sensors. Measurement results indicate the performances of the environment sensing hub: humidity sensor with sensitivity of 4.06fF/%RH and response time of 3.1sec (15.7sec for the reference type of conventional design), and pressure sensor with sensitivity of 0.79fF/kPa, thermometer with response of 15.8mV/°C.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"9 1","pages":"877-880"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81768854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Smart Triboelectric Socks for Enabling Artificial Intelligence of Things (AIoT) Based Smart Home and Healthcare 智能摩擦电袜子，实现基于人工智能(AIoT)的智能家居和医疗保健
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056149
Zixuan Zhang, Tianyiyi He, Minglu Zhu, Qiongfeng Shi, Chengkuo Lee
{"title":"Smart Triboelectric Socks for Enabling Artificial Intelligence of Things (AIoT) Based Smart Home and Healthcare","authors":"Zixuan Zhang, Tianyiyi He, Minglu Zhu, Qiongfeng Shi, Chengkuo Lee","doi":"10.1109/MEMS46641.2020.9056149","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056149","url":null,"abstract":"Smart socks using textile-based triboelectric nanogenerator (TENG) for powering a Bluetooth module are developed to support wireless sensory data transmission under Internet of Things (IoT) framework. Leveraging personalized triboelectric output features, artificial intelligence (AI) based comprehensive gait analysis provides detailed information of multiple users wearing triboelectric socks in a same room. Such information can tell us about the identification, health condition, and activity of the users for smart home and healthcare applications.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"18 1","pages":"80-83"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81840330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Pipette Based Viscometer with Pressure Sensor Element 带压力传感器元件的移液管式粘度计
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056273
Sinwoo Cho, Thanh-Vinh Nguyen, N. Miki, Hidetoshi Takahashi
{"title":"Pipette Based Viscometer with Pressure Sensor Element","authors":"Sinwoo Cho, Thanh-Vinh Nguyen, N. Miki, Hidetoshi Takahashi","doi":"10.1109/MEMS46641.2020.9056273","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056273","url":null,"abstract":"This paper reports a simple viscometer, whose principle utilizes the relationship between liquid viscosity and the suction speed in a tube. The proposed viscometer is composed of an air chamber and a glass tube. A steel ball is attached to the silicone membrane of the chamber and an electromagnetic magnet is used to provide the volume change. A MEMS pressure sensor element is attached to the chamber to measure its pressure change. When a step-response volume change is applied, the chamber pressure decreases so that the liquid sticking to the tube gradually ascends at a speed depending to the viscosity. Thus, the viscosity can be calculated by measuring the gradient of the pressure change. The proposed method can be applied to micropipettes so that viscosity is easily measured with a simple device.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"2 1","pages":"646-648"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81847695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A High Sensitive and Low Parasitic Capacitance Folding Micro Coil with Multilayered Zigzag Diameter Wiring 一种高灵敏度、低寄生电容的多层之字形直径折叠微线圈
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056289
Tomohiko Izumizaki, M. Hori, T. Dohi
{"title":"A High Sensitive and Low Parasitic Capacitance Folding Micro Coil with Multilayered Zigzag Diameter Wiring","authors":"Tomohiko Izumizaki, M. Hori, T. Dohi","doi":"10.1109/MEMS46641.2020.9056289","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056289","url":null,"abstract":"This paper reports on a high sensitive and low parasitic capacitance folding micro coil with multilayered zigzag diameter wiring used as an RF coil for Magnetic resonance imaging (MRI). This coil was fabricated by assembling a flexible substrate with an unfolded wiring pattern and 3D printed jigs with hollow skeletal structures. So as not to increase the parasitic capacitance, this coil has a multilayered zigzag structure with different coil diameters for each turn to reduce the overlapped area of wiring and 3D printed jigs with hollow skeletal structures were adopted not to exist jigs with a high dielectric constant between coil wirings. As a result, since the parasitic capacitance increased slightly compared to the increase in the number of turns, high sensitive MRI images can be taken using our coil.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"1 1","pages":"465-468"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80836199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A High-Performance Electrodynamic Micro-Receiver for Low-Frequency Wireless Power Transfer 一种用于低频无线电力传输的高性能电动力微型接收器
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056444
M. A. Halim, S. E. Smith, J. Samman, D. Arnold
{"title":"A High-Performance Electrodynamic Micro-Receiver for Low-Frequency Wireless Power Transfer","authors":"M. A. Halim, S. E. Smith, J. Samman, D. Arnold","doi":"10.1109/MEMS46641.2020.9056444","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056444","url":null,"abstract":"We report the design, fabrication and characterization of a microfabricated electrodynamic wireless power transmission (EWPT) receiver that uses a bulk-micromachined silicon serpentine torsional suspension, NdFeB magnets, and precision-manufactured micro-coils. The 0.31 cm3 device generates 2.46 mW average power (7.9 mW/cm3) at a distance of 4 cm from a transmitter coil operating at 821 Hz and safely within allowable human exposure limits. Compared to a previously reported prototype, this micro-receiver is ∼40% smaller, offers ∼16x better magnetic field sensitivity and 1.7x higher power density for improved applicability for wirelessly charging wearable and bio-implantable devices.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"25 1","pages":"590-593"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83145542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
RGB all Liquid-Based Microfluidic Quantum Dots Light-Emitting Diodes Using Deep-Blue Liquid Organic Semiconductor Backlight 采用深蓝液体有机半导体背光的RGB全液体微流控量子点发光二极管
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056181
M. Kawamura, H. Kuwae, T. Kamibayashi, J. Oshima, T. Kasahara, S. Shoji, J. Mizuno
{"title":"RGB all Liquid-Based Microfluidic Quantum Dots Light-Emitting Diodes Using Deep-Blue Liquid Organic Semiconductor Backlight","authors":"M. Kawamura, H. Kuwae, T. Kamibayashi, J. Oshima, T. Kasahara, S. Shoji, J. Mizuno","doi":"10.1109/MEMS46641.2020.9056181","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056181","url":null,"abstract":"We developed an RGB microfluidic quantum dots light-emitting diode (QLED). All emitter and luminophores were liquid materials, including liquid organic semiconductor (LOS) as a backlight and quantum dots (QDs) solutions for high-color-purity luminophores. A deep-blue LOS backlight was used to excite QDs solutions. RGB lights were achieved with narrow full width at half maximum (FWHM) of 26.2 nm (green) and 25.0 nm (red), and were close to the boundary of CIE color space. The color purity of the RGB microfluidic QLED was the highest in that of ever reported LOS based devices. The proposed device is expected to provide future flexible displays with high-color-purity.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"20 1 1","pages":"1238-1241"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81311114","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Stretchable Pressure and Strain Sensor Using Conductive Silk Hydrogels 使用导电丝水凝胶的可拉伸压力和应变传感器
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056254
Shan Zhang, Zhitao Zhou, T. Tao
{"title":"A Stretchable Pressure and Strain Sensor Using Conductive Silk Hydrogels","authors":"Shan Zhang, Zhitao Zhou, T. Tao","doi":"10.1109/MEMS46641.2020.9056254","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056254","url":null,"abstract":"We report a set of flexible and stretchable sensors using conductive silk hydrogels for wearable applications. Benefiting from its superior flexibility, the conductive silk hydrogel, doped with carbon nanotubes (CNTs) for desired conductivity, shows excellent flexibility with elastic modulus of ∼2-80 kPa, high stretchability up to 100% strain, good robustness and resilience. The conductive silk hydrogels can be used as both pressure and strain sensors showing characteristic responses to various simple and complex motions such as compression, tension and bending alone or in different combinations. As proof-of-concept, we demonstrated the use of these devices for real-time monitoring sporting motions of finger joints. Our approach offers potential opportunities wearable individual-centered health monitoring.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"3 1","pages":"165-167"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83002349","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Highly Stretchable Microelectrode Array for Free-form 3D Neuronal Tissue 用于自由形态三维神经元组织的高度可拉伸微电极阵列
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056250
Chaeyun Shim, Yehhyun Jo, H. K. Cha, Mi Kyung Kim, Hyojung Kim, Geon Kook, Kiup Kim, G. Son, Hyunjoon Lee
{"title":"Highly Stretchable Microelectrode Array for Free-form 3D Neuronal Tissue","authors":"Chaeyun Shim, Yehhyun Jo, H. K. Cha, Mi Kyung Kim, Hyojung Kim, Geon Kook, Kiup Kim, G. Son, Hyunjoon Lee","doi":"10.1109/MEMS46641.2020.9056250","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056250","url":null,"abstract":"There has been rapid advancement in the development of 3D neuronal cultures and brain organoids. However, conventional rigid 2D and 3D microelectrode arrays (MEAs) are not suitable for neural recording of free-form tissues due to limited contact with the tissue and poor media exchange. Here, we present a stretchable dual-MEA device suitable for non-invasive recording of free-form neural tissues for the first time. We achieve high stretchability by employing serpentine signal lines on a polyimide substrate and enable media exchange through perforated regions. A tissue sample was placed in between a pair of these stretchable MEAs to demonstrate successful 3D conformal contact and continuous media exchange.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"87 1","pages":"380-383"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83435408","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Capacitive Lamé Mode Resonators in $65 mu mathrm{m}$-Thick Monocrystalline Silicon Carbide with Q-Factors Exceeding 20 Million 65 mu mathm {m}$厚单晶硅q因子超过2000万的电容式lam<s:1>模谐振器
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056301
Jeremy Yang, B. Hamelin, F. Ayazi
{"title":"Capacitive Lamé Mode Resonators in $65 mu mathrm{m}$-Thick Monocrystalline Silicon Carbide with Q-Factors Exceeding 20 Million","authors":"Jeremy Yang, B. Hamelin, F. Ayazi","doi":"10.1109/MEMS46641.2020.9056301","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056301","url":null,"abstract":"This paper reports on the implementation of a capacitive in-plane Lamé mode resonator in $65 mu mathrm{m}$-thick monocrystalline 4H silicon carbide on insulator (SiCOI) with ultra-low dissipation. Boasting the highest $fcdot Q$ in Lamé mode resonators to date, this work is a stepping stone toward realizing a myriad of high-performance instruments and sensors in monocrystalline SiC. In addition to providing chemical and environmental robustness, SiC exhibits extremely low levels of intrinsic dissipation, potentially enabling $fcdot Qmathrm{s} 30times$ higher than those achievable in silicon (Si). However, attaining quantum-limited microresonators demands scrupulous processing and careful, deliberate design. With this in view, Lamé mode square resonators are excellent candidates to probe the fundamental phonon dissipation limits of SiC. Acoustically-engineered anchoring tethers composed of 1D phononic crystal (PnC) strips localize the acoustic vibration, limiting losses to the substrate. Electrostatically-transduced Lamé mode resonators are fabricated by deep reactive ion etching (DRIE) of fusion bonded SiCOI substrates, displaying a $Q$-factor of 20 Million (M) at 6.27 MHz with $fcdot Q=1.25 times 10^{14}$ Hz, over 4× above the Akhiezer limit set in (100) Si substrates. With further process optimization, these resonators can theoretically achieve $Qmathrm{s}$ in excess of 100M at room temperature. Across the temperature range −45° to 85°C, the thermal coefficient of frequency (TCF) of on-axis 4H-SiC Lamé modes is −12 ppm/°C.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"8 1","pages":"226-229"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78731174","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Conductive Liquid Bandage Based on Nitrocellulose and Ag Particles for Wound Isolation and Evaluation 基于硝酸纤维素和银颗粒的导电液体绷带伤口隔离及评价
2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2020-01-01 DOI: 10.1109/MEMS46641.2020.9056228
Yufeng Chen, Tongren Yang, Junshi Li, Yuanyu Huang, Zhihong Li
{"title":"Conductive Liquid Bandage Based on Nitrocellulose and Ag Particles for Wound Isolation and Evaluation","authors":"Yufeng Chen, Tongren Yang, Junshi Li, Yuanyu Huang, Zhihong Li","doi":"10.1109/MEMS46641.2020.9056228","DOIUrl":"https://doi.org/10.1109/MEMS46641.2020.9056228","url":null,"abstract":"Inspired by the commercial liquid bandage for first-aid treatment of wounds, we proposed a kind of Ag-particle-doped liquid bandage (AgP@LB), which can directly form a conductive layer on a wound for simultaneous isolation and evaluation. Ag particles were doped into collodion solution to realize high conductivity and antibacterial property. Compared to the planner electrode used for wound evaluation, the AgP@LB enables more stable and accurate impedance measurement owing to conformal and flexible contact with skin and wound. To demonstrate this feature, we introduced LCR digital bridge to extract electrical parameters from healthy and injured tissue through skin in order to evaluate the wound state. Our preliminary experimental result indicated significant impedance difference between the wounded skin and healthy one.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"3 1","pages":"6-9"},"PeriodicalIF":0.0,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89274287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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