半导体技术 Pub Date : 2002-08-07 DOI: 10.1109/ASMC.2002.1001595

B.K. Best

{"title":"Manufacturing Execution System (MES) operating system migration to integrate leading-edge methodologies and leverage emerging technologies","authors":"B.K. Best","doi":"10.1109/ASMC.2002.1001595","DOIUrl":"https://doi.org/10.1109/ASMC.2002.1001595","url":null,"abstract":"This article describes the successful migration of The Poseidon MES from IBM's OS/2 Warp Operating System to IBM's AIX/Unix Operating System. The Poseidon System was initially developed by IBM/ITS (an IBM Japan subsidiary) and installed at Dominion Semiconductor (DSC) in May of 1997. This MES was developed for OS/2 and was customized to meet DSC's Manufacturing and Engineering startup requirements. It became evident that the MES was not easily extendable while running on OS/2. Therefore, DSC decided to migrate the MES to an operating system (AIX/Unix) that was supported by 3/sup rd/ party vendor applications that did not support OS/2. The MES Development Team's primary focus was to extend the functionality of the MES to integrate leading-edge manufacturing methodologies, such as Advanced Process Control and Real-Time Dispatching. The MES is now postured to take advantage of new and emerging technologies, such as the following: Java - for program portability; XML - for data portability; Internet protocols - for data transmission and communication control; Browser - for user interface; HTTP Server - for an HTTP Server with proxy and caching.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89605402","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Distributed WIP control in advanced semiconductor manufacturing 先进半导体制造中的分布式在制品控制

半导体技术 Pub Date : 2002-08-07 DOI: 10.1109/ASMC.2002.1001573

R. Qiu, R. Burda, Robert Chylak

{"title":"Distributed WIP control in advanced semiconductor manufacturing","authors":"R. Qiu, R. Burda, Robert Chylak","doi":"10.1109/ASMC.2002.1001573","DOIUrl":"https://doi.org/10.1109/ASMC.2002.1001573","url":null,"abstract":"A proven successful strategy to improve the responsiveness of manufacturing systems is to continuously enhance shop floor work-in-process (WIP) management. It is well known that a centralized WIP management system results in inflexibility and poor scalability for a manufacturing system on the shop floor. This article presents an easily manageable and well-distributed WIP management system to address these issues for an advanced semiconductor manufacturing system where WIP control plays a critical role. Multiple spawned WIP control modules from a central server are synchronized using the concept of Virtual Production Lines. By doing so the modularization of both software and hardware on the shop floor is realized. The manufacturing system governed by the proposed distributed WIP control system is flexible, re-configurable, and scaleable. Therefore, when changes occur on equipment or manufacturing cells, the adjustment will be limited within the relevant line, while the impact onto the rest of the system is very much limited. Because the change can be made easily, quickly, and cost-effectively, the advanced semiconductor manufacturing system using this distributed WIP control system thus becomes much more competitive.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84208850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Spare parts expense management system [semiconductor manufacturing] 备件费用管理系统[半导体制造]

半导体技术 Pub Date : 2002-08-07 DOI: 10.1109/ASMC.2002.1001631

D. Yao, C. Blouin, M. Cavanaugh, G. Boldman, B. Alvarez, S. Miraglia, L. Hungerford

引用次数: 0

A MEMS-based, high-sensitivity pressure sensor for ultraclean semiconductor applications 一种基于mems的高灵敏度压力传感器，用于超清洁半导体应用

半导体技术 Pub Date : 2002-08-07 DOI: 10.1109/ASMC.2002.1001596

A. Henning, N. Mourlas, S. Metz, A. Zias

引用次数: 6

Direct wafer temperature measurements for etch chamber diagnostics and process control 直接晶圆温度测量蚀刻室诊断和过程控制

半导体技术 Pub Date : 2002-08-07 DOI: 10.1109/ASMC.2002.1001589

Mei H. Sun, C. Gabriel

{"title":"Direct wafer temperature measurements for etch chamber diagnostics and process control","authors":"Mei H. Sun, C. Gabriel","doi":"10.1109/ASMC.2002.1001589","DOIUrl":"https://doi.org/10.1109/ASMC.2002.1001589","url":null,"abstract":"It is well known that wafer temperature has significant impact on plasma etching performance. Instability of (peak) wafer temperatures during process can be linked to such issues as post-metal etch residues, undercut or sloping sidewall profiles and inconsistent photoresist selectivity. Direct wafer temperature measurements can yield valuable diagnostic information. This information can be used to characterize the process as well as to improve process control. This paper presents two direct wafer measurement techniques which when used in combination can be powerful tools for chamber diagnostics, tool to tool matching, as well as process control in a production environment. Real time, in situ wafer temperature measurement using a thermal optical system is used to understand the effect of process parameters such as backside He cooling, RF power and gas flows on wafer temperature and temperature uniformity. This data is then correlated to measurements from a novel technique employing arrays of peak temperature indicators mounted on a single-use-instrumented wafer. The latter technique is ideal for quick chamber qualifications and day to day process control while the former can be used for more detailed chamber diagnostics and analysis of the thermal cycle during the etch process.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87642901","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Transporting FOUPs as a driver for ESD-induced EMI 传输foup作为esd诱导EMI的驱动器

半导体技术 Pub Date : 2002-08-07 DOI: 10.1109/ASMC.2002.1001620

L. Levit, J. Montoya

引用次数: 0

Yield learning and the sources of profitability in semiconductor manufacturing and process development 在半导体制造和工艺开发方面的产量学习和利润来源

半导体技术 Pub Date : 2002-08-07 DOI: 10.1109/ASMC.2002.1001627

C. Weber

引用次数: 30

Automated residual metal inspection 自动残余金属检测

半导体技术 Pub Date : 2002-07-11 DOI: 10.1117/12.475643

R. Tiwari, J. Strupp, P. Terala, D. Shoham

{"title":"Automated residual metal inspection","authors":"R. Tiwari, J. Strupp, P. Terala, D. Shoham","doi":"10.1117/12.475643","DOIUrl":"https://doi.org/10.1117/12.475643","url":null,"abstract":"Residual metal inspection is an integral part of CMP manufacturing processes. This can be accomplished by adapting the existing YE inspection tools or microscopes. The use of Front Opening Unified Pod (FOUP) to house the wafers in 300 mm manufacturing offers unique challenges for wafer handling which necessitates the use of automated inspection procedures. These automated inspection procedures must not impede the flow of production material while achieving 100% inspection, and also have increased reliability compared to the existing inspection technologies. Ideally, these inspection procedures should be integrated into a feedback loop for further processing control. In this study, an existing particle monitoring technology for both bare and patterned wafers has been adapted for residual metal inspection. This is a new and unique application for post-metal CMP residue metal detection, which replaces the microscope visual inspection process. This technique uses a previously scanned 'golden wafer' to create the inspection recipe for a given pattern density and metal thickness, which is used to inspect other similarly processed product. This technique can be integrated to a CMP process tool, which can lead to significant reduction in cycle time and improved inspection efficiency.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2002-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74415841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Trace gas analysis by diode laser cavity ring-down spectroscopy 二极管激光腔衰荡光谱分析痕量气体

半导体技术 Pub Date : 2002-04-18 DOI: 10.1117/12.462654

Wen-Bin Yan, C. Krusen, J. Dudek, K. Lehmann, P. Rabinowitz

引用次数: 5

13th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference. Advancing the Science and Technology of Semiconductor Manufacturing. ASMC 2002 (Cat. No.02CH37259) 第13届IEEE/SEMI先进半导体制造年会。推进半导体制造科学技术。ASMC 2002 (Cat。No.02CH37259)

半导体技术 Pub Date : 2002-01-01 DOI: 10.1109/ASMC.2002.1001562

引用次数: 1

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