2008 International Conference on Electronic Packaging Technology & High Density Packaging最新文献_第7页

Introduction of Microelectronics Manufacturing Engineering into professional education: a joint effort among industry, government and universities 将微电子制造工程引入专业教育:工业界、政府和大学的共同努力

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606961

K. Pan, Daoguo Yang, Qiao Kai, Kouchi Zhang, L. Yang

引用次数: 5

Synthesis of high purity o-cresol novolac epoxy resins 高纯度邻甲酚环氧树脂的合成

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607062

Xiao-Wei Tian, Zhenguo Yang, Jiang-yan Sun, Zheng Ji

引用次数: 3

Preparation of polysulfoneamide electrospinning nanofibers 聚砜酰胺静电纺丝纳米纤维的制备

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607092

Li Liu, Yinggang Shi, Qinghua Jiao, Yanan Wu, Zhikun Zhang, J. Liu

引用次数: 1

Microstructure and properties of barium strontium titanate thin films prepared on copper foils via addition of PEG to the sol precursor 溶胶前驱体中加入聚乙二醇制备钛酸锶钡薄膜的微观结构和性能

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607059

Yanhua Fan, Shuhui Yu, R. Sun, Lei Li, Mian Huang, Yan-sheng Yin, L. Wan

引用次数: 3

Research on the contact resistance and reliability of flexible RFID tag inlays packaged by anisotropic conductive paste 各向异性导电浆料封装柔性RFID标签嵌体的接触电阻及可靠性研究

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606959

Xiong-hui Cai, B. An, Yi-Ping Wu, Feng-shun Wu, Xiao-wei Lai

{"title":"Research on the contact resistance and reliability of flexible RFID tag inlays packaged by anisotropic conductive paste","authors":"Xiong-hui Cai, B. An, Yi-Ping Wu, Feng-shun Wu, Xiao-wei Lai","doi":"10.1109/ICEPT.2008.4606959","DOIUrl":"https://doi.org/10.1109/ICEPT.2008.4606959","url":null,"abstract":"In this work, ACA was prepared by mixing micro-sized spherical Ag particles and latent curing agent into thermo-set epoxy resin, and RFID flip chips were assembled on the Al/PET, printed Ag/PET and printed Ag/paper antennae through hot-press bonding process. The contact resistance and shear bonding strength before and after the reliability tests (hot humidity test, 85degC, RH 85%), and degradation mechanism of ACA interconnection for flip-chip-on-flex (FCOF) assembly were studied using modified RFIC and the three kinds of antennae mentioned above. It was found that the contact resistance changed after the reliability test, it was caused by the total results of oxidation of Al/PET antennae and conductive particles, mismatch of coefficient of thermal expansion (CTE) between the ACA adhesive, antennae and flip-chips and post curing of resin. And the bonding strength also affect by the further curing of paste, strain release accumulated in resin and the microstructure change caused by moisture absorption during the reliability test. It was concluded that it was benefit to improve the reliability of FCOF assembly packaged by ACA by introducing the post curing process. And it was suggested that selecting the anti-oxidation conductor and the anti-heat substrate of antennae could decrease the shift of contact resistance, which was especially favored for ultra-high frequency RFID tag. Therefore, the printed Ag/paper antenna was preferred to large scale, cheap and rapid manufacturing RFID tags.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"97 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81324849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Improvement of power integrity with novel segmented power bus structures in RF/digital SOP 射频/数字SOP中采用新型分段电源总线结构提高电源完整性

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606977

Jun Li, L. Wan, Wei Gao, C. Liao

引用次数: 3

Combinational test generation for transition faults in acyclic sequential circuits 非循环顺序电路中过渡故障的组合测试生成

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607015

Shi Hui, Ran Feng, Zhang Jinyi

引用次数: 0

FEA based reliability prediction for different Sn-based solders subjected to fast shear and fatigue loadings 基于有限元分析的不同锡基焊料在快速剪切和疲劳载荷作用下的可靠性预测

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606962

R. Dudek, E. Kaulfersch, S. Rzepka, M. Rollig, B. Michel

{"title":"FEA based reliability prediction for different Sn-based solders subjected to fast shear and fatigue loadings","authors":"R. Dudek, E. Kaulfersch, S. Rzepka, M. Rollig, B. Michel","doi":"10.1109/ICEPT.2008.4606962","DOIUrl":"https://doi.org/10.1109/ICEPT.2008.4606962","url":null,"abstract":"Recent studies revealed that there is no simple ldquodrop inrdquo solution for the lead-free replacement of SnPb joints, instead different Sn-based solders are advantageous for different use conditions, which can be dominated either by drop loading or by thermal cyclic loading in harsh use conditions. By way of high-speed shear testing reliability assessments of components during drop and shock events can be studied in a simplified manner. Dynamic 3-D finite element simulations have been performed applying explicit FEA to replicate the shear tests virtually. It was shown in this way that SAC 1305 solder outperformed SAC 387 solder. The low cycle fatigue behavior of different SAC alloys is additionally of interest. Fatigue life predictions require both the constitutive description of the lead-free solders and a fatigue hypothesis linked to the material selected. Based on recently measured creep properties the solder joint creep strain and creep dissipation responses were analyzed for several components and thermal cycling conditions. The results based upon non-linear finite element calculations indicate different trends for creep strain and energy dissipation: while the first is clearly increasing with lowered alloying Ag-content, the latter is almost stable and does only slightly vary. Furthermore, these trends are different for different test- and field cycling conditions as well as the different components studied.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"2 1","pages":"1-7"},"PeriodicalIF":0.0,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87187614","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

A study of thermal performance for the panel base package (PBP™) technology 面板基包(PBP™)技术的热性能研究

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606935

M. Yew, Chun-Fai Yu, M. Tsai, D. Hu, Wen-Kung Yang, K. Chiang

{"title":"A study of thermal performance for the panel base package (PBP™) technology","authors":"M. Yew, Chun-Fai Yu, M. Tsai, D. Hu, Wen-Kung Yang, K. Chiang","doi":"10.1109/ICEPT.2008.4606935","DOIUrl":"https://doi.org/10.1109/ICEPT.2008.4606935","url":null,"abstract":"A new panel base package (PBP) technology that was developed based on the concepts of the wafer level package (WLP) has been proposed in order to obtain the signal fan-out capability for the fine-pitched integrated circuit (IC). In the PBP, the chip is attached to a selected chip carrier, and the volume of IC devices is extended for the redistribution of the original die pads. In this study, the thermal performance of the PBP technology was investigated and discussed through three-dimensional finite element (FE) analysis. In order to compare the thermal performance between conventional WLP and the proposed PBP, the junction temperature of WLP was also recorded through the modified FE model. The results showed that due to the larger packaging size of the PBP structure, the added solder bumps can be used as thermal balls. Moreover, they can effectively reduce the packaging thermal resistance (from 55degC/W to 41degC/W). It is expected that thermal performance could be further improved by applying solder paste between the chip and chip carrier. The study likewise discussed the condition of forced convection and developed the PBP technology for high-density IC devices. In light of the results obtained from this study, we believe in our new PBB technologypsilas great potential for future applications.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"51 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87591303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

DPA tests on SiP device SiP设备上的DPA测试

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606953

Jin Ling, H. Jun, Han Li

引用次数: 0