DPA tests on SiP device

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4606953

Jin Ling, H. Jun, Han Li

引用次数: 0

Abstract

The reliability of multi-dice in package was studied in this paper; DPA tests were operated on qualified devices to distribute early failure from overstress failure. Then factorial experiments manipulated on early failure samples for failure analysis. Comparing the C-SAM images before and after a series reliability tests, the reliability of SiP devices was confirmed.

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SiP设备上的DPA测试

本文研究了多骰子封装的可靠性问题;在合格的设备上进行DPA试验，以分配超应力破坏引起的早期破坏。然后对早期失效样本进行析因实验，进行失效分析。通过一系列可靠性测试前后的C-SAM图像对比，验证了SiP器件的可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2008 International Conference on Electronic Packaging Technology & High Density Packaging

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