K. Pan, Daoguo Yang, Qiao Kai, Kouchi Zhang, L. Yang
{"title":"Introduction of Microelectronics Manufacturing Engineering into professional education: a joint effort among industry, government and universities","authors":"K. Pan, Daoguo Yang, Qiao Kai, Kouchi Zhang, L. Yang","doi":"10.1109/ICEPT.2008.4606961","DOIUrl":null,"url":null,"abstract":"In order to promote the professional education and meet the requirements for the well-qualified technicians of the microelectronics industry , the higher education division of the education ministry and Intel (China) jointly initiated and setup a new mode of higher professional education faculty training:ldquo2008 Microelectronics Manufacturing Engineering Faculty Training Camprdquo, of which the ldquoIntel-GUET Microelectronics Packaging & Assembly Technology Faculty Training Camprdquo was organized and implemented by Guilin University of Electronic Technology (GUET). The program includes three parts: basic theories and experiments, one weekpsilas industry visit & investigation, and one weekpsilas education reform discussion & forum. In this paper, the initiatives, curriculum structure, and hands-on training, etc. were presented. The activities and the achievements of this joint faculty training are summarized.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"23 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4606961","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
In order to promote the professional education and meet the requirements for the well-qualified technicians of the microelectronics industry , the higher education division of the education ministry and Intel (China) jointly initiated and setup a new mode of higher professional education faculty training:ldquo2008 Microelectronics Manufacturing Engineering Faculty Training Camprdquo, of which the ldquoIntel-GUET Microelectronics Packaging & Assembly Technology Faculty Training Camprdquo was organized and implemented by Guilin University of Electronic Technology (GUET). The program includes three parts: basic theories and experiments, one weekpsilas industry visit & investigation, and one weekpsilas education reform discussion & forum. In this paper, the initiatives, curriculum structure, and hands-on training, etc. were presented. The activities and the achievements of this joint faculty training are summarized.