IEEE Transactions on Electronics Packaging Manufacturing最新文献_第8页

Fabrication of Polymer Silver Conductor Using Inkjet Printing and Low Temperature Sintering Process 用喷墨打印和低温烧结工艺制备聚合物银导体

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-10-03 DOI: 10.1109/TEPM.2008.2004554

S. Wu, K. Yung, L.H. Xu, X. Ding

{"title":"Fabrication of Polymer Silver Conductor Using Inkjet Printing and Low Temperature Sintering Process","authors":"S. Wu, K. Yung, L.H. Xu, X. Ding","doi":"10.1109/TEPM.2008.2004554","DOIUrl":"https://doi.org/10.1109/TEPM.2008.2004554","url":null,"abstract":"In this paper, silver powders with a uniform particle size of 0.2-0.4 mum and an excellent dispersibility were applied to produce a conductive ink for the inkjet printing process. The thermal behaviors of silver particles sintered at different temperature were investigated through X-ray diffraction (XRD) patterns. It was found out that both the particle size and crystal grains increase during the surface diffusion and sintering process. A drop-on-demand (DOD) inkjet printing system was employed to print the conductor by using as-mentioned silver particles suspended in terpineol/polyketone (PK) system as conductive materials. The optimized value of WPK/Wsilver was 5%, corresponding to a resistivity of 2.0 muOmega ldr cm. It was revealed that an increase in the WPK/Wsilver ratio resulted in the increase in both the resistivity and adhesion strength of the conductor. The scanning electron microscopy (SEM) analysis based on the microstructures of silver conductor further illustrates that the densification of conductor and long-range interparticle connectivity ensure the silver conductor a low resistivity. The adhesiveness effect from PK resin enables the conductor a high adhesion strength.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"38 1","pages":"291-296"},"PeriodicalIF":0.0,"publicationDate":"2008-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90811659","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Selecting an E-Scrap Reverse Production System Design Considering Multicriteria and Uncertainty 考虑多准则和不确定性的电子废品逆向生产系统设计选择

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-10-01 DOI: 10.1109/TEPM.2008.2004572

Wen-Chih Chen, I-Hsuan Hong

引用次数: 3

In Situ Acoustic Temperature Measurement During Variable-Frequency Microwave Curing 变频微波固化过程中的原位声温测量

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-10-01 DOI: 10.1109/TEPM.2008.2004570

C. Davis, A. Dickherber, W. Hunt, G. May

引用次数: 2

Bed of Nails—100- $mu$m-Pitch Wafer-Level Interconnections Process 钉床- 100- μ - m-Pitch晶圆级互连工艺

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-10-01 DOI: 10.1109/TEPM.2008.2004500

S. Vempati, A. Tay, V. Kripesh, S. Yoon

{"title":"Bed of Nails—100- $mu$m-Pitch Wafer-Level Interconnections Process","authors":"S. Vempati, A. Tay, V. Kripesh, S. Yoon","doi":"10.1109/TEPM.2008.2004500","DOIUrl":"https://doi.org/10.1109/TEPM.2008.2004500","url":null,"abstract":"The rapid advances in integrated chip (IC) design and fabrication continue to challenge electronic packaging technology, in terms of fine pitch, high performance, low cost, and reliability. Demand for higher input/output (I/O) count per IC chip increases as the IC chip fabrication technology is continuously moving towards nano ICs with feature size less than 90 nm. As micro systems continue to move towards high speed and microminiaturization technologies, stringent electrical and mechanical properties are required. To meet the above requirements, chip-to-substrate interconnection technologies with less than 100-mum pitch are required. Currently, the coefficient of thermal expansion (CTE) mismatch between the Si chip and the substrate serves as the biggest bottleneck issue in conventional chip to substrate interconnections technology, which becomes even more critical as the pitch of the interconnects is reduces. Further, the assembly yield of such fine-pitch interconnections also serves as one of the biggest challenges. Bed-of-nails (BoN) interconnects show great potential in meeting some of these requirements for next-generation packaging. In the present study, BoN interconnects prepared by a novel process called copper column wafer-level packaging is presented. The BoN interconnect technology is being developed to meet fine pitch of 100 mum and high-density interconnections. These BoN interconnects are demonstrated by designing a test chip of 10times10mm2size with 3338 I/Os and fabricated using an optimized process. The board-level reliability tests performed under temperature cycling in the range of -40degC to 125degC show promising results.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"18 1","pages":"333-340"},"PeriodicalIF":0.0,"publicationDate":"2008-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79904511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Processing of Silvar for MIC Packaging Applications 用于MIC封装应用的银的加工

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-07-09 DOI: 10.1109/TEPM.2008.926287

E.R. Tagore, A. Upadhyaya, A. Pathak

{"title":"Processing of Silvar for MIC Packaging Applications","authors":"E.R. Tagore, A. Upadhyaya, A. Pathak","doi":"10.1109/TEPM.2008.926287","DOIUrl":"https://doi.org/10.1109/TEPM.2008.926287","url":null,"abstract":"Materials with high thermal conductivity and thermal expansion coefficient matching with that of GaAs are being used for packaging high-density microwave integrated circuits (MICs) due to their ability of faster heat dissipation. Powder metallurgy (P/M) has emerged as a promising technique for the processing of metal matrix composites (MMCs) in satellite applications such as thermal management materials. Individual components in these composites must retain their metallurgical identity. The present study investigates the processing of silvar (Fe-Ni-Co-Ag) alloys for thermal management materials. For these silvar alloys, composition was varied by varying the silver content from 15 to 35 wt.%. The compacts were pressed at 400 and 600 MPa and sintered/infiltrated at 1100degC, 1150degC,and 1225degC. Quantitative metallographic measurements were performed on all sample and the results were discussed. It was observed that all samples were sintered without any shape distortion. Microstructural evaluation reveals that higher compaction pressure resulted in highly contiguous structure. In spite of density differences between constituents, none of the alloys showed segregation. Coefficient of thermal expansion (CTE) values of the liquid phase sintered composites is near to the values obtained by rule of mixtures.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"143 1","pages":"260-265"},"PeriodicalIF":0.0,"publicationDate":"2008-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80249403","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies 射频/微波BGA组件热循环失效检测

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-07-09 DOI: 10.1109/TEPM.2008.926289

J. Putaala, T. Kangasvieri, O. Nousiainen, H. Jantunen, M. Moilanen

{"title":"Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies","authors":"J. Putaala, T. Kangasvieri, O. Nousiainen, H. Jantunen, M. Moilanen","doi":"10.1109/TEPM.2008.926289","DOIUrl":"https://doi.org/10.1109/TEPM.2008.926289","url":null,"abstract":"The purpose of this paper was to investigate the effect of thermal cycling on the high-frequency behavior of ball grid array (BGA) interconnection structures. In order to characterize the applicability of RF measurements in predicting interconnection breakdown, a broadband BGA transition structure between a radio frequency printed wiring board (RF-PWB) and a ceramic module was fabricated. In addition to basic assemblies consisting of two BGA transitions between the module and substrate, the designed transition was applied in a passband filter module to demonstrate the effect of thermal cycling on the performance of a practical device, as well. The BGA test modules mounted on the PWBs were exposed to thermal cycling testing over a temperature range of -40degC to + 125degC. To detect interconnection failures induced by cyclic thermal stresses, both dc resistance and scattering parameter measurements were performed on the test assemblies at specific intervals. Parallel to the electrical measurements, crack propagation in the vicinity of the BGA transition structure was investigated using scanning acoustic microscopy (SAM). Moreover, scanning electron microscopy (SEM) was used to determine the failure mechanisms of the test assemblies. Degradation of the signal transmission characteristics of the basic assemblies was first observed at higher microwave frequencies as an increase in signal return loss (|S11|) and/or a change in its phase. The effect of TCT on the filter assembly was more constant and clearer to observe in the phase than in the magnitude of S11 in the passband. The dc resistance measurements showed no indication of degradation in any of the tested assemblies.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"20 1","pages":"240-247"},"PeriodicalIF":0.0,"publicationDate":"2008-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81491041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 26

Dynamic Characteristics of a New Jetting Dispenser Driven by Piezostack Actuator 压电堆驱动的新型喷射点胶机动态特性研究

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-07-09 DOI: 10.1109/TEPM.2008.926292

Q. Nguyen, Young-Min Han, Seung-bok Choi, S. Hong

引用次数: 26

Drop-on-Demand Solder Droplet Jetting System for Fabricating Microstructure 用于微结构制造的按需焊点喷射系统

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-07-09 DOI: 10.1109/TEPM.2008.926285

Taik-Min Lee, T. Kang, Jeong-Soon Yang, Jeongdai Jo, Kwangyoung Kim, B. Choi, Dong-Soo Kim

{"title":"Drop-on-Demand Solder Droplet Jetting System for Fabricating Microstructure","authors":"Taik-Min Lee, T. Kang, Jeong-Soon Yang, Jeongdai Jo, Kwangyoung Kim, B. Choi, Dong-Soo Kim","doi":"10.1109/TEPM.2008.926285","DOIUrl":"https://doi.org/10.1109/TEPM.2008.926285","url":null,"abstract":"The novel drop-on-demand (DOD) solder droplet jetting system, which can be characterized as the non-heat affection of the piezoelectric actuator, the control mechanism of the piston head-to-nozzle distance, and disposable nozzle parts, is devised. This system consists of the piezoelectric actuator, insulator, piston head-to-nozzle distance control apparatus, pressure control unit, and furnace. For the modulation of the droplet size, the distance from piston head-to-nozzle exit can be controlled by using the piston head-to-nozzle distance control apparatus. The working temperature is improved by locating the piezoelectric actuator outside of the furnace and by inserting the insulation block between the print head and the actuator. From a practical point of view, the DOD solder droplet jetting system has a simple structure for easily interchangeable nozzle parts. We derived the equation of the ejected droplet volume as a function of design parameters and operating conditions. The prototype of the DOD solder droplet jetting system was fabricated and the performance was verified. The diameter, volume and velocity of the ejected solder droplet are around 65-150 mum, 140 pl-1.8 nl, and 2.8-4 m/s, respectively. We also experimented with the effect of varying the chamber pressure, piston head-to-nozzle distance, and operating frequency on the ejected droplet diameter and velocity. The high aspect ratio vertical columns and inclined columns were fabricated by using the DOD solder droplet jetting system.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"16 1","pages":"202-210"},"PeriodicalIF":0.0,"publicationDate":"2008-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85433828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 71

Design and Evaluation of Bioepoxy-Flax Composites for Printed Circuit Boards 印制电路板用生物环氧-亚麻复合材料的设计与评价

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-07-09 DOI: 10.1109/TEPM.2008.926273

J. Lincoln, A. Shapiro, J. Earthman, J. Saphores, O. Ogunseitan

{"title":"Design and Evaluation of Bioepoxy-Flax Composites for Printed Circuit Boards","authors":"J. Lincoln, A. Shapiro, J. Earthman, J. Saphores, O. Ogunseitan","doi":"10.1109/TEPM.2008.926273","DOIUrl":"https://doi.org/10.1109/TEPM.2008.926273","url":null,"abstract":"Printed circuit boards (PCBs) pose considerable occupational health risks during manufacturing and are a potential source of toxic hazards if improperly disposed at the end of their useful life. Indeed, base materials in current PCBs include epoxy resins, fiberglass, and brominated flame retardants. To improve the environmental performance of PCB manufacturing and disposal, we developed composite designs using a thermosetting matrix based on epoxidized linseed oil, melamine polyphosphate for flame retardance, and woven flax fiber for reinforcement. Analyses of our prototypes using IPC 4101A/24 specification for thick PCB laminates gave acceptable results for thermal, mechanical, and electrical properties, except for wet conditioning or water submersion. To improve moisture resistance, we treated flax fibers with sodium hydroxide and octadecyltrichlorosilane. We find that the improved bioepoxy-flax PCB design is a viable alternative to current PCBs; it has potentially lower environmental impacts, it is cheaper, and it has satisfactory thermal, electrical, and mechanical properties. However, additional improvements in moisture absorption properties may remain needed for commercial applications.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"7 1","pages":"211-220"},"PeriodicalIF":0.0,"publicationDate":"2008-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89808254","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 32

Combined Parameter and Tolerance Design for Quality via Computer Experiment: A Design for Thermoelectric Microactuator 计算机实验质量参数与公差组合设计——热电微动器的设计

IEEE Transactions on Electronics Packaging Manufacturing Pub Date : 2008-07-09 DOI: 10.1109/TEPM.2008.926286

A. Jeang

{"title":"Combined Parameter and Tolerance Design for Quality via Computer Experiment: A Design for Thermoelectric Microactuator","authors":"A. Jeang","doi":"10.1109/TEPM.2008.926286","DOIUrl":"https://doi.org/10.1109/TEPM.2008.926286","url":null,"abstract":"A thermoelectric microactuator is examined with a computer experimental approach based on the asymmetrical thermal expansion of the microstructure with two beams of different widths. Because a typical U-shaped lateral thermoelectric actuator is used, the remaining concerns are the associated parameters and tolerance values that need to be determined. Conventional approaches consider that parameter and tolerance variables are two unconnected controllable variables, with the condition that the analytical functions representing the design of interest are known. A belief that the two variables are unconnected, usually fails to find truly optimal solutions, particularly a belief that the design functions are nonlinear in a complicated design. Assuming that design functions are normally known is a mistake in most cases, especially in the early stage of design. In this regard, a simultaneous parameter and tolerance design accompanying the computer experiment is developed to ensure that true optimization is achieved. The computer experimental approach consists of both a computer simulation and a statistical method. In this paper, the computer simulation is performed with existing computer-aided engineering (CAE) software, and ANSYS, the finite-element method for the solution of coupled 3-D mechanical problems. The statistical method is one of a design experimental approach such as response surface methodology (RSM). The response value is the conformation rate used in measuring product quality for uncertain conditions. This approach provides designers not only with optimal parameter and tolerance values, but also with the importance ranking for the controllable variables of a product. This is particularly important for the evolutionary design processes in an uncertain environment.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"60 1","pages":"192-201"},"PeriodicalIF":0.0,"publicationDate":"2008-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84248026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15