IEEE Transactions on Electronics Packaging Manufacturing最新文献

{"title":"Study of Temperature Parameter in Au–Ag Wire Bonding","authors":"Zhili Long, Lei Han, Yunxin Wu, J. Zhong","doi":"10.1109/TEPM.2008.926278","DOIUrl":"https://doi.org/10.1109/TEPM.2008.926278","url":null,"abstract":"The effect of the temperature on bondability and bonding process for wire bonding are investigated. Bondability is characterized by shear bonding strength and bonding process is represented by input and output power of ultrasonic transducer. A laser Doppler vibrometer and Labview software were used to record the velocity, voltage and current of transducer at different temperature settings. A K-type thermocouple sensor was used to measure the bonding temperature. Experimental results show that unsuccessful bonding happens at low temperature, and over bonding appears if the temperature is too high. Only when the temperature is at appropriate settings, can a stable and satisfied bondability be attained. The reason for this experimental observation is analyzed. By using a high resolution transmission electron microscope, the atom diffusion depth of Au-Ag bonding interface was measured and the result is about 200 nm. By using joint time-frequency analysis, the instantaneous characteristics of bonding process were observed completely and clearly. It is found that input and output ultrasonic power vs. time-frequency in a bonding process, including resonance frequency, harmonic components and amplitude of ultrasonic energy, vary along with the change of temperature settings.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"84 1","pages":"221-226"},"PeriodicalIF":0.0,"publicationDate":"2008-07-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75139311","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests","authors":"Jie-Hua Zhao, J. Tellkamp, V. Gupta, D. Edwards","doi":"10.1109/ITHERM.2008.4544335","DOIUrl":"https://doi.org/10.1109/ITHERM.2008.4544335","url":null,"abstract":"Silicon wafers and dies are made of single crystalline material in semiconductor applications which must withstand high stresses within electronic packages. The apparent mechanical strength of single-crystalline Si depends on process induced defects. Mechanical bending tests are the simplest way to obtain the strength of Si dies and wafers and have been used for many years throughout the industry. Some of the bending tests, such as the 3-point-bend (3PB) test, provide a convoluted contribution from both the defects on die surface (caused by backgrinding and mishandling) and defects on die edges (caused by sawing or dicing). However, the ball-on-ring (BOR) test provides a way to single out the contribution of backside grinding defects to the die strength. This paper compares the results of both 3PB and BOR tests on a number of backgrinding and dicing processes. The die strength of the 3PB test is consistently less than that of the BOR test due to the fact that the edge defects are under tension for 3PB tests but not for BOR. It is demonstrated that the BOR test is a good method for backgrinding process optimization. Due to the intrinsic scattering nature of the strength data, a Weibull-based probabilistic mechanics approach is the method of choice to present the data.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"40 1","pages":"248-255"},"PeriodicalIF":0.0,"publicationDate":"2008-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81372016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Time–Frequency and Autoregressive Techniques for Prognostication of Shock-Impact Reliability of Implantable Biological Electronic Systems","authors":"P. Lall, Prashant Gupta, M. Kulkarni, J. Hofmeister","doi":"10.1109/TEPM.2010.2078824","DOIUrl":"https://doi.org/10.1109/TEPM.2010.2078824","url":null,"abstract":"In this paper, autoregressive and time-frequency-based techniques have been investigated to predict and monitor the damage in implantable biological electronics such as pacemakers and defibrillators. The approach focuses is on the pre-failure space and methodologies for quantification of failure in electronic equipment subjected to shock and vibration loads using the dynamic response of the electronic equipment. Presented methodologies are applicable at the system-level for identification of impending failures to trigger repair or replacement significantly prior to failure. Leading indicators of shock-damage have been developed to correlate with the damage initiation and progression in under variety of stresses in electronic systems. The approach is based on monitoring critical solder interconnects, and sensing the change in test-signal characteristics prior to failure, in addition to monitoring the transient strain characteristics optically using digital image correlation and strain gages. Previously, SPR based on wavelet packet energy decomposition and the Mahalanobis distance approach have been studied by the authors for quantification of shock damage in electronic assemblies (\"Solder-joint reliability in electronics under shock and vibration using explicit finite element sub-modeling,\" P. Lall, et al. Proc. 56th ECTC, May-Jun. 2006, pp. 428-435, \"Life prediction and damage equivalency for shock survivability of electronic components,\" P. Lall, et al. Proc. ITherm, May-Jun., 2006, pp. 804-816). In this paper, Autoregressive (AR), wavelet packet energy decomposition, and time-frequency (TFA) techniques have been investigated for system identification, condition monitoring, and fault detection and diagnosis in implantable biological electronic systems. One of the main advantages of the AR technique is that it is primarily a signal-based technique. Reduced reliance on system analysis helps avoid errors which otherwise may render the process of fault detection and diagnosis quite complex and dependent on the skills of the analyst. Results of the present study show that the AR and TFA-based health monitoring techniques are feasible for fault detection and damage-assessment in electronic units. Explicit finite-element models have been developed and various kinds of failure modes have been simulated such as solder ball cracking, package falloff, and solder ball failure.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"36 1","pages":"289-302"},"PeriodicalIF":0.0,"publicationDate":"2008-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78024126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration","authors":"P. Lall, D. Iyengar, S. Shantaram, R. Pandher, D. Panchagade","doi":"10.1109/TEPM.2009.2031873","DOIUrl":"https://doi.org/10.1109/TEPM.2009.2031873","url":null,"abstract":"In this paper, a design-envelope approach based on optical feature extraction techniques has been investigated for drop and shock survivability of electronic packaging has been presented for 6-lead-free solder alloy systems. Solder alloy systems investigated include, Sn1Ag0.5Cu, Sn3Ag0.5Cu, Sn0.3Ag0.7Cu, Sn0.3Ag0.7Cu0.1Bi, Sn0.2Ag0.7Cu0.1Bi-0.1Ni, 96.5Sn 3.5Ag. Previously, digital image correlation (DIC) has been used for measurement of thermally induced deformation and material-characterization. In this paper, DIC has been used for transient dynamic measurements, and optical feature extraction. Board assemblies have been subjected to shock-impact in various orientations including the JEDEC zero-degree drop and the vertical free-drop. Transient deformation has been measured using both digital image correlation and the strain gages. Measurements have been taken on both the package and the board side of the assemblies. Accuracy of high-speed optical measurement has been compared with that from discrete strain gages. Package architectures examined include-flex ball-grid arrays, tape-array ball-grid arrays, and metal lead-frame packages. Explicit finite-element models have been developed and correlated with experimental data. Models developed include, smeared property models, and Timoshenko-beam models. The potential of damage identification and tracking for various solder alloys has been investigated. Data on identification of damage proxies for competing failure mechanisms at the copper-to-solder, solder-to-printed circuit board, and copper-to-package substrate has been presented. Design envelopes have been developed based on statistical pattern recognition. The design-envelope is intended for component integration to ensure survivability in shock and vibration environments at a user-specified confidence level.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"20 1","pages":"311-324"},"PeriodicalIF":0.0,"publicationDate":"2008-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87458167","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Laser Micromachining of Barium Titanate $({hbox {BaTiO}}_{3})$-Epoxy Nanocomposite-Based Flexible/Rollable Capacitors: New Approach for Making Library of Capacitors","authors":"R. Das, F. Egitto, J. Lauffer, V. Markovich","doi":"10.1109/TEPM.2008.919337","DOIUrl":"https://doi.org/10.1109/TEPM.2008.919337","url":null,"abstract":"This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposite thin films. In particular, recent developments on high-capacitance, large-area, thin, flexible, embedded capacitors are highlighted. A variety of barium titanate (BaTiO3)-epoxy polymer nanocomposite-based flexible/rollable thin films ranging from 2 to 25 mum thick were processed on large-area substrates (330 mm times 470 mm, or 495 mm times 607 mm) by liquid coating processes. The electrical performance of composites was characterized by dielectric constant (Dk), capacitance, and dissipation factor (loss) measurements. Nanocomposites provided high capacitance density (10-100 nF/in2) and low loss (0.02-0.04) at 1 MHz. Scanning electron microscopy (SEM) micrographs showed uniform particle distribution in the coatings. Uniform mixing of nanoparticles in the epoxy matrix results in high dielectric (> 3 times 107 V/m) and mechanical strengths (> 3700 PSI). Reliability of the capacitor was ascertained by thermal cycling. Capacitance change was less than 5% after baking at 140degC for 4 h, and 1100 cycles from -55degC to 125degC (deep thermal cycle). A frequency-tripled Nd:YAG laser operating at a wavelength of 355 nm was used for the micromachining study. The micromachining was used to generate arrays of variable-thickness capacitors from the nanocomposites. The resultant thickness of the capacitors depends on the number of laser pulses applied.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"309 1","pages":"97-103"},"PeriodicalIF":0.0,"publicationDate":"2008-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TEPM.2008.919337","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72391933","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Modeling of Unsteady Laminar Flow Based on Steady Solution in Jetting Dispensing Process","authors":"Q. Nguyen, Seung-bok Choi","doi":"10.1109/TEPM.2008.919348","DOIUrl":"https://doi.org/10.1109/TEPM.2008.919348","url":null,"abstract":"This paper proposes a new approach to model unsteady laminar flows of dispenser systems in the semiconductor packaging industry. The approach is based on the exact steady solution. After an overview of dispensing technology and historical modeling of the unsteady flows, a new modeling approach of the unsteady laminar flow in a circular pipe and annular duct is developed. From the proposed model, the modeling results of unsteady flow in an arbitrary circular pipe and annular duct are obtained and compared with the spectral solution. In addition, a comparative work between the proposed analytical dynamic model and the finite-element model is undertaken in order to demonstrate the effectiveness of the proposed modeling methodology.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"9 1","pages":"134-142"},"PeriodicalIF":0.0,"publicationDate":"2008-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75227485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An X-Ray Imaging-Based Layer Alignment and Tape Deformation Inspection System for Multilayer Ceramic Circuit Boards","authors":"T. Tick, H. Jantunen","doi":"10.1109/TEPM.2008.919330","DOIUrl":"https://doi.org/10.1109/TEPM.2008.919330","url":null,"abstract":"Advances in conductor patterning and via preparation techniques have facilitated a continuous increase in the circuit packaging density of ceramic multilayer substrates. A decrease in feature size combined with the trend toward constantly increasing the processed panel size is placing extremely high demands for layer-to-layer alignment as well as ceramic green tape stability. This paper describes the main mechanisms contributing to layer-to-layer alignment errors in the ceramic tape alignment and stacking process and introduces a simple, nondestructive, X-ray imaging-based method for measuring alignment error in a ceramic multilayer substrate. A low-temperature cofired ceramic (LTCC) test panel was manufactured and analyzed using the introduced X-ray inspection method. In order to define the error caused by tape alignment and stacking as well as tape deformation, the alignment error between the layers was calculated over the whole panel area. The specific area of an LTCC panel that meets the required alignment tolerances can be identified from the calculated results.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"69 1","pages":"168-173"},"PeriodicalIF":0.0,"publicationDate":"2008-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74622103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Modified Face-Down Bonding of Ridge-Waveguide Lasers Using Hard Solder","authors":"J. Teo, X. Shi, S. Yuan, G.Y. Li, Z. Wang","doi":"10.1109/TEPM.2008.919329","DOIUrl":"https://doi.org/10.1109/TEPM.2008.919329","url":null,"abstract":"A modified face-down bonding technique of ridge-waveguide laser diodes (LDs) using 80Au20Sn solder has been performed. For ease of manufacturability, a bonding window with good bonding integrity and improved optical performance was determined. Metallographical investigation showed that the solder joint comprised of a layer of delta phase compound near the solder/heatsink interface, a layer of (Au,Ni)Sn intermetallic compound (IMC) at the solder/heatsink interface, and zeta' phase Au/Sn compound at the center of the solder joint. The delta phase shifted to the interfaces after reflow was postulated by its lower surface tension than zeta' phase Au/Sn compound. Good bonding integrity was observed with LD residues still adhering onto the bond pad after die shear testing. Scanning electron microscopy (SEM)/energy dispersive X-ray (EDX) analyses of the fracture surface showed that the fracture occurred within the LD, at the GaAs/SiN interface. LDs bonded with this modified bonding process achieved an optical improvement of 2.5-3X compared to the unbonded LDs due to its good thermal management. These bonded LDs further exhibited good long-term reliability with no significant degradation in optical performance and no significant microstructure evolution in the solder joint after 500 thermal cycling test.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"2 1","pages":"159-167"},"PeriodicalIF":0.0,"publicationDate":"2008-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88359960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Neural Network Control of Variable-Frequency Microwave Processing of Polymer Dielectric Curing","authors":"Cleon E. Davis, Gary S. May","doi":"10.1109/TEPM.2008.919345","DOIUrl":"https://doi.org/10.1109/TEPM.2008.919345","url":null,"abstract":"Variable-frequency microwave (VFM) curing can perform the same processing steps as conventional thermal processing in minutes, without compromising intrinsic material properties. With increasing demand for novel dielectrics, there is a corresponding demand for new processing techniques that lead to comparable or better properties than conventional methods. VFM processing could be a viable alternative to conventional thermal techniques. However, current limitations include uncertain process characterization methods, a lack of reliable temperature measuring techniques, and limited control methodologies. This research focuses on the development of a neural network controller for curing low-k polymer dielectrics on silicon wafers in a VFM furnace. The neural network controller exhibits temperature set point control with percent error of 7% when compared with the target trajectory.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"59 1","pages":"104-113"},"PeriodicalIF":0.0,"publicationDate":"2008-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87097835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Wide-Bandwidth Coaxial PWB Transmission Line Probe","authors":"N. Paulter, R. Palm, D. Barry","doi":"10.1109/TEPM.2008.919354","DOIUrl":"https://doi.org/10.1109/TEPM.2008.919354","url":null,"abstract":"The design, fabrication, and test of a wide-bandwidth (3-dB attenuation bandwidth ges 30 GHz), 50 Omega, passive coaxial probe for the electrical characterization of printed wiring board (PWB) transmission lines is described. The probe can make thousands of repeated contacts, using spring-loaded interconnects, without affecting probe performance. The probe contains an internal mechanism for dissipating static charge on the signal line of the PWB transmission line and is long enough (approximately 10 cm) to act as a transfer standard for characteristic impedance testing, as per the time-domain reflectometry test method described in IPC TM 2.5.5.7.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"22 1","pages":"150-158"},"PeriodicalIF":0.0,"publicationDate":"2008-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81795673","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}