{"title":"Photonics West 2026","authors":"Rachel Won","doi":"10.1038/s44287-026-00285-8","DOIUrl":"10.1038/s44287-026-00285-8","url":null,"abstract":"Photonics West 2026 highlighted how photonics research and innovations rapidly translate into commercial technologies, aligning with SPIE’s vision of photonics as a driver of economic opportunity.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 4","pages":"209-209"},"PeriodicalIF":0.0,"publicationDate":"2026-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147686398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Han Li, Dong Wang, Mingqing Zuo, Xiaodong Duan, Dechao Zhang, Shan Cao, Yuqian Zhang, Jiachen Li, Jiang Sun, Dawei Ge
{"title":"Making long-haul large-capacity 400G optical network a reality","authors":"Han Li, Dong Wang, Mingqing Zuo, Xiaodong Duan, Dechao Zhang, Shan Cao, Yuqian Zhang, Jiachen Li, Jiang Sun, Dawei Ge","doi":"10.1038/s44287-026-00278-7","DOIUrl":"10.1038/s44287-026-00278-7","url":null,"abstract":"Coherent 400G technology can enhance the capacity and reduce the power consumption per bit in long-haul optical networks with transmission distances of over 1,500 km. Advances in optical components, chips and optical-layer infrastructure will enable 1,500 km transmission with about 0.08 nJ b−1 efficiency per optical module, allowing optical fibre networks to become a backbone of everyday communications. In this Review, we describe the key technologies necessary for long-haul large-capacity 400G optical transmission. First, we determine that the quadrature phase-shift keying format is appropriate to implement such an optical network. Accordingly, optical components, chips and optical-layer infrastructure are required to support 130 GBd symbol rate and 12-THz-wide optical bandwidth. Next, we summarize the benchmarking experimental demonstrations of long-haul large-capacity optical transmission with coherent 400G signals. Finally, we outline the remaining challenges such as unified C + L-band optics and provide guidance for future researchers to bring higher-bandwidth and longer-range communications beyond 400G to telecom networks. Long-haul large-capacity 400G optical transmission over 1,500 km is possible through advanced fibre-optic systems. This Review provides a holistic view of the signal modulation, spectrum plans, optical components and optical-layer infrastructure necessary to achieve those networks.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 4","pages":"226-237"},"PeriodicalIF":0.0,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147686419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Sustainable glass-based data storage","authors":"Miranda L. Vinay","doi":"10.1038/s44287-026-00286-7","DOIUrl":"10.1038/s44287-026-00286-7","url":null,"abstract":"Microsoft Research has developed a long-term data storage technique using borosilicate glass that leverages phase modifications to achieve unprecedented write speeds for glasslaser storage. They suggest data integrity for a lifetime of 10,000 years.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 4","pages":"210-210"},"PeriodicalIF":0.0,"publicationDate":"2026-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147686417","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Challenges and opportunities of metalenses","authors":"Rong Lin, Junxiao Zhou, Chen Chen, Din Ping Tsai","doi":"10.1038/s44287-026-00276-9","DOIUrl":"10.1038/s44287-026-00276-9","url":null,"abstract":"Metalenses are poised to redefine optical design, but their path from laboratory innovation to real-world application remains fraught with both remarkable promise and persistent challenge. Enabled by subwavelength nanostructures, these flat optical components promise to revolutionize photonics by replacing bulky conventional optics with compact, multifunctional devices. However, persistent trade-offs among numerical aperture, focusing efficiency, spectral bandwidth, field of view and device size continue to constrain their versatility. Overcoming these bottlenecks will rely on the convergence of design innovation, material breakthroughs and scalable manufacturing. Recent advances in large-area nanofabrication, high-aspect-ratio patterning and advanced material integration are beginning to alleviate these limitations, signalling a path toward scalable, high-performance and multifunctional metalenses. As advances in nanofabrication and design accelerate worldwide, stronger synergy between academic research and industrial development has become essential to transform current challenges into opportunities for the widespread adoption of metalenses in real-world optical systems. Metalenses face both remarkable opportunities and challenges as they evolve from laboratory prototypes to practical devices. This Review highlights how advances in advanced materials, scalable manufacturing and academic–industrial synergy can transform these challenges into opportunities for the widespread implementation of metalens technologies.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 4","pages":"214-225"},"PeriodicalIF":0.0,"publicationDate":"2026-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147686421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ravi V. Mahajan, William Chen, Patrick Thompson, Wilmer Bottoms, Amr S. Helmy, Benson Chan, Madhavan Swaminathan, John Shalf, Christopher Bailey, Jose Schutt-Aine, Ganesh Subbarayan, Timothy Lee, Subramanian S. Iyer, Sreekant Narumanchi, Rajiv Mongia
{"title":"The heterogeneous integration of electronic components","authors":"Ravi V. Mahajan, William Chen, Patrick Thompson, Wilmer Bottoms, Amr S. Helmy, Benson Chan, Madhavan Swaminathan, John Shalf, Christopher Bailey, Jose Schutt-Aine, Ganesh Subbarayan, Timothy Lee, Subramanian S. Iyer, Sreekant Narumanchi, Rajiv Mongia","doi":"10.1038/s44287-026-00270-1","DOIUrl":"10.1038/s44287-026-00270-1","url":null,"abstract":"Heterogeneous integration (HI) of electronics components is broadly recognized as a powerful and crucial enabler for the continued growth of computing and communication. From 2010 onwards, the value of HI is increasingly visible in the advanced packaging used in artificial intelligence, high-performance computing, smartphones and communications product implementations. In this Perspective, we argue that HI is crucial to semiconductors and more broadly to the continued evolution of computing and communications. We use leading-edge advanced packaging examples to represent the value, advancements and opportunities for HI. To succeed, it is critical to develop comprehensive HI roadmaps that inform collaborations across the design, manufacturing and reliability spectrum between systems architects, packaging and semiconductor technologists to common goals. Although this article does not provide a full roadmap, we instead detail additional parameters for artificial intelligence, smartphone and other cellular communication devices, and their constituent building blocks including interconnects, power electronics, photonics, thermal management, reliability, modelling and co-design, to foster greater collaboration opportunities among academia, research laboratories and industry. Heterogeneous integration is essential to advances in artificial intelligence, high-performance computing and mobile technologies. This Perspective outlines the emerging technology and challenges necessary to revise the technology roadmap to shape the future evolution of semiconductor systems and computing architectures.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 4","pages":"254-263"},"PeriodicalIF":0.0,"publicationDate":"2026-03-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147686416","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Flying cars from design to commercialization","authors":"Xinyu Zhang, Huaping Liu","doi":"10.1038/s44287-026-00282-x","DOIUrl":"10.1038/s44287-026-00282-x","url":null,"abstract":"Flying cars integrate ground-vehicle mobility with aircraft capabilities, making them candidates for deployment in the low-altitude economy and emergency rescue. We have advanced three enabling technologies — morphology design, multi-modal fusion perception, and active safety — across four generations of flying-car platforms.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 6","pages":"335-336"},"PeriodicalIF":34.8,"publicationDate":"2026-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"148262038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"The 10th International Topical Meeting on Nanophotonics and Metamaterials (NANOMETA 2026)","authors":"Rachel Won","doi":"10.1038/s44287-026-00280-z","DOIUrl":"10.1038/s44287-026-00280-z","url":null,"abstract":"NANOMETA 2026 revealed that the frontiers of nanophotonics and metamaterials are advancing faster than ever, driven by bold ideas and a deepening understanding of how light and information intertwine.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 4","pages":"208-208"},"PeriodicalIF":0.0,"publicationDate":"2026-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147686397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Sustainable electronics for a sustainable future","authors":"","doi":"10.1038/s44287-026-00277-8","DOIUrl":"10.1038/s44287-026-00277-8","url":null,"abstract":"Sustainable electronics must pair high performance with markedly lower energy consumption, material waste and environmental impact across the full lifecycle of electronic systems. Sustainable electronics must achieve high performance while dramatically cutting energy consumption, material waste and environmental impact across the entire lifecycle of electronic systems.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 3","pages":"135-136"},"PeriodicalIF":0.0,"publicationDate":"2026-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.nature.comhttps://www.nature.com/articles/s44287-026-00277-8.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147570496","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Junliang Ye, Yuxi Zhao, Yue Yu, Yuting Li, Xiaohu Ge, Hamid Gharavi, Yang Yang, Wuxiong Zhang
{"title":"Artificial intelligence for low-carbon energy and information networks","authors":"Junliang Ye, Yuxi Zhao, Yue Yu, Yuting Li, Xiaohu Ge, Hamid Gharavi, Yang Yang, Wuxiong Zhang","doi":"10.1038/s44287-026-00271-0","DOIUrl":"10.1038/s44287-026-00271-0","url":null,"abstract":"Achieving low-carbon energy and information networks requires coordination between variable renewable energy supply and fluctuating traffic demand. Artificial intelligence (AI) systems offer tools both to optimize networks and to coordinate between them. Yet AI systems generate substantial carbon emissions — from model training, deployment and use, and the hardware life cycle — creating a paradox in which the solution contributes to the problem. This Review analyses the dual role of AI systems. We examine AI applications in energy supply networks and information networks, the capabilities required for supply–demand coordination, and the carbon emissions of AI systems themselves. Achieving low-carbon AI systems has become a central challenge to ensure that their environmental benefits outweigh their costs. Looking forward, we outline three research directions: low-carbon AI goals, energy-efficient large models, and AI-driven life-cycle management. Furthermore, we call for policy frameworks and industry strategies to achieve low-carbon energy and information networks. This Review examines how artificial intelligence (AI) systems optimize energy and information networks independently, then coordinate renewable energy supply with traffic demand across both. This Review also assesses the carbon emissions of AI systems from their training, deployment and use, and hardware life cycle, outlining strategies to ensure the environmental benefits of AI systems outweigh their costs.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 4","pages":"238-253"},"PeriodicalIF":0.0,"publicationDate":"2026-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147686420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Laili Wang (, ), Fengtao Yang (, ), Yunqing Pei (, ), Xu Yang (, ), Leo Lorenz
{"title":"Packaging and integration of silicon carbide power devices","authors":"Laili Wang \u0000 (, ), Fengtao Yang \u0000 (, ), Yunqing Pei \u0000 (, ), Xu Yang \u0000 (, ), Leo Lorenz","doi":"10.1038/s44287-026-00263-0","DOIUrl":"10.1038/s44287-026-00263-0","url":null,"abstract":"Silicon carbide (SiC) power devices have the potential to transform conversion systems of power electronics. However, conventional packaging and integration technologies — originally developed for silicon power devices — cannot fully address three key challenges in SiC applications: material limitations for high-temperature and high-voltage operation, electromagnetic interactions from high-speed switching and increased heat flux density from smaller die areas compared with silicon devices. In this Review, we outline how the material-level advantages of SiC translate into device-level and system-level benefits and examine solutions to the above three challenges. We review emerging packaging materials for high-temperature and high-voltage applications, packaging technologies that address electromagnetic interactions and thermal management and electro-thermal co-design strategies that jointly optimize electrical and thermal performance. Looking ahead, we set out two development trends: cost-sensitive applications that prioritize miniaturized modular units and performance-driven applications that leverage high-temperature and high-voltage capabilities for system miniaturization. Silicon carbide power devices offer advantages over silicon, but realizing these advantages requires tailored packaging and integration strategies. This Review examines packaging materials, packaging technologies and electro-thermal co-design strategies that address the challenges of high-speed switching, concentrated heat flux and high-temperature and high-voltage operation.","PeriodicalId":501701,"journal":{"name":"Nature Reviews Electrical Engineering","volume":"3 3","pages":"157-172"},"PeriodicalIF":0.0,"publicationDate":"2026-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147570497","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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