2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)最新文献_第6页

Contact resistance of Sn-film and Sn-bulk investigated by microscopic analysis 用显微分析方法研究了锡膜和锡体的接触电阻

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355125

A. Omura, M. Fukuta, K. Miyake, T. Kondo, M. Onuma

引用次数: 2

Forensic analysis of thermally stressed crimp connections 热应力卷曲连接的法医分析

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355117

David M. Williams, Michael E. Range, V. Pascucci, Justin T. Savrock

引用次数: 4

Nickel-free option for electrical contact plating stack using a nano-crystalline silver alloy 无镍选择电接触镀堆栈使用纳米结晶银合金

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355126

Zheng Zhou, George Eichman, T. Martin, T. Goodrich, Kathy Bui, T. Hasanali, J. Cahalen

{"title":"Nickel-free option for electrical contact plating stack using a nano-crystalline silver alloy","authors":"Zheng Zhou, George Eichman, T. Martin, T. Goodrich, Kathy Bui, T. Hasanali, J. Cahalen","doi":"10.1109/HOLM.2015.7355126","DOIUrl":"https://doi.org/10.1109/HOLM.2015.7355126","url":null,"abstract":"There is an increased interest in eliminating nickel from all wearable/personal electronics surfaces to prevent contact dermatitis and other allergic reactions caused by nickel. This paper presents a new metal finish for contact surfaces based on a unique nano-crystalline silver alloy (NCSA) that eliminates the need for a nickel barrier layer. The performance of the NCSA-based finish is evaluated using standard industry qualification tests commonly associated with high reliability electronic connectors, including durability, mixed flowing gas, neutral salt spray, heat & humidity, and immersion corrosion. Preliminary results show that the NCSA stack, without the use of a nickel barrier layer, can provide equivalent or better durability and corrosion resistance when compared to an industry standard gold/nickel-sulfamate stack, while also acting as a diffusion barrier for Cu thus preserving its electrical performance as a final finish. In contrast with traditional silver coatings, the NCSA is thermally stable, maintaining its nano-crystalline grain structure and durability performance. The new NCSA stack contact finish shows positive performance in this initial testing suite, and represents a promising new nickel-free option for wearable electronic device electrical contact surfaces.","PeriodicalId":448541,"journal":{"name":"2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130483915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Research on the dynamic calculation model for a dc solenoid electromagnetic contactor and its contact characteristics in break process 直流螺线管电磁接触器的动态计算模型及其分断过程中的接触特性研究

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355096

You Jiaxin, Liang Huimin, Ma Guangcheng, Chen Shuqing, Cai Zhaowen

引用次数: 4

Electrical breakdown voltage in micro- and submicrometer contact gaps (100nm - 10µm) in air and nitrogen 空气和氮气中微米和亚微米接触间隙(100nm - 10 μ m)的击穿电压

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355110

A. Peschot, C. Poulain, N. Bonifaci, O. Lesaint

{"title":"Electrical breakdown voltage in micro- and submicrometer contact gaps (100nm - 10µm) in air and nitrogen","authors":"A. Peschot, C. Poulain, N. Bonifaci, O. Lesaint","doi":"10.1109/HOLM.2015.7355110","DOIUrl":"https://doi.org/10.1109/HOLM.2015.7355110","url":null,"abstract":"In this paper, we present the results of electrical breakdown experiments performed in a contact gap ranging from 100nm to 10μm under air and nitrogen environment. The electrodes arrangement corresponds to a point-plane system and consists in a probe tip with a radius of curvature of 20μm and a perfectly flat electrode. A high precision piezoelectric actuator provides to the system a static resolution of ±30nm allowing to investigate submicrometer contact gaps. Numerous experiments have been performed at those distances (<;1μm), a range rarely explored in the literature so far. The results highlight the presence of a pre-disruptive current and the deviation to the Paschen's law. Two breakdown mechanisms can be identified. Above 4μm, the breakdown voltage values are in good agreement with the so called “Paschen's law” (electrical breakdown vs contact gap × pressure). From 1μm to 4μm, the value of the breakdown voltage corresponds to the Paschen's minimum. This plateau can be explained by the fact that the breakdown does not occur at the minimum distance but when the pressure/distance couple corresponds to the Paschen's curve minimum. Below 1μm, a completely different behavior is observed as the breakdown occurs according to a constant electric field of 350V/μm. Emission spectroscopy highlights the presence of a metal plasma that could explain such a breakdown in the micro-gap.","PeriodicalId":448541,"journal":{"name":"2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129482043","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

Power contact arc suppression An investigation into the relative effectiveness of snubbers vs. an engineered electronic power contact arc suppressor 电源接触灭弧器与工程电子电源接触灭弧器的相对有效性研究

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355098

Reinhold Henke, Robert P. Thorbus

引用次数: 1

Basic investigations on joints with cylindrical aluminum conductors made by press- and shrink-fit for high-current devices 大电流器件用压缩配合圆柱形铝导体接头的基本研究

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355114

Alexander Ramonat, Stephan Schlegel, S. Grossmann, M. Kudoke

{"title":"Basic investigations on joints with cylindrical aluminum conductors made by press- and shrink-fit for high-current devices","authors":"Alexander Ramonat, Stephan Schlegel, S. Grossmann, M. Kudoke","doi":"10.1109/HOLM.2015.7355114","DOIUrl":"https://doi.org/10.1109/HOLM.2015.7355114","url":null,"abstract":"Electrical joints with cylindrical aluminum conductors are often used in Gas Insulated Switchgears (GIS) and Gas Insulated Lines (GIL). Separable connections have to be used for dealing with relative movement between the conductor and the encapsulation initiated by thermal expansion on one end of the conductor. On the other end of the conductor permanent connections can be used with the intention to reduce the costs and operating power losses. Therefore, technologies like the press- and the shrink-fit are suitable. In order to use those technologies for electrical joints proper joining parameters have to be determined from baseline investigations and the long-term behavior of the joints has to be investigated. This paper presents and compares these two joining technologies, press- and shrink-fit. Joints are made with both technologies and the influence of different parameters like surface properties and forms on the joint resistance are being investigated. The behavior of the joint resistance over time is determined from oven-experiments at a temperature of 105 °C. Furthermore a comparison between the cylindrical contacting of the shrink-fit and the flat contacting like it can be found at bus bar joints is made with focus on the contact resistance.","PeriodicalId":448541,"journal":{"name":"2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134545951","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Finite element modeling of nickel oxide film for Au-Ni contact of MEMS switches MEMS开关金镍触点氧化镍膜的有限元建模

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355108

Hong Liu, D. Leray, S. Colin, P. Pons

{"title":"Finite element modeling of nickel oxide film for Au-Ni contact of MEMS switches","authors":"Hong Liu, D. Leray, S. Colin, P. Pons","doi":"10.1109/HOLM.2015.7355108","DOIUrl":"https://doi.org/10.1109/HOLM.2015.7355108","url":null,"abstract":"Contamination and oxidation are inevitable in contact surfaces, especially for micro contact under low load (μN-mN). They are considered as major causes for a high contact resistance, and can lead to the failure of a contact. However, as the film formation is a complex phenomenon, it is difficult to accurately observe and characterize the film properties. In this paper, a finite element model of nickel oxide film is developed for Au-Ni contact of MEMS switches. Considering the fact that the electrical contact area is only a portion of the mechanical contact area, a so-called `nano-spots' model is developed: multiple small conductive spots are scattered on a large mechanical contact asperity, and ultrathin oxide film is located around the nano-spots. The sizes of the electrical spots and the mechanical asperity are deduced from the measured electrical resistance and a mechanical contact modeling, respectively. The simulations results show a good agreement with the experimental results. This model allows us to determine some possible geometrical configurations of contact surfaces that lead to the measured contact resistance in real devices.","PeriodicalId":448541,"journal":{"name":"2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133042135","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Micro-contact performance and reliability under low frequency, low amplitude, alternating current (AC) test conditions 在低频、低幅值、交流(AC)试验条件下的微接触性能和可靠性

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355101

T. Laurvick, R. Coutu

{"title":"Micro-contact performance and reliability under low frequency, low amplitude, alternating current (AC) test conditions","authors":"T. Laurvick, R. Coutu","doi":"10.1109/HOLM.2015.7355101","DOIUrl":"https://doi.org/10.1109/HOLM.2015.7355101","url":null,"abstract":"This paper presents an experimental investigation of micro-contact performance (i.e. contact resistance) and reliability (i.e. successful cycles) evaluated under time-varying, low frequency, low amplitude, alternating current (AC) test conditions. Previous research efforts have focused on either on direct current (DC) or high frequency, radio frequency (RF) test conditions. This works attempts to bridge the gap in prior work by generating knowledge related to frequency, phase, and amplitude effects on micron-sized electrical contacts. Contact support structures, micromachined with gold on gold micro-contacts, were actuated using an externally applied contact load of approximately 200 μN and tested in dry, nitrogen ambient environments to minimize pre-test contact surface contamination. Contact resistances measured were comparable to those obtained using a DC. However, reliability is drastically reduced with AC signals between 100 to 100 kHz. Device failure typically occurred prior to 10k cycles on devices proven to last beyond 100M cycles or more under DC conditions. Phase of the AC appeared to have some influence on the manner of failure, as did AC signals that persisted through contact opening. In all cases examined, noticeable physical damage in the form of material migration was observed using a scanning electron microscope.","PeriodicalId":448541,"journal":{"name":"2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)","volume":"402 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116389708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

The impact of coaxial connector failures on high frequency signal transmission 同轴连接器故障对高频信号传输的影响

2015 IEEE 61st Holm Conference on Electrical Contacts (Holm) Pub Date : 2015-10-01 DOI: 10.1109/HOLM.2015.7355112

Rui Ji, Jinchun Gao, G. Xie, G. Flowers, Qiuyan Jin

{"title":"The impact of coaxial connector failures on high frequency signal transmission","authors":"Rui Ji, Jinchun Gao, G. Xie, G. Flowers, Qiuyan Jin","doi":"10.1109/HOLM.2015.7355112","DOIUrl":"https://doi.org/10.1109/HOLM.2015.7355112","url":null,"abstract":"Connector failures may alter the signal that is being transmitted and is one of the major causes of low communication quality. Accordingly, a better understanding of the influence of contact degradation in communication connectors on transmitted signal integrity is of substantial value. In the present work, the effects of coaxial connector failure on the high frequency signal transmission were experimentally studied, modeled, and analyzed. A series of measurements were conducted to test impedance values and electrical performances (the voltage standing wave ratio and insertion loss) of the degraded connectors using an Impedance Analyzer and a Vector Network Analyzer. Based on transmission line theory and the measurement results, an impedance model of a connector with a degraded contact interface was developed and the associated parameters identified. It was found that when the connector initially degrades, it exhibits an inductive characteristic in the application frequency range. However, as the degradation increases to a serious degree, the connector will exhibit a more capacitance-like impedance. Accordingly, as the contact surface degrades, the impedance of the connector will change as will the associated effect on the performance of high frequency signal transmission as related to pollution induced corrosion.","PeriodicalId":448541,"journal":{"name":"2015 IEEE 61st Holm Conference on Electrical Contacts (Holm)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122670700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3