2011 IEEE International Symposium on Electromagnetic Compatibility最新文献

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25 Gbps backplane links frequency and time domain characterization - correlation study between test and full-wave 3D EM simulation 25gbps背板链路频率和时域表征-测试与全波三维电磁仿真之间的相关性研究
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038419
P. Amleshi, V. Shah, Zhiping Yang, J. Mohan, T. Mukherjee
{"title":"25 Gbps backplane links frequency and time domain characterization - correlation study between test and full-wave 3D EM simulation","authors":"P. Amleshi, V. Shah, Zhiping Yang, J. Mohan, T. Mukherjee","doi":"10.1109/ISEMC.2011.6038419","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038419","url":null,"abstract":"Designing backplane links at such high data rates requires the consideration of the interaction between active and passive components. The degree of interaction at 25 Gbps data rates requires a co-design approach with respect to active and passive blocks. In this paper, we start with modelling a 25 Gbps backplane channel in frequency domain and establish the correlation between results obtained from passive channel model and measurement. We further extend this analysis to establish correlation between chip test and chip-based simulation. In this study, we focus on the transmission performance of a 0.6-meter backplane channel operating at 25 Gbps, and expect similar performance in the presence of crosstalk with sufficiently isolated TX/RX grouping within the multi-lane backplane system.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115640640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Design and experimental verification of on-chip signal integrity analyzer (OSIA) scheme for eye diagram monitoring of a high-speed serial link 用于高速串行链路眼图监测的片上信号完整性分析仪(OSIA)方案的设计与实验验证
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038295
Minchul Shin, Myunghoi Kim, Kyoungchoul Koo, Sunkyu Kong, Joungho Kim
{"title":"Design and experimental verification of on-chip signal integrity analyzer (OSIA) scheme for eye diagram monitoring of a high-speed serial link","authors":"Minchul Shin, Myunghoi Kim, Kyoungchoul Koo, Sunkyu Kong, Joungho Kim","doi":"10.1109/ISEMC.2011.6038295","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038295","url":null,"abstract":"Recently, bandwidth of data channel has increased with the development of high-performance electronic system. The method used to characterize the channel is important for successful channel design. However, conventional methods have several disadvantages to characterize the whole high-speed serial link including on-chip and package channel. In this paper, we design and experimental verification of on-chip signal integrity analyzer (OSIA) scheme for high-speed data transmission. The designed OSIA circuit can be an effective method to determine the eye diagram of an inside package channel and on-chip I/O channel because it is located at the front of a receiver circuit. The test chip for the OSIA is fabricated by a standard 0.18-μm CMOS process. The performance of the proposed OSIA is verified be measuring the eye diagram of a chip-package-board hierarchical channel with 10 ps and with 10-mV resolution. It is successfully demonstrated to monitor the eye diagram distortion affected by variation of data rate and channel loss.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128315080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Reverberation chambers: Full 3D FDTD simulations and measurements of independent positions of the stirrers 混响室:全三维时域有限差分模拟和测量的独立位置的搅拌器
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038314
F. Moglie, V. M. Primiani
{"title":"Reverberation chambers: Full 3D FDTD simulations and measurements of independent positions of the stirrers","authors":"F. Moglie, V. M. Primiani","doi":"10.1109/ISEMC.2011.6038314","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038314","url":null,"abstract":"This paper describes the developing and the testing of our FDTD code to simulate the whole reverberation chamber. In order to reduce computer load some approximations were introduced, and we validated the results with the experimental ones measured in our reverberation chamber. Simulated and measured results were compared using the same statistical software. In addition, the computations easily provide other results that cannot be obtained by measurements like the ones that regard field distribution inside the cavity. The developed FDTD code is able to simulate the statistical properties of an RC as function of its dimensions and stirrer geometry. Many numerical techniques haves been proposed to simulate reverberation chambers. Every method requires very large computer resources if a full 3D simulation is done. The developed FDTD code is able to simulate different geometries and movements of the stirrer(s) allowing the designer to obtain the best configuration using the simulator, and saving time for experimental tests. Simulations integrate experimental measurements when long measurement time or destructive tests are required.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131581914","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 26
EMI noise reduction between planes due to a signal via with a ground via at various distances 由于在不同距离上有一个与地通孔的信号通孔,可以降低平面之间的电磁干扰噪声
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038304
A. Jaze, B. Archambeault, S. Connor
{"title":"EMI noise reduction between planes due to a signal via with a ground via at various distances","authors":"A. Jaze, B. Archambeault, S. Connor","doi":"10.1109/ISEMC.2011.6038304","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038304","url":null,"abstract":"This study investigates the behavior of EMI noise reduction through a simple 2-layered printed circuit board cavity, as a ground (GND) via is placed in proximity of a signal (SIG) via. Provided that the maximum frequency of the signal's harmonic content is known, an algorithm which predicts the maximum distance at which the GND via placement will effectively provide noise reduction has been developed. This could be used as a design guideline for PCB designers.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115883208","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Detect VR noise coupling sources through near field scanning 通过近场扫描检测虚拟现实噪声耦合源
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038408
X. Ye, A. Luoh
{"title":"Detect VR noise coupling sources through near field scanning","authors":"X. Ye, A. Luoh","doi":"10.1109/ISEMC.2011.6038408","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038408","url":null,"abstract":"This paper uses near field scanning (NFS) techniques to detect noise coupling sources due to switching voltage-regulators (VR) in a typical computer system. The fast switching of the VR FETs couples significant amounts of noise to signal lines in proximity, resulting in degraded signal performance, system malfunction, etc. Detecting all the potential noise sources has been a challenging task due to the complexity of VR design and the layout of the board. The near field scanning technique is utilized as a brute-force measurement-based method to identify and verify potential noise sources. Applications of the techniques are reported in the paper, where noise sources are revealed and design changes are made to mitigate the noise coupling issue.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"120 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116574012","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Modeling of common mode currents induced by motor cable in converter fed AC motor drives 变频器交流电机驱动中电动机电缆感应共模电流的建模
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038355
J. Luszcz
{"title":"Modeling of common mode currents induced by motor cable in converter fed AC motor drives","authors":"J. Luszcz","doi":"10.1109/ISEMC.2011.6038355","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038355","url":null,"abstract":"Investigation of conducted EMI generation in AC motor fed by pulse width modulated frequency converters requires to consider parasitic capacitances in converters, motor windings and feeding cables to be taken into account. Motor voltage transients and related common mode currents are significantly correlated with resonance effects occurring in load circuits. An analysis of frequency converter load impedance-frequency characteristics allows for identification and determination of frequency ranges in which the foremost contributions to EMI noise generation have the voltage ringing phenomena associated with the load parasitic capacitances. This paper presents a method to model an AC motor with a feeding cable in conducted EMI frequency range up to 30 MHz. Distributed parasitic capacitances of AC motor windings are modeled by a ladder circuit. The proposed circuit model allows for an analysis of the influence of motor feeding cable parameters on common mode currents generated in AC motor drive system, particularly in AC motor itself. The simulation results obtained based on the proposed ladder circuit model are verified by the experimental tests which have been carried out for an exemplary adjustable speed AC motor drive application.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"183 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116875605","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 31
Multiport VNA measurement uncertainty - Signal integrity applications 多端口VNA测量不确定度。信号完整性应用
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038385
B. Grossman, Michael Peterson, J. Torres
{"title":"Multiport VNA measurement uncertainty - Signal integrity applications","authors":"B. Grossman, Michael Peterson, J. Torres","doi":"10.1109/ISEMC.2011.6038385","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038385","url":null,"abstract":"Vector network analyzer (VNA) measurements are often stated without an indication of the estimated uncertainty. Understanding the uncertainty can lead to understanding the sources of uncertainty and targeting improvements in the metrology to address the largest sources. Connector repeatability in manually probed measurements can be a primary source of uncertainty with this metrology. A measurement capability assessment provides the method for evaluating the total uncertainty. Evaluation of the probe launch and cable movement provided substantial opportunities to improve the capability. Implementing improvements identified through the measurement capability assessment (MCA) process has resulted in a doubling of the highest frequency where the metrology is deemed capable.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115518994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A novel characterization method of the radiation emission for electromagnetic compatibility 一种新的电磁兼容辐射发射表征方法
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038321
Ping Li, Lijun Jiang
{"title":"A novel characterization method of the radiation emission for electromagnetic compatibility","authors":"Ping Li, Lijun Jiang","doi":"10.1109/ISEMC.2011.6038321","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038321","url":null,"abstract":"Conventionally the radiation emissions from PCB boards, electronic devices and antennas were characterized through the near field (NF) - far field (FF) transformation to find the equivalent sources. In this paper, a new methodology without NF-FF transformation is presented. Based on the uniqueness theorem, it only employs the measured tangential field over a spherical surface to rigorously characterize the outward radiation emission. The dyadic Green's function for the perfect magnetic conductor (PMC) sphere is derived using spherical wave functions. Based on this dyadic Green's function and integral equations, the NF-FF transformation is not necessary any more. To facilitate feasible near field measurements, only the tangential magnetic field is needed. As the proof of the concept, the radiations of Hertzian dipoles are analyzed. This approach can be directly used to characterize the radiation from PCBs and antennas.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122670546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Comparison between three-antenna method and equivalent capacitance substitution method for calibrating electrically short monopole antenna 三天线法与等效电容替代法标定电短单极天线的比较
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038292
M. Ishii, S. Kurokawa, Y. Shimada
{"title":"Comparison between three-antenna method and equivalent capacitance substitution method for calibrating electrically short monopole antenna","authors":"M. Ishii, S. Kurokawa, Y. Shimada","doi":"10.1109/ISEMC.2011.6038292","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038292","url":null,"abstract":"In low-frequency bands, monopole antennas are generally used for measuring the electromagnetic interference (EMI) and estimating the electric field strength. The antenna factor is an important and widely studied characteristic. Thus far, there have been a number of measurement methods proposed for electrically short monopole antennas. A case in point is the equivalent capacitance substitution method, which is commonly used for monopole antenna measurements. On the other hand, we have proposed a near-field three-antenna method for electrically short monopole antennas. These two absolute measurement methods are of quite different origins. In light of this fact, a comparison is made between the two measurement methods by means of experiments and simulations, and the difference observed between the antenna factors is discussed.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122507529","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Managing engineers for success 管理工程师取得成功
2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI: 10.1109/ISEMC.2011.6038451
S. Mee, J. Teune
{"title":"Managing engineers for success","authors":"S. Mee, J. Teune","doi":"10.1109/ISEMC.2011.6038451","DOIUrl":"https://doi.org/10.1109/ISEMC.2011.6038451","url":null,"abstract":"To be successful as a manager of engineers, there are three parties that should benefit: Employer, Engineer, and the Manager. Without all three, long term success may not be assured. While the advice given in this paper could apply to managing a wide range of personnel, the focus will be placed on engineering personnel. The authors have spent most of their career working in electromagnetic compatibility positions that include: EMC Test Engineer, EMC Design Engineer, Lead Engineer and Laboratory Manager Roles. Over 25 combined years spent managing technicians and engineers. Much of what is covered in this paper is lessons learned from working for various managers and our own success and failures as managers.","PeriodicalId":440959,"journal":{"name":"2011 IEEE International Symposium on Electromagnetic Compatibility","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126329720","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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