由于在不同距离上有一个与地通孔的信号通孔，可以降低平面之间的电磁干扰噪声

2011 IEEE International Symposium on Electromagnetic Compatibility Pub Date : 2011-10-10 DOI:10.1109/ISEMC.2011.6038304

A. Jaze, B. Archambeault, S. Connor

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引用次数: 5

摘要

本研究研究了通过简单的2层印刷电路板腔降低EMI噪声的行为，因为地(GND)通孔放置在信号(SIG)通孔附近。如果已知信号谐波含量的最大频率，则开发了一种算法，该算法可以预测通过放置GND将有效提供降噪的最大距离。这可以作为PCB设计师的设计指南。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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EMI noise reduction between planes due to a signal via with a ground via at various distances

This study investigates the behavior of EMI noise reduction through a simple 2-layered printed circuit board cavity, as a ground (GND) via is placed in proximity of a signal (SIG) via. Provided that the maximum frequency of the signal's harmonic content is known, an algorithm which predicts the maximum distance at which the GND via placement will effectively provide noise reduction has been developed. This could be used as a design guideline for PCB designers.

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2011 IEEE International Symposium on Electromagnetic Compatibility

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