{"title":"Improved design methodology for a 2 GHz class-E hybrid power amplifier using packaged GaN-HEMTs","authors":"J. Flucke, C. Meliani, F. Schnieder, W. Heinrich","doi":"10.1109/EMICC.2007.4412794","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412794","url":null,"abstract":"This paper reports on design methodology and realization of a class-E power amplifier (PA) for 2 GHz using a packaged GaN-HEMT. The circuit achieves 36 dBm output power and 57% PAE, with drain efficiency as high as 62%. In addition to the large-signal simulation considerations, we discuss particularly the problem of input matching of the amplifier under class-E operation.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122132385","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A high linearity mixed signal down converter IC for C-band radar receivers","authors":"H. Berg, H. Thiesies, M. Hertz, F. Norling","doi":"10.1109/EMICC.2007.4412697","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412697","url":null,"abstract":"A mixed signal receiver IC for C-band radars is presented. The design work has been focused on spectral purity and miniaturization. Miniaturization is achieved by minimizing peripheral components and control signals using internal calibration data and temperature compensation tables stored in RAM on-chip. This allows for the packaged chip to be used with a minimum of. The chip is manufactured by Austria Microsystems in their 0.35 um SiGe-BiCMOS process and utilizes digital IP-block included in the design kit.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122321623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Transport shot noise models and NFmin comparison for SiGe HBTs under different operation configurations","authors":"Hui Li, Z. Ma, G. Niu","doi":"10.1109/EMICC.2007.4412684","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412684","url":null,"abstract":"Triggered by the recent discoveries on the superior high-frequency performance exhibited by the common-base (CB) SiGe HBTs over the common-emitter (CE) ones, noise characteristics of the CB SiGe HBT are investigated in this paper. Accurate RF shot noise models are derived for CB SiGe HBTs and used to calculate their minimum noise figure (NFmin). The NFmin of CB SiGe HBTs are then compared with that of the CE SiGe HBTs. Simplified noise models can be obtained for both CE and CB SiGe HBTs by ignoring the base resistance effects in order to obtain an explicit expression of the NFmin for both configurations. It is found, from applying the noise models into CE and CB SiGe HBTs, that the simplified noise model can provide the same noise figure as the improved model for CE SiGe HBTs, while different results were obtained for CB SiGe HBTs. The difference indicates the critical importance of including base resistance in modelling the noise characteristics of CB SiGe HBTs. Regardless of the difference of NFmin between CE and CB SiGe HBTs, CB SiGe HBTs also exhibit low NFmin while offering their potential higher associated power gain values for promising implementation in low-noise amplifiers.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132602105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A simplified, empirical large-signal model for SiC MESFETs","authors":"K. Yuk, G. Branner","doi":"10.1109/EMICC.2007.4412643","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412643","url":null,"abstract":"A new, simplified empirical large-signal model for high power microwave SiC MESFFTs is presented. A generalized drain current source equation is developed, allowing close predictions of both pulsed and static IV characteristics, which vary significantly due to current dispersion. Thv drain current source is based on pulsed IV measurements and accurately predicts the gm and gds without supplemental RF current source generators as typically used in other models. The model is shown to accurately predict the output and input reflected power over an available power range of +10dBm to +36dBm for three harmonics while maintaining the ability to compute the small-signal S-parameters.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126213457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
P. Blondy, A. Crunteanu, A. Pothier, P. Tristant, A. Catherinot, C. Champeaux
{"title":"Effects of atmosphere on the reliability of RF-MEMS capacitive switches","authors":"P. Blondy, A. Crunteanu, A. Pothier, P. Tristant, A. Catherinot, C. Champeaux","doi":"10.1109/EMICC.2007.4412771","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412771","url":null,"abstract":"The influence of atmosphere on capacitive RF-MEMS switches is studied. It is shown that ambient atmosphere not only induces an incremental effect on the degradation of MEMS switches but also completely changes the charging mechanism of the dielectrics, directly linked with RF-MEMS reliability behaviour of MEMS switches reliability. Operating RF-MEMS switches in a dry environment changes the mechanism of charging from surface charging to bulk charging.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125986681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
V. Di Giacomo, A. Santarelli, F. Filicori, A. Raffo, G. Vannini, R. Aubry, C. Gaquière
{"title":"Low-frequency dynamic drain current modeling in AlGaN-GaN HEMTs","authors":"V. Di Giacomo, A. Santarelli, F. Filicori, A. Raffo, G. Vannini, R. Aubry, C. Gaquière","doi":"10.1109/EMICC.2007.4412649","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412649","url":null,"abstract":"Low-frequency dispersive effects in AlGaN/GaN HEMTs are here modeled above their cutoff frequencies by adopting a modeling approach developed for GaAs PHEMTs. To this aim, a new identification procedure is proposed, which allows to obtain very accurate predictions of the pulsed drain currents, even in the presence of strong kink effects in the DC characteristics. In addition, a dedicated algorithm of data extrapolation is used, in order to make the model more computationally efficient.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122871439","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A 25 % bandwidth 8 W X-band HPA for radar applications","authors":"C. Costrini, M. Calori, C. Lanzieri, C. Proietti","doi":"10.1109/EMICC.2007.4412670","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412670","url":null,"abstract":"The development of a MMIC HPA designed for X-band radar applications is reported. The chip was fabricated with a low-cost 0.4 mum GaAs PHEMT process and is composed of two stages, with a final stage of 16 mm gate-width periphery. In the frequency bandwidth 8.5-11 GHz, the HPA delivers an output power of 8 W @ 3dB compression point, with an associated PAE of circa 30%.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115218193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Boulay, S. Touati, Y. Cordier, F. Semond, J. Massies
{"title":"AlGaN/GaN HEMTs on (001) oriented silicon substrate based on 100nm SiN recessed gate technology for low cost device fabrication","authors":"S. Boulay, S. Touati, Y. Cordier, F. Semond, J. Massies","doi":"10.1109/EMICC.2007.4412656","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412656","url":null,"abstract":"This paper shows the capability of AlGaN/GaN high electron mobility transistors (HEMTs) with 0.1 mum gamma shaped gate length on (001) oriented silicon substrate for microwave power applications. The gate technology is based on silicon nitride thin film and uses a digital etching to perform the recess through the SiN mask. Output current densities of 420 mA/mm, extrinsic cut-off frequencies (fT) of 28 GHz and maximum oscillations frequencies (fmax) of 46C Hz are measured on 300 mum gate periphery device. At 2.15 GK/., an output power density of 1 W/mm associated to a power added efficiency of 17% and a linear gain of 24 dB are achieved lit VDS = 30 V and VGS = -1.2 V.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114389227","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"10-Gb/s CMOS ultrahigh-speed gold-code generator using differential-switches feedback","authors":"C.‐L. Lu, H.-C. Wang, J. Juang, H. Chuang","doi":"10.1109/EMICC.2007.4412693","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412693","url":null,"abstract":"This paper proposes a new architecture for the implementation of an n-input XOR gate in ultrahigh-speed applications. The new circuitry makes it possible to let the conventional sequence logic with XOR feedback, such as Gold code generator, to work up to ten-gigabit per second. This paper will systematically describe the principle of substituting a set of differential switches for an XOR gate. The proposed circuitry is demonstrated in a five-stage Gold code generator implemented in TSMC 0.18-mum 1P6M CMOS process. The simulation results show that the delay of the proposed four-input XOR gate is so much improved as to let the five-stage (5,3) and (5,4,3,2) Gold code generator to work up to 10 Gb/s.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127316548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Kyoung-Min Kim, J. Yook, Sung-Ku Yeo, Young-Se Kwon
{"title":"Embedded IC technology for compact packaging inside aluminum substrate (pocket embedded packaging)","authors":"Kyoung-Min Kim, J. Yook, Sung-Ku Yeo, Young-Se Kwon","doi":"10.1109/EMICC.2007.4412715","DOIUrl":"https://doi.org/10.1109/EMICC.2007.4412715","url":null,"abstract":"Various technologies have been developed to package microwave systems to achieve low-cost, high-integration, better RF performance and good thermal dissipation. In this paper, we propose a new type packaging technology, \"pocket embedded packaging (PEP)\", using selectively anodized aluminum substrate. In this technology, chips can be embedded inside aluminum substrate so that ultra thin and compact type of package can be achieved. More than 120 mum thick aluminum oxide (Al2O3) is selectively anodized on an aluminum substrate with 5% oxalic acid electrolyte. This thick aluminum oxide (Al2O3) can be chemically etched with vertical side walls. Rectangular-shape of opening area, which we named \"pocket\" is easily formed inside aluminum substrate. After the formation of the pocket, active chips can be embedded inside it with a tolerance of less than 3 mum. Passive components on an aluminum oxide (Al2O3) are interconnected with active chips through metallic interconnections.","PeriodicalId":436391,"journal":{"name":"2007 European Microwave Integrated Circuit Conference","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2007-12-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131592958","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}