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2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)最新文献

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Human body impedance modelling for ESD simulations ESD仿真的人体阻抗建模
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2018-09-01 DOI: 10.23919/EOS/ESD.2018.8509795
I. Oganezova, D. Pommerenke, J. Zhou, K. Ghosh, A. Hosseinbeig, J. Lee, N. Tsitskishvili
{"title":"Human body impedance modelling for ESD simulations","authors":"I. Oganezova, D. Pommerenke, J. Zhou, K. Ghosh, A. Hosseinbeig, J. Lee, N. Tsitskishvili","doi":"10.23919/EOS/ESD.2018.8509795","DOIUrl":"https://doi.org/10.23919/EOS/ESD.2018.8509795","url":null,"abstract":"Motivated by understanding the ESD-induced currents from body-worn, wire and hose connected medical equipment is exposed to, a computer simulation is presented to estimate the impedance of a human body relative to ground. This 3D model is the basis for transient field calculation. A Method of Moments (MoM) frequency domain solution is transformed into time domain via IFFT for further circuit level time domain simulations. The human body is modeled as a homogeneous dielectric with frequency-dependent complex permittivity. Dependence of the impedance on the position of discharge and posture of the human body is investigated. The simulation results are compared with measurements and demonstrate capturing of general tendencies of measured curves.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121458383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Transmission line matrix method (TLM) 传输线矩阵法(TLM)
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495432
D. Johns
{"title":"Transmission line matrix method (TLM)","authors":"D. Johns","doi":"10.1109/EMCSI.2018.8495432","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495432","url":null,"abstract":"TLM Summary • Highly versatile full-wave 3D time-domain method • Uses scattering and connecting of voltage pulses in a mesh of transmission-lines to simulate EM fields • Conformal meshing improves accuracy, cell-lumping improves efficiency • Compact models may be used to capture important detail such as thin panels, apertures and wires • Wide range of applications including shielding, radiated emissions and susceptibility","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117158061","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Modeling fundamentals the importance of validation for all simulations 建模基础说明了验证对所有模拟的重要性
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495433
Scott Piper
{"title":"Modeling fundamentals the importance of validation for all simulations","authors":"Scott Piper","doi":"10.1109/EMCSI.2018.8495433","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495433","url":null,"abstract":"","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128111791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reproducibility of CISPR 25 alse test method CISPR 25假体试验方法的重复性
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2018-07-01 DOI: 10.1109/emcsi.2018.8495374
C. Carobbi, Danilo Izzo
{"title":"Reproducibility of CISPR 25 alse test method","authors":"C. Carobbi, Danilo Izzo","doi":"10.1109/emcsi.2018.8495374","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495374","url":null,"abstract":"The reproducibility of the Absorber Lined Shielded Enclosure (ALSE) radiated emission test method, defined in the standard CISPR 25, is evaluated through an interlaboratory comparison (ILC). The ILC started on September 2016 and concluded on February 2017. Nineteen data sets have been received. The investigated frequency range is from 1 MHz to 1000 MHz. The most critical (worst reproducibility) frequency range is the one from 10 MHz to 50 MHz where the robust (outlier-resistant) standard deviation of the measured values is comprised between 5 dB and 8 dB. In the frequency range from 50 MHz to 1000 MHz the robust standard deviation is comprised between 2 dB and 3 dB. The main causes of non-reproducibility are identified and test setup adjustments aimed at improving the reproducibility are proposed.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124236945","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Fundamentals of power integrity 电力诚信的基本原则
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2018-07-01 DOI: 10.1109/EMCSI.2018.8495347
Zhiping Yang
{"title":"Fundamentals of power integrity","authors":"Zhiping Yang","doi":"10.1109/EMCSI.2018.8495347","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495347","url":null,"abstract":"Content • Industry trend and power integrity challenges • Capacitor modeling • Power impedance measurement • Power decoupling strategy • Target impedance • On-die power integrity analysis• Package-level power integrity analysis• Die/Package/Board co-design methodology • SSO and SSI • Open topics and Q&A","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122721373","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Harmonic cancellation in a novel multilevel converter topology for the future smart grid 面向未来智能电网的新型多电平变换器拓扑谐波抵消
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2017-10-23 DOI: 10.1109/ISEMC.2017.8077939
N. Moonen, M. Gagic, F. Buesink, J. Ferreira, F. Leferink
{"title":"Harmonic cancellation in a novel multilevel converter topology for the future smart grid","authors":"N. Moonen, M. Gagic, F. Buesink, J. Ferreira, F. Leferink","doi":"10.1109/ISEMC.2017.8077939","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077939","url":null,"abstract":"Increased switching speed of semiconductors are reducing losses, but increasing emissions. EMC compliance becomes increasingly difficult in power electronics. A reactive attitude is unwanted, often due to the possible increased costs of solutions. Converter topologies that can inherently reduce emissions are preferred This paper demonstrates that harmonic cancellation is possible in a novel topology for DC/DC converter applications referred to as the Multi-frequency, Multi-level Modular converter (M3C). The emission spectrum dependency on control parameters is investigated numerically, while measurements on a M3C demonstrator are implemented to verify the occurrence of harmonic cancellation.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126562956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Source isolation measurements in a multi-source coupled system 多源耦合系统中的源隔离测量
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2017-10-20 DOI: 10.1109/ISEMC.2017.8077844
A. Patnaik, G. Shen, D. Pommerenke, M. Boettcher, Hermann L. Aichele, C. Keller, V. Khilkevich
{"title":"Source isolation measurements in a multi-source coupled system","authors":"A. Patnaik, G. Shen, D. Pommerenke, M. Boettcher, Hermann L. Aichele, C. Keller, V. Khilkevich","doi":"10.1109/ISEMC.2017.8077844","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077844","url":null,"abstract":"An electronic system will commonly have multiple emission (or noise) sources, some of which are correlated while others are un-correlated. Measuring the contribution to a node voltage or branch current by an individual source with high accuracy in such a multi source inter-coupled system is a fundamental problem. The problem is further amplified when the signal processing following the measurements is highly sensitive to the error in the measured parameters. This article describes a filtering method which can isolate the measured parameter (voltage or current) of the contribution of other such sources while preserving the phase and magnitude associated with the source under consideration.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128271088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
SI and EMI performance comparison of standard QSFP and flyover QSFP connectors for 56+ Gbps applications 56+ Gbps应用中标准QSFP和立交桥QSFP连接器的SI和EMI性能比较
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2017-10-20 DOI: 10.1109/ISEMC.2017.8077972
A. Talebzadeh, Kyoungchoul Koo, P. Vuppunutala, J. Nadolny, Angela Li, Qian Liu, P. Sochoux, D. Pommerenke, J. Drewniak
{"title":"SI and EMI performance comparison of standard QSFP and flyover QSFP connectors for 56+ Gbps applications","authors":"A. Talebzadeh, Kyoungchoul Koo, P. Vuppunutala, J. Nadolny, Angela Li, Qian Liu, P. Sochoux, D. Pommerenke, J. Drewniak","doi":"10.1109/ISEMC.2017.8077972","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077972","url":null,"abstract":"In this paper, signal integrity (SI) and EMI aspects of a novel Flyover Quad Small Form Factor Pluggable (Flyover QSFP) connector is compared to a traditional QSFP connector which are used in 28/56 Gb/s applications. The flyover technique can overcome the limitation of high insertion loss associated with standard surface mount QSFP connectors that use PCB Microstrip traces. In flyover QSFP, substituting 7.5 cm PCB traces with 15 cm twin-ax cables results in at least 7 dB insertion loss improvement at 40 GHz. To study the SI and EMI performances of FQSFP in comparison with standard QSFP, two test vehicles were designed, fabricated, and tested. The return loss, insertion loss, and total radiated power (TRP) of both standard QSFP and flyover QSFP connectors are obtained up to 40 GHz. Based on the results, it is shown that flyover QSFP interconnect exhibits better SI performance due to the lower loss in comparison to the standard QSFP. When the same power is applied to both connectors, similar TRP performance is measured at most of the frequencies with differential excitation.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130959036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Extending the validity of the time-domain contour integral method using the admittance-wall boundary condition 利用导纳-壁边界条件，扩展了时域轮廓积分法的有效性
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2017-08-01 DOI: 10.1109/ISEMC.2017.8077967
M. Štumpf
{"title":"Extending the validity of the time-domain contour integral method using the admittance-wall boundary condition","authors":"M. Štumpf","doi":"10.1109/ISEMC.2017.8077967","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077967","url":null,"abstract":"The admittance-wall boundary condition is incorporated in the time-domain contour integral method. It is shown that the inclusion of the radiating wall amounts to adding a single matrix in the resulting marching-on-in-time scheme. An illustrative numerical example demonstrates that even a simple instantaneously-reacting uniform edge admittance may improve the validity of results with respect to the standard formulation based on the (closed) cavity model.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115156733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Effect of relative humidity and materials on triboelectric charging of USB cables 相对湿度和材料对USB电缆摩擦充电的影响
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) Pub Date : 2017-08-01 DOI: 10.1109/ISEMC.2017.8077945
Hossein Rezaei, Li Guan, A. Talebzadeh, Shubhankar Marathe, Pengyu Wei, D. Pommerenke
{"title":"Effect of relative humidity and materials on triboelectric charging of USB cables","authors":"Hossein Rezaei, Li Guan, A. Talebzadeh, Shubhankar Marathe, Pengyu Wei, D. Pommerenke","doi":"10.1109/ISEMC.2017.8077945","DOIUrl":"https://doi.org/10.1109/ISEMC.2017.8077945","url":null,"abstract":"A USB cable can be triboelectrically charged by rubbing it against a piece of clothing, such as a sweater. If a charged cable is inserted into a connector, an ESD event can upset or damage attached equipment. To investigate charge levels and estimate the resulting voltages on a USB cable, a set of experiments has been performed in a climate chamber under five different environmental conditions. These experiments were conducted by rubbing 44 different cables against sweaters made of 100% cotton, 100% polyester, 50% wool/50% nylon, and 50% wool/50% acrylic. The resulting charge levels often reflected the material pairing, as expected from the triboelectric series. The maximum charge level reached −141 nC, or −7 kV, assuming a capacitance of 20 pF between the cable and ground.","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115348025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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