{"title":"传输线矩阵法(TLM)","authors":"D. Johns","doi":"10.1109/EMCSI.2018.8495432","DOIUrl":null,"url":null,"abstract":"TLM Summary • Highly versatile full-wave 3D time-domain method • Uses scattering and connecting of voltage pulses in a mesh of transmission-lines to simulate EM fields • Conformal meshing improves accuracy, cell-lumping improves efficiency • Compact models may be used to capture important detail such as thin panels, apertures and wires • Wide range of applications including shielding, radiated emissions and susceptibility","PeriodicalId":426924,"journal":{"name":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Transmission line matrix method (TLM)\",\"authors\":\"D. Johns\",\"doi\":\"10.1109/EMCSI.2018.8495432\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"TLM Summary • Highly versatile full-wave 3D time-domain method • Uses scattering and connecting of voltage pulses in a mesh of transmission-lines to simulate EM fields • Conformal meshing improves accuracy, cell-lumping improves efficiency • Compact models may be used to capture important detail such as thin panels, apertures and wires • Wide range of applications including shielding, radiated emissions and susceptibility\",\"PeriodicalId\":426924,\"journal\":{\"name\":\"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCSI.2018.8495432\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCSI.2018.8495432","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
TLM Summary • Highly versatile full-wave 3D time-domain method • Uses scattering and connecting of voltage pulses in a mesh of transmission-lines to simulate EM fields • Conformal meshing improves accuracy, cell-lumping improves efficiency • Compact models may be used to capture important detail such as thin panels, apertures and wires • Wide range of applications including shielding, radiated emissions and susceptibility