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Education 4.0 Lab for Digital Innovation Units – Collaborative Learning in Time of COVID-19 Pandemic 数字创新单元教育4.0实验室- COVID-19大流行时期的协作学习
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663606
M. Ciolacu, Alina Elena Marcu, M. Vlădescu, Dan Stoichescu, P. Svasta
{"title":"Education 4.0 Lab for Digital Innovation Units – Collaborative Learning in Time of COVID-19 Pandemic","authors":"M. Ciolacu, Alina Elena Marcu, M. Vlădescu, Dan Stoichescu, P. Svasta","doi":"10.1109/SIITME53254.2021.9663606","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663606","url":null,"abstract":"Industry 4.0 and the COVID-19 pandemic are shaping the future of higher education, industry, and organizations, acting as a catalyst for digitalization with enormous challenges for mobile connectivity, collaboration, and blended teaching and learning. This paper focuses on the didactical concept of remote interaction and collaborative learning for students in electronics. We present the Education 4.0 Lab for Digital Innovation Units (E4LDIU). In this regard, we implemented for two courses (\"Optoelectronic Devices\", and \"Photonic Sensors and Transducers'') a remote lab, experimental-based interactions with the learning environment. E4LDIU offers a foundation for collaborative learning and sustainable development with knowledge produced in situational contexts. E4LDIU is here to stay after the pandemic.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122492681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
The influence of the SARS-CoV-2 on electricity consumption in Romania 新冠肺炎疫情对罗马尼亚电力消费的影响
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663612
M. Dobrea, Mihaela Vasluianu, G. Neculoiu, Ana-Maria Cristiana Moldoveanu
{"title":"The influence of the SARS-CoV-2 on electricity consumption in Romania","authors":"M. Dobrea, Mihaela Vasluianu, G. Neculoiu, Ana-Maria Cristiana Moldoveanu","doi":"10.1109/SIITME53254.2021.9663612","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663612","url":null,"abstract":"The article aims to study the impact of Coronavirus on electricity consumption. The changes suffered in electricity consumption affect the operation of the national energy system in Romania between January 2019 and May 2021. The study analyses the energy profile of the consumer and how the pandemic influenced its characteristics. It is tried to analyze the changes encountered in the daily load curve in the national energy system and will be presented methods to cover the disturbances using photovoltaic systems. Depending on the profile of the energy consumer, two methods of covering the disturbances will be used: the standalone photovoltaic systems and the on-grid type ones.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125217345","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IoT module for air quality measurement 用于空气质量测量的物联网模块
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663421
Ana-Maria Niculescu, D. Pavel, A. Dumitrașcu, N. Elisei, Vasile Mădălin Moise
{"title":"IoT module for air quality measurement","authors":"Ana-Maria Niculescu, D. Pavel, A. Dumitrașcu, N. Elisei, Vasile Mădălin Moise","doi":"10.1109/SIITME53254.2021.9663421","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663421","url":null,"abstract":"The main purpose of this paper is to present an embedded system designed for monitoring indoor and outdoor air quality, using more specific sensors for a higher detection range of pollutants. The system is based on an ESP32 microcontroller, which collects information from the sensors, then displays it on an LCD for local viewing. We are using Internet of Things technology in order to allow data retrieval and analyze the evolution of different measured parameters. From the sensors available on the market, we have tried to select those that offer the best specifications and high measurement accuracy at an affordable price. Also, most of the sensors use the I2C communication protocol, in order to minimize pin allocation.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126572946","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Digital Solutions for Smart Food Supply Chain 智能食品供应链的数字化解决方案
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663672
G. Suciu, I. Pop, A. Pasat, Serban-Emanuel Calescu, Robert-Ionut Vatasoiu, Ioana Suciu
{"title":"Digital Solutions for Smart Food Supply Chain","authors":"G. Suciu, I. Pop, A. Pasat, Serban-Emanuel Calescu, Robert-Ionut Vatasoiu, Ioana Suciu","doi":"10.1109/SIITME53254.2021.9663672","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663672","url":null,"abstract":"Food waste is a major problem in the current economy, equaling 20% of all food produced in the EU. The European Commission reported, in 2019, that the EU-27 generated 89 million tons of food waste, while the food service and hospitality sector accounts for 12.5 million tons of food waste (14% of total food waste). Catering and Food Services in Healthcare institutions face even more significant challenges: plate waste in healthcare facilities ranges between 6% - 65%; hospitalized patients continue to suffer from the risk of malnutrition resulting from inappropriate food distribution and consumption. In this paper we introduce ADCATER project, which proposes an advanced ICT platform based on innovative technologies integrated in a Smart Food Catering Supply Chain platform. ADCATER aims for economic efficiencies to farmers and suppliers; personalized nutrition accuracy to diners/kitchens, wholesalers, and caterers; also, verification of personal, organizational, and global nutritional policies. This will be achieved by harnessing IoT, computer vision and deep learning technologies to identify and decode images of prepared food \"served to plate before a meal\" and \"left in plate after a meal\", applying advanced analytics to derive valuable information such as served meal ingredients, the degree of adjustment and dietary gaps to the diner profile, batch traceability data, effective and up-to-date nutritional supervision, food waste, and correlation between consumer consumption and health.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121494116","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Solving Automotive Signal Integrity Issues by EMC Simulation 通过EMC仿真解决汽车信号完整性问题
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663717
A. Silaghi, Catalin Pescari, Ciprian Bleoju, A. De Sabata
{"title":"Solving Automotive Signal Integrity Issues by EMC Simulation","authors":"A. Silaghi, Catalin Pescari, Ciprian Bleoju, A. De Sabata","doi":"10.1109/SIITME53254.2021.9663717","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663717","url":null,"abstract":"The use of Electromagnetic (EM) simulation tools for analysing Signal Integrity (SI) performance of an automotive product is demonstrated in this paper. The contribution is demonstrated by step-by-step guidance presentation on how to handle SI simulations for a device under test (DUT) (this topic has not been addressed so frequently in the literature so far). The novelty stems from: layout improvements for Time Domain Reflectometry (TDR) issues and also by demonstrating that the use of EM simulation at the early design stage allows for the appropriate selection of resistor values to achieve optimized SI performance, without performing complex measurements.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117234408","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
COVID-19: the Shift to E-learning - Student’s Perception and Outlooks 2019冠状病毒病:向电子学习的转变——学生的看法和观点
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663659
C. Marghescu, A. Drumea, M. Pantazica, N. Codreanu
{"title":"COVID-19: the Shift to E-learning - Student’s Perception and Outlooks","authors":"C. Marghescu, A. Drumea, M. Pantazica, N. Codreanu","doi":"10.1109/SIITME53254.2021.9663659","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663659","url":null,"abstract":"The COVID -19 pandemic has affected teachers and students around the world and changed the educational process by forcing a shift to online. This paper discusses how this switch has been perceived by students at a Romanian university: Politehnica of Bucharest. Through a questionnaire we tried to find out the perceived advantages and disadvantages and concluded that some elements can and should remain part of the educational process, even when returning to face-to-face learning.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132246169","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The investigation by numerical simulation of thermal induced deformation in a double soldered chip structure 双焊芯片结构热致变形的数值模拟研究
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663709
Luiza Dobre, A. Bojita, M. Purcar, A. Fazakas
{"title":"The investigation by numerical simulation of thermal induced deformation in a double soldered chip structure","authors":"Luiza Dobre, A. Bojita, M. Purcar, A. Fazakas","doi":"10.1109/SIITME53254.2021.9663709","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663709","url":null,"abstract":"The overvoltages and/or overcurrents generated by the repetitive power cycling can highly impact the power MOSFET integrated circuits (IC) lifetime. Hence, these devices are often subjected to defects. The predominant defects meet in power MOSFET IC based on copper clip technology are solder fatigue and aluminum degradation [1]. The root cause is the Coefficient of Thermal Expansion (CTE) mismatch between the constitutive materials, leading to chip metallization deformation (e.g., wrinkles in metal layers). In this paper, the accumulation of mechanical deformation is assessed by numerical simulation during several temperature cycles under the influence of various geometry dimensions.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122866489","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Ultrasound liver steatosis diagnosis using deep convolutional neural networks 超声诊断肝脂肪变性的深度卷积神经网络
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663701
G. Simion, C. Căleanu, Patricia Andreea Barbu
{"title":"Ultrasound liver steatosis diagnosis using deep convolutional neural networks","authors":"G. Simion, C. Căleanu, Patricia Andreea Barbu","doi":"10.1109/SIITME53254.2021.9663701","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663701","url":null,"abstract":"One of the most common liver diseases is nonalcoholic hepatic steatosis. Until now, the standard method used for direct fatty liver quantification in hepatic tissue samples is liver biopsy. However, this method is invasive and involves certain risks for the patient. The goal of this paper is to find a non-invasive, cost-effective and wide available method for hepatic steatosis diagnosis that can replace the standard invasive procedure. The solution proposed is to use ultrasound images and deep convolutional neural networks. We implemented two models of deep convolutional neural networks and used 550 ultrasound images from 55 obese patients (only 17 with healthy liver) to train and test them. Our best model obtained an average accuracy of 87.49%.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127124718","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Experimental Estimation of the State of Health of Lithium-ion Batteries under Different Conditions 不同工况下锂离子电池健康状态的实验评估
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663419
Adelina Ioana Ilieş, G. Chindris, D. Pitica, R. Jano
{"title":"Experimental Estimation of the State of Health of Lithium-ion Batteries under Different Conditions","authors":"Adelina Ioana Ilieş, G. Chindris, D. Pitica, R. Jano","doi":"10.1109/SIITME53254.2021.9663419","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663419","url":null,"abstract":"As Lithium-ion batteries are used in numerous applications that require energy storage systems, the analysis of battery performance degradation is an increasingly investigated topic. To ensure the safe and optimal operation of battery-powered devices, an evaluation of the state of health of the battery is important. Monitoring the state of charge (SoC) and state of health (SoH) of the battery in a system is a task of the battery management system. During the past years, great efforts have been made to estimate and predict the lifespan of a lithiumion battery considering the calendar ageing. The purpose of the paper is to evaluate how affected are the performances of lithium-ion cells over time, after long-term storage in certain conditions. The battery cells degradation is evaluated by performing a series of tests to determine their capacity and internal resistance.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122298734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Calibration of Time-of-Flight Ultrasonic Flow Meters 飞行时间超声流量计的校准
2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2021-10-27 DOI: 10.1109/SIITME53254.2021.9663687
Butean Fabian-Manuel, Lica Septimiu, Lie Ioan
{"title":"Calibration of Time-of-Flight Ultrasonic Flow Meters","authors":"Butean Fabian-Manuel, Lica Septimiu, Lie Ioan","doi":"10.1109/SIITME53254.2021.9663687","DOIUrl":"https://doi.org/10.1109/SIITME53254.2021.9663687","url":null,"abstract":"This paper presents the use of various techniques in adjusting correction factors applied to flow meters as part of the testing procedure. Because of non-linearity in measurements done with ultrasonic transducers, it can be difficult to implement rigid algorithms to determine the correction factors. Artificial Intelligence methods cater well to such processes, which are not governed by a precise mathematical model.","PeriodicalId":426485,"journal":{"name":"2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132912618","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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