International Symposium for Testing and Failure Analysis最新文献

Application of Plasma Focused Ion Beam Technique in Advanced Technology Nodes 等离子体聚焦离子束技术在先进技术节点中的应用

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022p0092

Liangshan Chen, Amado Longoria, Gina Cha, Gilbert Tovar, Elena Ramirez, Pingan Fang, Yong Liu, Andres Torres, Marco Alcantara, C. Penley

引用次数: 0

Transmission Electron Microscopy (TEM) Techniques for Semiconductor Failure Analysis 半导体失效分析的透射电子显微镜技术

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022tpl1

Sam Subramanian, K. Ly, Tony Chrastecky

引用次数: 0

A Multi-Protocol Module To Provide An External Trigger For Dynamic Lock-In Thermography 为动态锁定热成像提供外部触发的多协议模块

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022p0333

R. Bienek

{"title":"A Multi-Protocol Module To Provide An External Trigger For Dynamic Lock-In Thermography","authors":"R. Bienek","doi":"10.31399/asm.cp.istfa2022p0333","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2022p0333","url":null,"abstract":"\u0000 Lock-in thermography (LIT) is a firmly established and powerful technique for IC defect localization. The standard approach is to detect and analyze the device temperature fluctuation between two bias conditions using an infrared thermal imaging camera and check for any anomalous heat response. For the most straightforward setup, these bias conditions would be achieved by the modulation of a supply voltage provided by the LIT system. This allows for synchronization to the internal camera frame rate. In addition to this method, the ability to provide an external trigger may be an option, as it is for the ELITE system by Thermo Fisher Scientific. This expands the LIT arena to failures that may only be observable by, for example, setting different register contents at a constant supply voltage. Though IC testers can be used to provide the stimulus and a trigger signal for these situations, often a simpler, more compact solution would be beneficial for the failure analyst. This paper presents such an alternative: the application of a low-cost, USB-based module which can emulate various communication protocols (for example, I2C, SPI) while providing a synchronized timing pulse to externally trigger the ELITE, thus facilitating dynamic LIT investigations. The efficacy of this solution is demonstrated by a case study in which dynamic LIT produced a single hot spot at the defect site that was undetected by the voltage modulation approach.","PeriodicalId":417175,"journal":{"name":"International Symposium for Testing and Failure Analysis","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125299340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Applications of PVC and Progressive FIB Milling in Identifying Top-Down Invisible Defect on Advanced Nodes SRAM Devices 聚氯乙烯和渐进FIB铣削在先进节点SRAM器件自顶向下隐形缺陷识别中的应用

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022p0347

Wiwy Wudjud, Chan Dang, Kah Chin Cheong, Gregory B. Collins, C. Penley

引用次数: 0

New Approach in Physical Failure Analysis Based on 3D Reconstruction 基于三维重构的物理失效分析新方法

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022p0201

D. Mello, Giuseppe Sciuto, M. Astuto, M. F. Santangelo, H. Stegmann, F. Cognigni, Marco Rossi

引用次数: 0

X-Ray Device Alteration Using a Scanning X-Ray Microscope 使用扫描x射线显微镜改变x射线设备

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022p0153

W. Lo, Pankaj Gupta, Rakshith Venkatesh, R. Schlangen, H. Marks, B. Cory, Frances Su, Benjamin Stripe, S. Lewis, W. Yun

引用次数: 0

Complementary Fault Isolation Procedures Combining Laser Voltage Probing/Imaging and Lock-In Thermography—Case Studies 互补故障隔离程序结合激光电压探测/成像和锁定热成像-案例研究

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022p0369

Sukho Lee, M. van Veenhuizen

引用次数: 0

Corrosion Mechanisms of Copper and Gold Ball Bonds 铜和金球键的腐蚀机理

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022p0310

W. Qin

引用次数: 1

SPILL—Security Properties and Machine-Learning Assisted Pre-Silicon Laser Fault Injection Assessment 泄漏安全特性和机器学习辅助的预硅激光故障注入评估

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022p0225

Nitin Pundir, Henian Li, Lang Lin, N. Chang, Farimah Farahmandi, M. Tehranipoor

{"title":"SPILL—Security Properties and Machine-Learning Assisted Pre-Silicon Laser Fault Injection Assessment","authors":"Nitin Pundir, Henian Li, Lang Lin, N. Chang, Farimah Farahmandi, M. Tehranipoor","doi":"10.31399/asm.cp.istfa2022p0225","DOIUrl":"https://doi.org/10.31399/asm.cp.istfa2022p0225","url":null,"abstract":"\u0000 Laser-based fault injection (LFI) attacks are powerful physical attacks with high precision and controllability. Therefore, attempts have been in the literature to model and simulate the laser effect in pre-silicon digital designs. However, these efforts can only model the laser effect on small SPICE or TCAD circuits of individual standard cells. This paper proposes security properties and a machine-learning assisted layout signoff framework in verifying the full-chip layout's resiliency against LFI. In the framework, we leveraged the commercial SoC power integrity sign-off tool to inject the Gaussian laser current to any spot in the layout, by considering different layout features such as power distribution network, decoupling capacitor placement, metal geometry, instance switching power, etc. To avoid exhaustive analysis of all layout spots regardless of LFI criticality, we use security properties to drive the assessment and identify critical areas. We then use SPICE simulations and machine learning to develop cell-level laser fault models under different laser-induced transient current intensities. This laser cell library is used during full-chip LFI feasibility analysis for the cells inside laser illumination, enabling precise layout -level design fix for critical cells failing the fault injection threshold. Finally, we show the effectiveness of the proposed framework by analyzing the fully implemented AES design layout.","PeriodicalId":417175,"journal":{"name":"International Symposium for Testing and Failure Analysis","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127781551","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Yield Basics for Failure Analysts (2022 Update) 失效分析的良率基础(2022年更新)

International Symposium for Testing and Failure Analysis Pub Date : 2022-10-30 DOI: 10.31399/asm.cp.istfa2022tpa1

D. Albert, Tracy A. Meyers

引用次数: 0