失效分析的良率基础(2022年更新)

D. Albert, Tracy A. Meyers
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引用次数: 0

摘要

本报告概述了与半导体良率分析、建模和改进技术相关的术语和概念。它比较和对比了良率模型,并描述了针对特定故障和缺陷建立良率工程程序所涉及的步骤和设备。它还包括案例历史,展示了如何使用不同的产量分析模型来识别随机和系统故障的根本原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Yield Basics for Failure Analysts (2022 Update)
This presentation provides an overview of the terminology and concepts associated with semiconductor yield analysis, modeling, and improvement techniques. It compares and contrasts yield models and describes the steps and equipment involved in setting up yield engineering programs targeting specific failures and defects. It also includes case histories showing how different yield analysis models have been used to identify the root cause of random and systematic failures.
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