Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)最新文献

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Ball grid array (BGA) solder joint integrity enhancement 球栅阵列(BGA)焊点完整性增强
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682104
G. Barlett, S. Lee, W. Yacovitch
{"title":"Ball grid array (BGA) solder joint integrity enhancement","authors":"G. Barlett, S. Lee, W. Yacovitch","doi":"10.1109/ELECTR.1998.682104","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682104","url":null,"abstract":"Ball Grid Arrays (BGAs) are popular micropackaging options because of their packaging density, relative ease of assembly, and inherent physical integrity, among other things. Standard commercial environments pose no rigorous stresses on them, but the same cannot be said for harsher environments. Unfortunately, the distinction between the two is ill-defined and requires extensive testing and analysis to be performed for each specific application. Both ceramic BGAs (CBGAs) and plastic BGAs (PBGAs) that house Mercury Computer Systems' custom ASIC chips have been found to be generally resilient to such stresses, with the exception of large vibrational stresses which caused premature failure of susceptible solder joints during qualification testing. A variety of techniques were investigated to ruggedize these joints. Application of a compliant underfilling epoxy with viscosity levels tailored for two package types, CBGAs and PBGAs, was found to provide the best combination of performance, cost, ease of use, and reworkability. Furthermore, this material is compatible with other materials and processes used in electronics assembly.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132452023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Power lines, cancer, and erroneous physics 电力线,癌症,还有错误的物理学
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682111
J. Ashley, R.E. Beatie, J.F. Heneage
{"title":"Power lines, cancer, and erroneous physics","authors":"J. Ashley, R.E. Beatie, J.F. Heneage","doi":"10.1109/ELECTR.1998.682111","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682111","url":null,"abstract":"A 1979 epidemiologic study in Denver found that living near overhead distribution lines significantly increased the risk of certain kinds of childhood cancers. No measurements of electrical quantities were made. The hypothesis advanced as an explanation was that the magnetic field would be the causative agent and that the magnetic fields could be estimated by counting the number of conductors on the line and measuring the distance to the home, termed \"wiring configurations\". By estimating the induced current density in humans standing below the power lines, one learns that the electric field must be considered as a possible causative agent. The follow-on study in Denver failed to properly measure the fields directly under the power line. The defined wiring configuration codes failed to account for the spacing of the conductors or the location of the residence with respect to the supply substation. The idea that wiring configurations (a.k.a. wiring codes) estimate magnetic fields is erroneous. The studies in Denver, Los Angeles, Sweden, Finland, and a large area in the USA have found insufficient confidence in the magnetic field hypothesis, possibly because of many other physics errors; e.g., ignoring the role of vector direction, time and space averaging, not measuring any reasonable aspect of the power line electric fields and ignoring the engineering design differences in the transmission and distribution systems. The Scandinavian studies concentrated on 115 kV to 400 kV bulk transmission lines; yet, failed to consider the electric fields which induce at least ten times greater current density in a human than do the magnetic fields near the same lines. The cumulative effect of these serious errors in engineering physics is that the past decade of funded research has failed to explain why living adjacent to overhead distribution power lines in Denver and Los Angeles and living within 50 meters of bulk transmission lines in Sweden increases the risk of childhood leukemia.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"79 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131558672","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
The EMC Directive EMC指令
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682109
M. Hopkins
{"title":"The EMC Directive","authors":"M. Hopkins","doi":"10.1109/ELECTR.1998.682109","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682109","url":null,"abstract":"Compliance with the EMC Directive is an on-going process. The manufacturer can do much of the testing for himself. In-house testing can be cost effective. Using EMC instruments as design tools will result in better products.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122241765","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Receiver structures for signals with unknown frequency and time-of-arrival 频率和到达时间未知信号的接收机结构
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682114
T.A. Schonhoff, A. Giordano
{"title":"Receiver structures for signals with unknown frequency and time-of-arrival","authors":"T.A. Schonhoff, A. Giordano","doi":"10.1109/ELECTR.1998.682114","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682114","url":null,"abstract":"Receiver structures for an optimal noncoherent receiver when a transmitted signal experiences a random frequency shift and/or a random time-of-arrival are derived. Error rate performance, obtained by simulation, is then developed and compared with the standard noncoherent correlator for the random frequency shift.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115501122","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
High density SMT assemblies based on flex substrates 基于柔性基板的高密度SMT组件
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682105
R. Larmouth, J. Keating
{"title":"High density SMT assemblies based on flex substrates","authors":"R. Larmouth, J. Keating","doi":"10.1109/ELECTR.1998.682105","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682105","url":null,"abstract":"The industry trend to shrink semiconductor device packages while increasing I/O count results in demands on the printed circuit boards to which these devices are assembled. An increase in wiring density is required at the board level, often equating to higher costs and/or layer counts. In many cases, designers are looking to multilayer flexible circuits as the next level of interconnect for a wide range of packaging technologies from fine-pitch surface mount to chip-scale packages to direct-chip attach. Challenges associated with a flex-based solution include assembly compatibility, material costs and reliability. This paper reviews work by Teledyne Electronic Technologies (TET) to address these board level interconnect challenges for several custom applications. An approach employing flexible multilayer substrates which incorporate fine-line circuitry, small vias and flexible soldermask is examined. A test vehicle designed and built to accommodate micro-BGA packages is used to illustrate the density achieved and to provide a platform for demonstrating assembly and reliability attributes. This test vehicle is also being used to evaluate materials and process technologies applicable to high density SMT assemblies.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128815119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Follow these 18 rules for better EMC design 遵循以下18条规则可以更好地进行EMC设计
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682108
J. Curtis, I. Straus
{"title":"Follow these 18 rules for better EMC design","authors":"J. Curtis, I. Straus","doi":"10.1109/ELECTR.1998.682108","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682108","url":null,"abstract":"The measures described in this article can go a long way to reduce radiated emissions due to return voltages. For most devices, return voltages are the dominant cause of radiation for frequencies up to several hundred MHz. Upward of that, loops of current on the printed circuit boards themselves can act as radiators to a significant degree. Nonetheless, the same techniques employed here to reduce radiation will work to reduce radiation directly from these loops as well.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"28 10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124690767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Dual mode CDMA networks: capacity, planning and optimization
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682113
R. Ganesh
{"title":"Dual mode CDMA networks: capacity, planning and optimization","authors":"R. Ganesh","doi":"10.1109/ELECTR.1998.682113","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682113","url":null,"abstract":"CDMA deployment is proving more complex than originally anticipated. Optimisation is dependent on traffic projections. Long-term and interim capacity increase are discussed. In some cases it may be more beneficial to add more cell sites than use an additional carrier.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130792303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Measurement of potential magnetic field interference with implanted cardioverter defibrillators or pacemakers 对植入的心律转复除颤器或起搏器的潜在磁场干扰的测量
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682110
J. Ashley, B. Myers, H. C. Lilly, R. Beatie
{"title":"Measurement of potential magnetic field interference with implanted cardioverter defibrillators or pacemakers","authors":"J. Ashley, B. Myers, H. C. Lilly, R. Beatie","doi":"10.1109/ELECTR.1998.682110","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682110","url":null,"abstract":"The return to active employment in a Central Florida phosphate mine of people with recently implanted cardioverter defibrillators raised a serious concern about possible electromagnetic interference. The implantable cardioverter defibrillator as well as the pacemaker has magnetically actuated switches to enable the physician to program and test the device. The draglines used in strip mining use large DC motors driven by AC to DC motor generator sets. There are no catalog data on the fringing fields near these electrical machines. A one week measurement effort found several regions near machines where the DC magnetic fields exceeded limits set for the implanted devices. These were found to be a function of the placement and installation of the machines. It is necessary to make the actual measurements to locate possible unsafe regions. The DC magnetic fields were measured with a Hall effect gaussmeter. Equipment complying with IEEE Std. 644-1994 was used to measure 60 Hz AC magnetic and electric fields. No unsafe regions were found below 230 kV three-phase bulk power transmission lines or near any of the outdoor substations. Some regions near 480 V BC equipment cabinets were found to have excessive 60 Hz magnetic fields. This is a function of the bus configuration inside the cabinets. These measurements at one CF Industries facility allowed one supervisory employee to resume his duties with very few restrictions based on his implanted defibrillator; however, the measurements in no way can be interpreted to apply to other facilities.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116656392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Bonding and handling procedure for (TM)GMIC flip-chip devices (TM)GMIC倒装芯片的键合和处理程序
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682102
D. Santeusanio
{"title":"Bonding and handling procedure for (TM)GMIC flip-chip devices","authors":"D. Santeusanio","doi":"10.1109/ELECTR.1998.682102","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682102","url":null,"abstract":"(Glass Microwave Integrated Circuits (GMIC)), is a design and manufacturing technology for microwave circuits that has been developed and patented by MIA-COM. It provides a high level of repeatability, high performance and low manufacturing costs through the use of wafer level processing to generate all of the common passive components and structures on a substrate that incorporates a dielectric layer (silicon) and a carrier layer (glass). Currently, M/A-COM is offering a wide variety of passive RF and microwave devices in industry standard plastic packages. Typical functions include; power (dividers/combiners (2 to 8 way), directional and hybrid couplers, filter diplexers and balun transformers). The current plastic packaged device's range in frequency from DC to 3 GHz. All of these functions are realizable in the flip-chip format to be described herein. Higher frequency functionality will also be available with flip-chip format to be installed due to the elimination of many of the electrical parasitics due to the plastic packaging.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121999837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
PQFP moisture bake out process optimization PQFP烘干工艺优化
Professional Program Proceedings. Electro 98 (Cat. No.98CH36240) Pub Date : 1998-06-09 DOI: 10.1109/ELECTR.1998.682103
T. Nguyen, G. Atlas
{"title":"PQFP moisture bake out process optimization","authors":"T. Nguyen, G. Atlas","doi":"10.1109/ELECTR.1998.682103","DOIUrl":"https://doi.org/10.1109/ELECTR.1998.682103","url":null,"abstract":"PQFP packages, prior to board assembly, have a requirement to be \"baked out\" of absorbed moisture to prevent \"pop corning\". This paper identifies key factors that are necessary for controlling an efficient and optimized bake out process. Moisture absorption and desorption of the PQFP package is discussed. Methods are recommended for optimizing and verifying the performance of the bake out ovens.","PeriodicalId":402966,"journal":{"name":"Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121327423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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