球栅阵列(BGA)焊点完整性增强

G. Barlett, S. Lee, W. Yacovitch
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引用次数: 2

摘要

球栅阵列(bga)是流行的微包装选择,因为它们的包装密度,相对容易组装,以及固有的物理完整性等。标准的商业环境不会对它们造成严格的压力,但对于更恶劣的环境就不是这样了。不幸的是,两者之间的区别是不明确的,并且需要对每个特定的应用程序执行大量的测试和分析。水银计算机系统定制ASIC芯片的陶瓷BGAs (CBGAs)和塑料BGAs (PBGAs)都被发现对这种应力具有普遍的弹性,除了在鉴定测试期间导致易感焊点过早失效的大振动应力。研究了各种技术来加固这些接头。研究发现,为CBGAs和PBGAs两种封装类型量身定制的粘度等级的柔性底填充环氧树脂,可以提供性能、成本、易用性和可返修性的最佳组合。此外,这种材料与电子组装中使用的其他材料和工艺兼容。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ball grid array (BGA) solder joint integrity enhancement
Ball Grid Arrays (BGAs) are popular micropackaging options because of their packaging density, relative ease of assembly, and inherent physical integrity, among other things. Standard commercial environments pose no rigorous stresses on them, but the same cannot be said for harsher environments. Unfortunately, the distinction between the two is ill-defined and requires extensive testing and analysis to be performed for each specific application. Both ceramic BGAs (CBGAs) and plastic BGAs (PBGAs) that house Mercury Computer Systems' custom ASIC chips have been found to be generally resilient to such stresses, with the exception of large vibrational stresses which caused premature failure of susceptible solder joints during qualification testing. A variety of techniques were investigated to ruggedize these joints. Application of a compliant underfilling epoxy with viscosity levels tailored for two package types, CBGAs and PBGAs, was found to provide the best combination of performance, cost, ease of use, and reworkability. Furthermore, this material is compatible with other materials and processes used in electronics assembly.
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