Bonding and handling procedure for (TM)GMIC flip-chip devices

(Glass Microwave Integrated Circuits (GMIC)), is a design and manufacturing technology for microwave circuits that has been developed and patented by MIA-COM. It provides a high level of repeatability, high performance and low manufacturing costs through the use of wafer level processing to generate all of the common passive components and structures on a substrate that incorporates a dielectric layer (silicon) and a carrier layer (glass). Currently, M/A-COM is offering a wide variety of passive RF and microwave devices in industry standard plastic packages. Typical functions include; power (dividers/combiners (2 to 8 way), directional and hybrid couplers, filter diplexers and balun transformers). The current plastic packaged device's range in frequency from DC to 3 GHz. All of these functions are realizable in the flip-chip format to be described herein. Higher frequency functionality will also be available with flip-chip format to be installed due to the elimination of many of the electrical parasitics due to the plastic packaging.