PQFP moisture bake out process optimization

Abstract

PQFP packages, prior to board assembly, have a requirement to be "baked out" of absorbed moisture to prevent "pop corning". This paper identifies key factors that are necessary for controlling an efficient and optimized bake out process. Moisture absorption and desorption of the PQFP package is discussed. Methods are recommended for optimizing and verifying the performance of the bake out ovens.