68th Device Research Conference最新文献

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Room temperature operation and DC characteristics of InAlN/GaN/AlGaN Hot Electron Transistors with common base transfer ratio, α = 0.97 共基传输比为α = 0.97的InAlN/GaN/AlGaN热电子晶体管的室温工作和直流特性
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551877
S. Dasgupta, N. Nidhi, A. Raman, J. Speck, U. Mishra
{"title":"Room temperature operation and DC characteristics of InAlN/GaN/AlGaN Hot Electron Transistors with common base transfer ratio, α = 0.97","authors":"S. Dasgupta, N. Nidhi, A. Raman, J. Speck, U. Mishra","doi":"10.1109/DRC.2010.5551877","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551877","url":null,"abstract":"A Hot Electron Transistor (HET) works on the principle of injection of ‘hot’ electrons above a barrier into a thin transit region (base), where they travel with minimal scattering and are collected in the collector.1,2 It is thus possible to obtain near ballistic transport in these devices and hence larger current drive and operation at frequencies higher than conventional (diffusive transport) transistors. The other obvious advantage of this device especially over nitride based HBTs is in the enormous decrease of Rb (base resistance) possible relative to HBTs; 100Ω/□ in a unipolar HET compared to a few kΩ/□ in an HBT due to the difficulty in obtaining high hole concentrations combined with low hole mobility.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115394171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Effects of nanoscale contacts to silicon nanowires on contact resistance: Characterization and Modeling 纳米尺度接触对硅纳米线接触电阻的影响:表征和建模
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551876
Joshua T. Smith, Yanjie Zhao, Chen Yang, J. Appenzeller
{"title":"Effects of nanoscale contacts to silicon nanowires on contact resistance: Characterization and Modeling","authors":"Joshua T. Smith, Yanjie Zhao, Chen Yang, J. Appenzeller","doi":"10.1109/DRC.2010.5551876","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551876","url":null,"abstract":"We have shown the first experimental data related to the contact resistance associated with nanoscale contact lengths along NWs to address scaling issues. We have implemented a new model that appropriately accounts for the finite depth and depletion width of a given semiconductor that preserves resistivity values in the short contact regime. Our model permits accurate predictions for the contact resistance over the entire range of Lcontact values knowing just two experimental points, one in both the short and long contact limit.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130100689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Flatband voltage tuning and EOT reduction for SiO2/HfO2/TiN gate stacks via lanthanum oxide capping layers using two different lanthanum precursors 使用两种不同的镧前驱体,通过氧化镧盖层实现SiO2/HfO2/TiN栅极堆的平带电压调谐和EOT降低
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551940
C. Chiang, H. Huang, C. Wu, J.F. Lin, C.C. Liu, C. Yang, J. Wu, S. Wang
{"title":"Flatband voltage tuning and EOT reduction for SiO2/HfO2/TiN gate stacks via lanthanum oxide capping layers using two different lanthanum precursors","authors":"C. Chiang, H. Huang, C. Wu, J.F. Lin, C.C. Liu, C. Yang, J. Wu, S. Wang","doi":"10.1109/DRC.2010.5551940","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551940","url":null,"abstract":"High-k dielectrics are crucial in scaled CMOS technology because their large physical thickness can suppress gate tunneling leakage current at a scaled equivalent oxide thickness (EOT). For the past decade, hafnium-based gate dielectrics (HfO2 or Hf-based oxides) have been introduced to mass-production by commercial chip-makers. In the meantime, metal gates were also explored to improve the poly-Si depletion effect polysilicon gate electrodes in high performance logic devices at 45 nm node technology and beyond. However, the development of metal gates with Fermi level near the Si band edges has been difficult on Hf-based gate dielectrics, which can be attributed to several possible factors including Fermi level pinning and interfacial dipole formation.[1,2] Recently, the use of thin cap layers that are inserted between the gate metal and dielectric has been shown to cause negative flatband voltage (Vfb) shift and stabilize low VTH simultaneously. A major challenge with cap layers is to achieve adequate effective work function shifts without large increases in EOT (ΔEOT). Atomic layer deposition (ALD) La2O3 cap layer is a promising candidate for n-channel devices due to its relatively high dielectric constant of ∼17 [3] and strong bond polarization. Essentially, ALD is one precursor dominated process [4], successful applications of ALD in advanced CMOS technology should depend on whether appropriate precursor can be utilized. In this work, effects of the La2O3 cap layer interposed in Si/SiO2/HfO2/TiN high-k gate dielectric stacks prepared from two different ALD lanthanum precursors, La(fAMD)3 and La(thd)3, in tuning Vfb and ΔEOT are investigated. The values of ΔVfb and ΔEOT as high as 0.45 V and 0.055 nm were achieved by a 1-nm-thick La2O3 cap layer.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129719380","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
InGaN/GaN nanowire green light emitting diodes on (001) Si substrates (001) Si衬底上的InGaN/GaN纳米线绿色发光二极管
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551984
Meng Zhang, Wei Guo, A. Banerjee, P. Bhattacharya
{"title":"InGaN/GaN nanowire green light emitting diodes on (001) Si substrates","authors":"Meng Zhang, Wei Guo, A. Banerjee, P. Bhattacharya","doi":"10.1109/DRC.2010.5551984","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551984","url":null,"abstract":"Progress in solid state lighting at the present time primarily involves the research and development of visible nitridebased light emitting diodes (LEDs) and perhaps lasers in the future. However, this development has been impeded due to the lack of high-quality and low-cost GaN substrate. Successful growth of GaN and InGaN nanowires on silicon and other mismatched substrates has been demonstrated recently [1]. The nanowires exhibit significantly reduced defect density due to their large surface-to-volume ratio. A reduced strain distribution in the nanostructures also leads to a weaker piezoelectric polarization field. Other advantages include large light extraction efficiency and the compatibility with low-cost, large area silicon substrates. In the present study, we have conducted a detailed investigation of the molecular beam epitaxial (MBE) growth and optical properties of (In)GaN nanowires directly on (001) Si in the absence of a foreign metal catalyst. Green LEDs have been fabricated with an ensemble of nanowires and the characteristics of these devices are also presented.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128736623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A charge-trapping memory structure featuring low-voltage high-speed operation and 250 °C retention 一种具有低压高速运行和250°C保持的电荷捕获存储器结构
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551969
C. Peng, W.Q. Zhang, X. Sun, Z.G. Liu, S. Cui, T. Ma, L. Kornblum, M. Eizenberg
{"title":"A charge-trapping memory structure featuring low-voltage high-speed operation and 250 °C retention","authors":"C. Peng, W.Q. Zhang, X. Sun, Z.G. Liu, S. Cui, T. Ma, L. Kornblum, M. Eizenberg","doi":"10.1109/DRC.2010.5551969","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551969","url":null,"abstract":"We have demonstrated that MAD-Al2O3 is an excellent candidate for the tunnel, as well as for the blocking dielectrics in NAND-type memories. Despite the limited minority carrier generation rate, the MANAS capacitors have already demonstrated superb memory characteristics, especially the 250C retention, which we believe is exceptional and unprecedented. The process simplicity is also an attractive feature, making the MANAS structure viable for future generations of non-volatile memories.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122692994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Enhanced responsivity in a novel AlGaN / GaN plasmon-resonant terahertz detector using gate-dipole antenna with parasitic elements 基于寄生元件栅极偶极天线的新型AlGaN / GaN等离子共振太赫兹探测器的响应性增强
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551895
T. Tanigawa, T. Onishi, S. Takigawa, T. Otsuji
{"title":"Enhanced responsivity in a novel AlGaN / GaN plasmon-resonant terahertz detector using gate-dipole antenna with parasitic elements","authors":"T. Tanigawa, T. Onishi, S. Takigawa, T. Otsuji","doi":"10.1109/DRC.2010.5551895","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551895","url":null,"abstract":"Plasmon-resonant terahertz (THz) detection using heterojunction field effect transistors (HFETs) is a promising method to enable compact and efficient THz detectors which can be applied to real-time imaging systems or THz spectroscopic analysis [1–2]. So far, the plasmon-resonant detectors which receive sub-THz and THz radiation at a gate bonding-wire or an external antenna have been reported [3–5]. However, the signal transmission from the antenna to the FET causes large propagation loss which degrades the sensitivity. In this paper, we present a novel AlGaN / GaN heterojunction FET which can detect THz radiation directly at a gate electrode with high responsivity.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126328037","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 42
Programmable nanomagnet-logic majority gate 可编程纳米磁体逻辑多数门
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551921
E. Varga, M. Niemier, G. Bernstein, W. Porod, X. S. Hu
{"title":"Programmable nanomagnet-logic majority gate","authors":"E. Varga, M. Niemier, G. Bernstein, W. Porod, X. S. Hu","doi":"10.1109/DRC.2010.5551921","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551921","url":null,"abstract":"Nanomagnet logic (NML) is a room temperature realization of the original quantum-dot cellular automata (QCA) concept, which is built from single-domain, e-beam patterned supermalloy nanomagnets. Many magnetic circuit elements have been experimentally realized (Fig. 1), including lines, gates, and inverters1. Calculations shows that if 1010 magnets switch 108 times/s, the magnets would dissipate ∼ 0.1 W.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117337582","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 17
Tellurium δ-doped 120nm AlSb/InAs HEMTs: towards sub-100mV electronics 碲δ掺杂120nm AlSb/InAs hemt:迈向亚100mv电子学
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551945
Y. Roelens, A. Olivier, L. Desplanque, A. Noudéviwa, F. Danneville, N. Wichmann, X. Wallart, S. Bollaert
{"title":"Tellurium δ-doped 120nm AlSb/InAs HEMTs: towards sub-100mV electronics","authors":"Y. Roelens, A. Olivier, L. Desplanque, A. Noudéviwa, F. Danneville, N. Wichmann, X. Wallart, S. Bollaert","doi":"10.1109/DRC.2010.5551945","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551945","url":null,"abstract":"In this paper, we have investigated f<inf>T</inf> variations under ultra low drain bias conditions of state of the art 120nm gate length AlSb/InAs HEMT featuring a f<inf>T</inf> / f<inf>max</inf> of 303GHz /227GHz under high bias conditions and a f<inf>T</inf> of 143GHz at 100mV drain bias voltage. A nearly linear dependence of f<inf>T</inf> versus V<inf>ds</inf> up to 100mV was observed and explained. This dependence means that f<inf>T</inf> could be easily tailored with V<inf>ds</inf> for a given application. Some points should now be investigated like the dependence of noise parameters under these low bias conditions. Unpublished studies on previous devices let us expected to obtain equal or better minimum Noise Figure NF<inf>min</inf> (1.56dB) and associated Gain G<inf>ass</inf> (5.32dB) at 30 GHz for a 100mV drain bias.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127487893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Backside gate thin film transistor based on MOCVD grown ZnO on SiO2/Si substrates 在SiO2/Si衬底上生长ZnO的MOCVD后栅薄膜晶体管
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551981
Jens-Peter Biethan, B. Bayraktaroglu, L. Considine, D. Pavlidis
{"title":"Backside gate thin film transistor based on MOCVD grown ZnO on SiO2/Si substrates","authors":"Jens-Peter Biethan, B. Bayraktaroglu, L. Considine, D. Pavlidis","doi":"10.1109/DRC.2010.5551981","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551981","url":null,"abstract":"Zinc oxide (ZnO) is a direct bandgap (Eg= 3.36 eV) semiconductor with a large exciton binding energy (60 meV), exhibiting near UV emission, transparent conductivity and piezoelectricity. It also has comparable to GaN high saturation velocity and better radiation hardness. Furthermore, ZnO is bio-safe and biocompatible, and may be also used for biomedical applications. Because of its unique properties, ZnO has recently attracted strong attention. Its applications vary from sensors and piezoelectric mechanical systems, to optical and electrical components. Interest in transparent displays has prompted a significant increase in studies of thin film transistors (TFTs) [1]. Compared to the widely used amorphous silicon displays, ZnO offers a major advantage in terms of significantly higher carrier mobility and excellent electrical and optical properties [2, 3]. Various reports addressed Metalorganic Chemical Vapor Deposition (MOCVD) grown ZnO layers, but only few results exist on TFTs [e.g. 4, 5]. MOCVD is a well established technique and has already become the dominant process for the manufacture of laser diodes, solar cells, LEDs and transistors. One particular advantage of the use of MOCVD ZnO growth for industry applications is the capability of using large size substrates at a relatively low cost-value ratio.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130447722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Nano-Electro-Mechanical vibrating body FET resonator for high frequency integrated oscillators 用于高频集成振荡器的纳米机电振动体FET谐振器
68th Device Research Conference Pub Date : 2010-06-21 DOI: 10.1109/DRC.2010.5551898
D. Grogg, A. Lovera, A. Ionescu
{"title":"Nano-Electro-Mechanical vibrating body FET resonator for high frequency integrated oscillators","authors":"D. Grogg, A. Lovera, A. Ionescu","doi":"10.1109/DRC.2010.5551898","DOIUrl":"https://doi.org/10.1109/DRC.2010.5551898","url":null,"abstract":"Mechanical resonators are attractive for many applications in signal processing and sensing applications [1]. However, the aggressive scaling of their dimensions into the nanometer range with a simultaneous increase of the resonance frequency makes their direct measurement extremely difficult with electrostatic transduction, due to the very low signal level. Novel current modulation mechanisms, such as the FET based detection [2,3,4] and piezoresistive [5,6] current modulation, demonstrated the most promising results for highly sensitive motion detection in Nano-Electro-Mechanical (NEM) resonators.","PeriodicalId":396875,"journal":{"name":"68th Device Research Conference","volume":"20 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131574466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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