Soldering & Surface Mount Technology最新文献

{"title":"Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly","authors":"Yan Pan, Shuye Zhang, Pengli Zhu, Kyung W. Paik","doi":"10.1108/ssmt-08-2023-0048","DOIUrl":"https://doi.org/10.1108/ssmt-08-2023-0048","url":null,"abstract":"Purpose\u0000The study aims to ascertain the influence of solder conductive particle types and substrate widths on the current carrying capability of flex-on-board (FOB) assemblies. By comparing Sn58Bi and SAC305 particles and varying substrate widths, the research sought to provide insights into the stability and performance of solder joints under different scenarios, particularly in high-power applications.\u0000\u0000Design/methodology/approach\u0000The study used a comprehensive design/methodology, encompassing the investigation of solder conductive particle types (Sn58Bi and SAC305) and substrate widths on the current carrying capability of FOB assembly. Stable solder joints were obtained by manipulating the curing speed of anisotropic conductive films for both particle types. Various tests were conducted, including current carrying capability assessments under differing conditions.\u0000\u0000Findings\u0000The study revealed that larger substrate widths yielded higher current carrying capability due to increased contact area and reduced contact resistance. Notably, solder joints remained stable beyond the solder melting temperature due to encapsulation by cured epoxy resin. SAC305 solder joints exhibited superior current carrying capability over Sn58Bi in continuous high-voltage conditions. The results emphasized the stability of SAC305 solder joints and their suitability for robust interconnections in high-power FOB assemblies.\u0000\u0000Originality/value\u0000This study contributes by offering a comprehensive assessment of the impact of solder particle types and substrate widths on solder joint performance in FOB assemblies. The finding that SAC305 joints outperform Sn58Bi under continuous high-voltage conditions adds significant value. Moreover, the observation of stable solder joints beyond solder melting temperature due to resin encapsulation introduces a novel aspect to solder joint reliability. These insights provide valuable guidance for designing robust and high-performance interconnections in demanding applications.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"46 12","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141929530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Electric current stressing enhanced damping properties in Sn5Sb solder","authors":"Linqiang Liu, Feng Chen, Wangyun Li","doi":"10.1108/ssmt-02-2024-0005","DOIUrl":"https://doi.org/10.1108/ssmt-02-2024-0005","url":null,"abstract":"\u0000Purpose\u0000The purpose of this paper is to investigate the effects of electric current stressing on damping properties of Sn5Sb solder.\u0000\u0000\u0000Design/methodology/approach\u0000Uniformly shaped Sn5Sb solders were prepared as samples. The length, width and thickness of the samples were 60.0, 5.0 and 0.5 mm, respectively. The damping properties of the samples were tested by dynamic mechanical analyzer with a cooling system to control the test temperature in the range of −100 to 100°C. Simultaneously, electric current was imposed to the tested samples using a direct current supply. After tests, the samples were characterized using scanning electron microscope, electron backscatter diffraction and transmission electron microscope, which was aimed to figure out the damping mechanism in terms of electric current stressing induced microstructure evolution.\u0000\u0000\u0000Findings\u0000It is confirmed experimentally that the increase in damping properties is due to Joule heating and athermal effects of current stressing, in which Joule heating should make a higher contribution. G–L theory can be used to explain the damping properties of strain amplitude under current stressing by quantitative description of geometrically necessary dislocation density. While the critical strain amplitude and high temperature activation energy decrease with increasing electric current.\u0000\u0000\u0000Originality/value\u0000These results provide a new method for vibration reliability evaluation of high-temperature lead-free solders in serving electronics. Notably, this method should be also inspiring for the mechanical performance evaluation and reliability assessment of conductive materials and structures serving under electric current stressing.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"13 6","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140654296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Electrical, morphological, optical and mathematical simulations equations studies in CAZO, CZO, AZO and ZNO films","authors":"V. Dalouji, N. Rahimi","doi":"10.1108/ssmt-04-2023-0017","DOIUrl":"https://doi.org/10.1108/ssmt-04-2023-0017","url":null,"abstract":"\u0000Purpose\u0000In this paper, it can be seen from AFM images of the as-deposited ZnO and CZO films, and the particle size and shape are not clear, while by increasing annealing temperature, they become distinguishable. By increasing temperature to 600°C, ZnO and CZO, CAZO and aluminum-doped zinc oxide (AZO) films particles became almost spherical. Due to high content of Cu in CZO target, and of Al in AZO target which was 5% weight ratio, doping plays a great role in the subject. Therefore, the annealing processing strongly affect the size and the shape of nanoparticles.\u0000\u0000\u0000Design/methodology/approach\u0000In this paper, the authors tried to study, in detail, nobel optical characterizations of ZnO films doped by transition metals in different annealing temperature. The authors found that the values of skin depth, optical density, electron–phonon interaction, steepness parameter, band tail width, direct and indirect carriers transitions and the dissipation factor, free carriers density and roughness of films affect the optical properties, especially the optical absorptions of ZnO films doped by transition metals. Also these properties were affected by annealing temperatures. The authors also found that topography characterizations strongly were affected by these parameters.\u0000\u0000\u0000Findings\u0000The CZO films have maximum value of coordination number ß, with considering NC = 4, Za = 2, Ne = 8. The CZO films annealed at 500 °C have maximum value of optical density. The as-deposited CAZO films have maximum value of steepness parameters in about of 0.13 eV. The as-deposited AZO films have maximum value of dispersion energy Ed in about of 5.75 eV. Optical gap and disordering energy plots of films can be fitted by linear relationships Eg = 0.49 + 0.2 EU and Eg = 0.52 + 0.5 EU, respectively.\u0000\u0000\u0000Originality/value\u0000With considering Nc = 4, Za = 2, Ne = 8 for ZnO films, coordination number ß has maximum value of 0.198. CZO nanocomposites films annealed at 500°C have maximum value of optical density. Different linear fitting of ln (α) for films were obtained as y = Ax + B where 5<A < 17 and 5<B < 12. As-deposited CAZO nanocomposites films have minimum value of electron phonon interaction in about of 4.91 eV. Optical gap and disordering energy plots can be fitted by linear relationships Eg = 0.49 + 0.2 EU and Eg = 0.52 + 0.5 EU for as-deposited films and films annealed at 500°C, respectively. Steepness parameters of as-deposited CAZO nanocomposites films have maximum value of 0.13 eV. Dispersion energy Ed for as-deposited AZO nanocomposites films has maximum value of 5.75 eV.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering &amp; Surface Mount Technology","volume":"157 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122861793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents","authors":"Mohammad A. Gharaibeh, F. Al-Oqla","doi":"10.1108/ssmt-07-2023-0036","DOIUrl":"https://doi.org/10.1108/ssmt-07-2023-0036","url":null,"abstract":"\u0000Purpose\u0000There are several lead-free solder alloys available in the industry. Over the years, the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly used and accepted for joining the electronic components. It is strongly believed that the silver (Ag) content has a significant impact on the solder mechanical behavior and thus solder thermal reliability performance. This paper aims to assess the mechanical response, i.e. creep response, of the SAC solder alloys with various Ag contents.\u0000\u0000\u0000Design/methodology/approach\u0000A three-dimensional nonlinear finite element simulation is used to investigate the thermal cyclic behavior of several SAC solder alloys with various silver percentages, including 1%, 2%, 3% and 4%. The mechanical properties of the unleaded interconnects with various Ag amounts are collected from reliable literature resources and used in the analysis accordingly. Furthermore, the solder creep behavior is examined using the two famous creep laws, namely, Garofalo’s and Anand’s models.\u0000\u0000\u0000Findings\u0000The nonlinear computational analysis results showed that the silver content has a great influence on the solder behavior as well as on thermal fatigue life expectancy. Specifically, solders with relatively high Ag content are expected to have lower plastic deformations and strains and thus better fatigue performance due to their higher strengths and failure resistance characteristics. However, such solders would have contrary fatigue performance in drop and shock environments and the low-Ag content solders are presumed to perform significantly better because of their higher ductility.\u0000\u0000\u0000Originality/value\u0000Generally, this research recommends the use of SAC solder interconnects of high silver contents, e.g. 3% and 4%, for designing electronic assemblies continuously exposed to thermal loadings and solders with relatively low Ag-content, i.e. 1% and 2%, for electronic packages under impact and shock loadings.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering &amp; Surface Mount Technology","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122313738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process","authors":"Z. Bachok, A. Abas, Hehgeraj A/L Raja Gobal, N. Yusoff, Mohamad Riduwan Ramli, Mohamad Fikri Mohd Sharif, F. Che Ani, Muhamed Abdul Fatah Muhamed Mukhtar","doi":"10.1108/ssmt-01-2023-0001","DOIUrl":"https://doi.org/10.1108/ssmt-01-2023-0001","url":null,"abstract":"\u0000Purpose\u0000This study aims to investigate crack propagation in a moisture-preconditioned soft-termination multi-layer ceramic capacitor (MLCC) during thermal reflow process.\u0000\u0000\u0000Design/methodology/approach\u0000Experimental and extended finite element method (X-FEM) numerical analyses were used to analyse the soft-termination MLCC during thermal reflow. A cross-sectional field emission scanning electron microscope image of an actual MLCC’s crack was used to validate the accuracy of the simulation results generated in the study.\u0000\u0000\u0000Findings\u0000At 270°C, micro-voids between the copper-electrode and copper-epoxy layers absorbed 284.2 mm/mg3 of moisture, which generated 6.29 MPa of vapour pressure and caused a crack to propagate. Moisture that rapidly vaporises during reflow can cause stresses that exceed the adhesive/substrate interface’s adhesion strength of 6 MPa. Higher vapour pressure reduces crack development resistance. Thus, the maximum crack propagation between the copper-electrode and copper-epoxy layers at high reflow temperature was 0.077 mm. The numerical model was well-validated, as the maximum crack propagation discrepancy was 2.6%.\u0000\u0000\u0000Practical implications\u0000This research holds significant implications for the industry by providing valuable insights into the moisture-induced crack propagation mechanisms in soft-termination MLCCs during the reflow process. The findings can be used to optimise the design, manufacturing and assembly processes, ultimately leading to enhanced product quality, improved performance and increased reliability in various electronic applications. Moreover, while the study focused on a specific type of soft-termination MLCC in the reflow process, the methodologies and principles used in this research can be extended to other types of MLCC packages. The fundamental understanding gained from this study can be extrapolated to similar structures, enabling manufacturers to implement effective strategies for crack reduction across a wider range of MLCC applications.\u0000\u0000\u0000Originality/value\u0000The moisture-induced crack propagation in the soft-termination MLCC during thermal reflow process has not been reported to date. X-FEM numerical analysis on crack propagation have never been researched on the soft-termination MLCC.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering &amp; Surface Mount Technology","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128828319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Data-driven electronic packaging structure inverse design with an adaptive surrogate model","authors":"S. Liu, Song Xue, Peiyuan Lian, Jianlun Huang, Zhihai Wang, Lihao Ping, Congsi Wang","doi":"10.1108/ssmt-04-2023-0020","DOIUrl":"https://doi.org/10.1108/ssmt-04-2023-0020","url":null,"abstract":"\u0000Purpose\u0000The conventional design method relies on a priori knowledge, which limits the rapid and efficient development of electronic packaging structures. The purpose of this study is to propose a hybrid method of data-driven inverse design, which couples adaptive surrogate model technology with optimization algorithm to to enable an efficient and accurate inverse design of electronic packaging structures.\u0000\u0000\u0000Design/methodology/approach\u0000The multisurrogate accumulative local error-based ensemble forward prediction model is proposed to predict the performance properties of the packaging structure. As the forward prediction model is adaptive, it can identify respond to sensitive regions of design space and sample more design points in those regions, getting the trade-off between accuracy and computation resources. In addition, the forward prediction model uses the average ensemble method to mitigate the accuracy degradation caused by poor individual surrogate performance. The Particle Swarm Optimization algorithm is then coupled with the forward prediction model for the inverse design of the electronic packaging structure.\u0000\u0000\u0000Findings\u0000Benchmark testing demonstrated the superior approximate performance of the proposed ensemble model. Two engineering cases have shown that using the proposed method for inverse design has significant computational savings while ensuring design accuracy. In addition, the proposed method is capable of outputting multiple structure parameters according to the expected performance and can design the packaging structure based on its extreme performance.\u0000\u0000\u0000Originality/value\u0000Because of its data-driven nature, the inverse design method proposed also has potential applications in other scientific fields related to optimization and inverse design.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering &amp; Surface Mount Technology","volume":"204 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114743299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Interfacial behavior and mechanism of brazed diamond with CeO2-added Ni-Cr filler alloy: a combined first-principles and experimental study","authors":"Ao Zhang, Jian Zhang, Mingjun Zhang, Junyi Liu, Ping Peng","doi":"10.1108/ssmt-03-2023-0016","DOIUrl":"https://doi.org/10.1108/ssmt-03-2023-0016","url":null,"abstract":"\u0000Purpose\u0000This paper aims to investigate the effect and mechanism of O atom single doping, Ce and O atoms co-doping on the interfacial microscopic behavior of brazed Ni-Cr/diamond.\u0000\u0000\u0000Design/methodology/approach\u0000Using first-principles calculations, the embedding energy, work of separation, interfacial energy and electronic structures of Ni-Cr-O/diamond and Ni-Cr-O-Ce/diamond interface models were calculated. Then, the effect of Ce and O co-doping was experimentally verified through brazed diamond with CeO2-added Ni-Cr filler alloy.\u0000\u0000\u0000Findings\u0000The results show that O single-doping reduces the interfacial bonding strength between Ni-Cr filler alloy and diamond but enhances its interfacial stability to some extent. However, the Ce and O co-doping simultaneously enhances the interfacial bonding strength and stability between Ni-Cr filler alloy and diamond. The in-situ formed Ce-O oxide at interface impedes the direct contact between diamond and Ni-Cr filler alloy, which weakens the catalytic effect of Ni element on diamond graphitization. It is experimentally found that the fine rod-shaped Cr3C2 and Cr7C3 carbides are generated on diamond surface brazed with CeO2-added Ni-Cr filler alloy. After grinding, the brazed diamond grits, brazed with CeO2-added Ni-Cr filler alloy, present few fracture and the percentage of intact diamond reaches 67.8%. Compared to pure Ni-Cr filler alloy, the brazed diamond with CeO2-added Ni-Cr filler alloy exhibit the better wear resistance and the slighter thermal damage.\u0000\u0000\u0000Originality/value\u0000Using first-principles calculations, the effect of Ce and O atoms co-doping on the brazed diamond with Ni-Cr filler alloy is investigated, and the calculation results are verified experimentally. Through the first-principles calculations, the interface behavior and reaction mechanism between diamond and filler alloy can be well disclosed, and the composition of filler alloy can be optimized, which will be beneficial for synergistically realizing the enhanced interface bonding and reduced thermal damage of brazed diamond.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering &amp; Surface Mount Technology","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123497974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Wetting kinetics, spreading phenomena and interfacial reaction of Sn-15Bi-xZn solders on Cu substrate at different temperatures","authors":"Weijane Lin, Xuewen Li, B. Tu, Chaohua Zhang, Yulong Li","doi":"10.1108/ssmt-01-2023-0002","DOIUrl":"https://doi.org/10.1108/ssmt-01-2023-0002","url":null,"abstract":"\u0000Purpose\u0000This study aims to analyze the wettability of the self-developed Sn–Bi–Zn solder and to conduct a series of analysis on the wetting kinetics, diffusion phenomenon and interfacial reaction of Sn–Bi–Zn solder on Cu substrate.\u0000\u0000\u0000Design/methodology/approach\u0000The wetting kinetics, diffusion phenomenon and interfacial reaction of Sn–Bi–Zn solder on Cu substrate were analyzed by experiments. The interface was observed by scanning electron microscope to study the effect of Zn content on its interface.\u0000\u0000\u0000Findings\u0000With the increase in brazing temperature, the final spreading equivalent radius of the solder increases significantly, and the final contact angle of the solder decreases significantly. In addition, when the Zn content is 1%, the spreading effect of solder is the best, the equivalent radius is the largest and the contact angle is the smallest. According to the microstructural analysis, the thick intermetallic compounds layer of the Sn–15Bi–xZn solders on the Cu substrate can be effectively decreased by adding appropriate Zn content.\u0000\u0000\u0000Originality/value\u0000The wetting kinetics, diffusion phenomenon and interfacial reaction of Sn–15Bi–xZn solder on Cu substrate at different temperatures have not been studied yet.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering &amp; Surface Mount Technology","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121576812","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reflow profiling with the aid of machine learning models","authors":"Yangyang Lai, Seungbae Park","doi":"10.1108/ssmt-03-2023-0013","DOIUrl":"https://doi.org/10.1108/ssmt-03-2023-0013","url":null,"abstract":"Purpose This paper aims to propose a method to quickly set the heating zone temperatures and conveyor speed of the reflow oven. This novel approach intensely eases the trial and error in reflow profiling and is especially helpful when reflowing thick printed circuit boards (PCBs) with bulky components. Machine learning (ML) models can reduce the time required for profiling from at least half a day of trial and error to just 1 h. Design/methodology/approach A highly compact computational fluid dynamics (CFD) model was used to simulate the reflow process, exhibiting an error rate of less than 1.5%. Validated models were used to generate data for training regression models. By leveraging a set of experiment results, the unknown input factors (i.e. the heat capacities of the bulkiest component and PCB) can be determined inversely. The trained Gaussian process regression models are then used to perform virtual reflow optimization while allowing a 4°C tolerance for peak temperatures. Upon ensuring that the profiles are inside the safe zone, the corresponding reflow recipes can be implemented to set up the reflow oven. Findings ML algorithms can be used to interpolate sparse data and provide speedy responses to simulate the reflow profile. This proposed approach can effectively address optimization problems involving multiple factors. Practical implications The methodology used in this study can considerably reduce labor costs and time consumption associated with reflow profiling, which presently relies heavily on individual experience and skill. With the user interface and regression models used in this approach, reflow profiles can be swiftly simulated, facilitating iterative experiments and numerical modeling with great effectiveness. Smart reflow profiling has the potential to enhance quality control and increase throughput. Originality/value In this study, the employment of the ultimate compact CFD model eliminates the constraint of components’ configuration, as effective heat capacities are able to determine the temperature profiles of the component and PCB. The temperature profiles generated by the regression models are time-sequenced and in the same format as the CFD results. This approach considerably reduces the cost associated with training data, which is often a major challenge in the development of ML models.","PeriodicalId":382949,"journal":{"name":"Soldering &amp; Surface Mount Technology","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132089554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Hot tear cracks on the suppression of Sn–Bi alloy for low-temperature assembly","authors":"Songtao Qu, Q. Shi","doi":"10.1108/ssmt-01-2023-0003","DOIUrl":"https://doi.org/10.1108/ssmt-01-2023-0003","url":null,"abstract":"\u0000Purpose\u0000In the electronic assembly industry, low-temperature soldering holds great potential to be used in surface mounting technology. Tin–bismuth (Sn–Bi) eutectic alloys are lead-free solders applied in consumer electronics because of their low melting point, high strength and low cost. This paper aims to investigate how to address the problem of hot tear crack formation during Sn–Bi low-temperature solder (LTS) in the mass production of consumer electronics.\u0000\u0000\u0000Design/methodology/approach\u0000This paper explored the development of hot tear cracks during Sn–Bi soldering in the fabrication of flip chip ball grid arrays. Experiments were designed to simulate various conditions encountered in Sn–Bi soldering. Quantitative analysis was conducted on the number of hot tear cracks observed in different alloy compositions and solder volumes to explore the primary cause of hot tear cracks and possible methods to suppress crack formation.\u0000\u0000\u0000Findings\u0000Hot tear cracks existed in Sn–Bi solders with different bismuth (Bi) contents, but increasing the solder volume reduced the number of hot tear cracks. Experiments were designed to test the degree of chip transient thermal warpage with temperature change, and, according to the results, glue was dispensed in specific areas to reduce chip warpage deformation. Finally, the results of combined process experiments pointed to an effective method of low-temperature soldering to suppress hot tear cracks.\u0000\u0000\u0000Research limitations/implications\u0000The study focuses on Sn–Bi solders only without other solder pastes such as SAC305 or Sn–Zn series.\u0000\u0000\u0000Practical implications\u0000With the growing popularity of smart electronics, especially in intelligent terminals, new energy vehicles electronics, solar photovoltaic and other field, there will be more and more demand for low- temperature, energy-saving, lead-free solders. Therefore, this study will help the industry to roll out LTS (Sn–Bi) solutions rapidly.\u0000\u0000\u0000Social implications\u0000In the long term, lean and green manufacturing is expected to be essential for maintaining an advanced manufacturing industry across the world. Developing new LTSs and soldering processes is the most effective, direct solution for energy conservation and emission mitigation. With the growing popularity of smart electronics, especially in intelligent terminals, new energy vehicles and solar photovoltaics, there would be an increased demand for low-temperature, energy-saving, lead-free techniques.\u0000\u0000\u0000Originality/value\u0000Although there are many methods that can be used to suppress hot tear cracks, there is little research on how to control the hot tear cracks caused by the low-temperature soldering of Sn–Bi in laptop applications. The authors studied the hot tear cracks that developed during the world’s first mass production of 50 million personal laptops based on low-temperature Sn–Bi alloy solder pastes. By controlling the Bi content, redesigning the solder paste printing process (e.g. through a printer’s stencil) and","PeriodicalId":382949,"journal":{"name":"Soldering &amp; Surface Mount Technology","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123143763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}