Soldering & Surface Mount Technology最新文献

{"title":"Investigation of ultrasound-assisted soldering of SiC ceramics by using Zn-Al-In solder for high-temperature applications","authors":"Igor Kostolný, R. Koleňák, P. Babincová, M. Kusý","doi":"10.1108/ssmt-02-2022-0012","DOIUrl":"https://doi.org/10.1108/ssmt-02-2022-0012","url":null,"abstract":"\u0000Purpose\u0000This study aims to investigate soldering of SiC ceramics by using Zn-Al-In-based solders and ultrasonic soldering. The focus was on the quality of soldered joints, examining the boundary of the solder/substrate joint and the strength of the fabricated joints. Moreover, the fractured surfaces of joints were assessed.\u0000\u0000\u0000Design/methodology/approach\u0000The Zn-5Al base, which is considered for eutectic solder, was used in experiments. When manufacturing this solder, In was also added to at 1 Wt.%. The soldering of SiC substrates on a hot plate with ultrasonic assistance was performed.\u0000\u0000\u0000Findings\u0000The solder at room temperature consists of a primary segregated solid solution (Zn) and the binary eutectics (Zn) + (Al) with a high Al content and binary lamellar eutectic with a high Zn and In content non-uniformly distributed on the grain boundaries. The average tensile strength of the Zn5Al1In solder was 52 MPa. The ceramic material was wetted during soldering via reaction between the solder and the SiC substrate, with the formation of Al-Si reaction products. The thickness of the reaction layer on the boundary was 0.5–1.1 µm. The average strength of the soldered joint was 59 MPa. The obtained results confirmed the high efficiency of ultrasonic soldering in air.\u0000\u0000\u0000Originality/value\u0000This work has characterised Zn5Al1In soldering alloy and examining soldering SiC ceramics by a flux-less ultrasonic process. The analyses were oriented to assess the strength and structure of the solder and the soldered joints. Based on the achieved results, it is possible to predict the suitability of the solder alloy for flux-free soldering of SiC ceramics.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132997601","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of TiO2 nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy","authors":"H. Alsorory, Mohammed S. Gumaan, R. Shalaby","doi":"10.1108/ssmt-01-2022-0003","DOIUrl":"https://doi.org/10.1108/ssmt-01-2022-0003","url":null,"abstract":"\u0000Purpose\u0000This study aims to investigate the effect of a small amount of TiO2 NPs addition on the microstructure, thermal, mechanical and electrical properties of environmentally friendly eutectic (SAC355)100-x(TiO2)x (x = 0.1, 0.3, 0.5, 0.7 and 1 wt.%) solder alloys.\u0000\u0000\u0000Design/methodology/approach\u0000Mechanical, thermal and electrical properties and microstructure conditions are taken into major consideration in any study of materials containing nanoparticles. Dynamic resonance technique, X-ray diffraction and scanning electron microscopy were carried out to study stiffness, identification of the phases and the morphology features of the solder. Structure and microstructure analysis indicated that the presence of rhombohedral β–Sn phase in addition to orthorhombic intermetallic compound (IMC) Ag3Sn and Cu3Sn phase dispersed in Sn matrix. In addition, the results showed that TiO2 NPs addition at a small trace amount into SAC355 system reduces and improves the particle size of both rhombohedral β–Sn and orthorhombic IMC Ag3Sn and Cu3Sn. The interstitial dispersion of TiO2 NPs at grain boundaries resulted in Ag3Sn being more uniform needle-like, which is distributed in the β–Sn matrix. The fine and uniform microstructure leads to improvement of mechanical strength.\u0000\u0000\u0000Findings\u0000Some important conclusions are summarized as follows: microstructure investigations revealed that the addition of TiO2 NPs particles to eutectic SAC355 inhibited in reducing and refines the crystallite size as well as the Ag3Sn IMC, which reinforced the strength of plain solder alloy. The mechanical properties values such as Young’s modulus and Vickers microhardness of SAC355 solder alloy can be significantly improved by adding a trace amount of TiO2 NPs compared with plain solder because of the existence of appropriate volume fraction of Ag3Sn IMC. The results show that the best creep resistance is obtained when the addition of 0.3 wt.% of TiO2 NPs is compared to plain solder. TiO2 NPs addition could increase the melting temperature, compared with plain solder. All results showed that TiO2 NPs addition is an effective method to enhance new solder joints.\u0000\u0000\u0000Practical implications\u0000New solder alloys.\u0000\u0000\u0000Originality/value\u0000Development of TiO2 NPs-doped eutectic SAC355 lead-free solder for electronic packaging.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126151196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints","authors":"Mengkuo Xu, F. Sun, Zhenya Pan, Yang Liu","doi":"10.1108/ssmt-07-2021-0044","DOIUrl":"https://doi.org/10.1108/ssmt-07-2021-0044","url":null,"abstract":"\u0000Purpose\u0000The purpose of this paper is to study the temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints compared with Sn-5Sb/Cu and SAC305/Cu micro solder joints, which has important engineering and theoretical significance for the research of micro solder joint reliability. This paper also aims to provide guidance for the selection of solder for third-generation semiconductor power device packaging.\u0000\u0000\u0000Design/methodology/approach\u0000The shear strength, plasticity, bulk solder hardness and creep performance of three kinds of micro solder joints before and after temperature cycling were studied by nanoindentation and micro shear experiments. Scanning electron microscopy and energy dispersive spectrometry were used to analyze the fracture mode, fracture position and compound composition of the solder joints.\u0000\u0000\u0000Findings\u0000The bulk solder hardnesses and shear strengths of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu solder joints were higher than those of Sn-5Sb/Cu and SAC305/Cu solder joints before and after temperature cycling. The indentation depth, creep displacement and creep rate of bulk solders of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu solder joints were the smallest compared with those of Sn-5Sb/Cu and SAC305/Cu solder joints after the same number of cycles. In addition, the fracture mode and fracture position of the micro solder joints changed before and after temperature cycling.\u0000\u0000\u0000Originality/value\u0000A new type of solder was developed with excellent temperature cycling performance.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133930844","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review","authors":"Lina Syazwana Kamaruzzaman, Yingxin Goh","doi":"10.1108/ssmt-06-2021-0035","DOIUrl":"https://doi.org/10.1108/ssmt-06-2021-0035","url":null,"abstract":"\u0000Purpose\u0000This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys.\u0000\u0000\u0000Design/methodology/approach\u0000A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder.\u0000\u0000\u0000Findings\u0000The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties.\u0000\u0000\u0000Originality/value\u0000This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129449479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging","authors":"B. Han, F. Sun, Chi Zhang, Xinlei Wang","doi":"10.1108/ssmt-09-2021-0061","DOIUrl":"https://doi.org/10.1108/ssmt-09-2021-0061","url":null,"abstract":"\u0000Purpose\u0000This paper aims to investigate the effect of the Cu, Ni and Ag addition in Sn5Sb-based alloy on the mechanical properties and its mechanism.\u0000\u0000\u0000Design/methodology/approach\u0000The micro-indentation, creeping test of the Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Cu/Sn–5Sb/Cu were conducted, and its microstructure was analysed. The scanning electron microscope and the metallographic microscope characterized the microstructure of the Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu and Sn–5Sb/Cu joints.\u0000\u0000\u0000Findings\u0000The microstructure of Cu/Sn5Sb–0.5Cu–0.1Ni–0.5Ag/Cu is distributed with the fine (Cu,Ni)6Sn5 and Ag3Sn intermetallic compounds (IMCs), whereas the Cu6Sn5 and Sn3Sb2 in Cu/Sn–5Sb/Cu is larger and far more less. This investigation reveals that the addition of the Cu, Ni and Ag elements reinforced mechanical properties and provided a technical basis for the development of Sn–Sb alloy with good mechanical properties.\u0000\u0000\u0000Originality/value\u0000This paper reveals that the hardness and the modulus of the bulk solder Cu/Sn–5Sb/Cu solder joints were improved with the addition of Cu, Ni and Ag trace elements. Meanwhile, the creep resistance and plasticity were also improved. This study has a great value for exploring high-performance Sn–Sb based solder alloy and has proved an example.\u0000","PeriodicalId":382949,"journal":{"name":"Soldering & Surface Mount Technology","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126710842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}